PCB ukwenza i-cloning, okulingana nebhodi lekhophi le-PCB, ibhodi yekhophi le-PCB kungenye indlela yokuthi, isivele isezingeni lemikhiqizo ye-elekthronikhi nebhodi lesifunda, ukusetshenziswa kobuchwepheshe obucwaningayo nobuchwepheshe bokuthuthuka kusho ukuhlaziywa kwebhodi lesifunda, Imikhiqizo yasekuqaleni yefayela le-PCB nohlu lwezinto ezibonakalayo (i-BOM), imibhalo ehlelekile efana nemibhalo yezobuchwepheshe nefayela le-PCB lokukhiqizwa kokuphrinta kwesikrini 1: 1 ukunciphisa, bese uphinde usebenzise lawa mafayili obuchwepheshe kanye nokukhiqizwa kohlelo lwebhodi le-PCB, izingxenye zokushisela, ukuhlolwa kwe-flying probe , ukulungisa iphutha lesifunda, imodeli ephelele ikhophi ephelele yesifunda sokuqala.

Ukukopisha kwe-PCB kubhekisa kuphela kwinqubo yokukhipha nokubuyisela amafayela e-PCB wamabhodi wesekethe kagesi kanye nokwenza amabhodi wesekethe ngokusebenzisa amafayela. Ikhophi lebhodi alihlanganisi nje kuphela ubuchwepheshe obujwayelekile be-PCB obufana nesizinda, i-PCB cloning, inqubo ye-PCB, kepha futhi nokuguqula ushintsho lwefayela le-PCB (ibhodi le-PCB), imikhiqizo ye-elekthronikhi yazo zonke izinhlobo zezinto ze-elekthronikhi kumabhodi wesifunda aphrintiwe ulwazi nokuhlungwa, ama-chip abethelwe ebhodini lesifunda noma kubo bonke ubuchwepheshe obufana nenqubo yokuchithwa kwe-chip eyodwa.

Inqubo yokukopisha ye-PCB:

Inqubo yokuqalwa kobuchwepheshe bebhodi ye-PCB ngamagama alula, ukuqala ukuskena amakhodi wesifunda amabhodi, ukurekhoda imininingwane yezingxenye, nezinto ezisusiwe ukwenza uhlu lwezinto (BOM) bese uhlela ukuthengwa kwezinto, isithombe sepuleti esingenalutho siskeniwe kwisoftware sicubungula emuva kufayela le-PCB copy board figure, bese uthumela ifayili le-PCB kupuleti elenza ifektri, Ngemuva kokuthi ibhodi lenziwe, izingxenye ezithengiwe zizofakwa ebhodini le-PCB elenziwe, bese kuthi ngokuhlolwa kwe-PCB nokulungisa iphutha.

PCB indlela yokukopisha ibhodi:

Isinyathelo sokuqala: thola i-PCB, okokuqala ephepheni ukurekhoda zonke izingxenye zemodeli, amapharamitha, kanye nokuma, ikakhulukazi i-diode, isiqondisi samapayipi amathathu, isiqondisi se-IC notch. Kungcono ukuthatha izithombe ezimbili zesimo se-ski ngekhamera yedijithali. Manje ibhodi lesifunda liya ngokuthuthuka ngaphezulu kwe-diode triode ezinye azinaki ukuthi nje azikwazi ukubona.

Isinyathelo 2: Ukususwa kwebhodi: Susa zonke izinto bese ususa ithini emgodini we-PAD. Hlanza i-PCB ngophuzo oludakayo noma ngamanzi ebhodi yokuwasha, bese uyifaka kuskena (iphrinta esebenza ngokuningiliziwe ngomsebenzi wokuskena), vula isoftware yokuskena ye-Win 10, setha ifomethi nokuskena (i-1200DPI inconyiwe, setha ifomethi yokuskena isithombe kuya kwifomethi ye-BMP), futhi uqinisekise isithombe esicacile. Shanela eceleni kwesikrini sikasilika, gcina ifayela bese uliphrinta ukuze ulisebenzise kamuva.

Isinyathelo 3: Yenza i-BOM: ngokwesithombe sebhodi lesifunda esinyathelweni 1, qopha imodeli, ipharamitha kanye nokuma kwazo zonke izingxenye ephepheni, ikakhulukazi ukuqondiswa kwe-diode, ithubhu yenjini emithathu ne-IC notch, futhi ekugcineni wenze i-BOM.

Isinyathelo 4: Ukugaya ipuleti: Pholisha uyinki we-TOP LAYER ne-BOTTOM LAYER ngephepha lentambo kuze kukhanye ifilimu yethusi, bese uyifaka kuskena bese uqhubeka nokuskena izithombe ezinhle nezimbi (qaphela ukuthi I-PCB kumele ibekwe ngokuvundlile futhi iqonde kuskena, kungenjalo isithombe esiskeniwe sizotshekiswa, futhi kuzoba nzima ukulungisa isithombe ngokuhamba kwesikhathi) bese ugcine ifayela.

Isinyathelo 5: Hlela: Gijimisa i-PHOTOSHO ukuvula isithombe esiskeniwe, ulungise ukungafani nomthunzi wendwangu, ukuze ingxenye enefilimu yethusi nengxenye ngaphandle kokuqhathaniswa kwefilimu yethusi ngokuqinile, hlola ukuthi ngabe imigqa icacile, uma kungenjalo, ukuphinda lokhu isinyathelo. Uma kucacile, isithombe sigcinwa njengamafomethi wefomethi yombala we-BMP top.bmp no-bot.bmp. Uma kunenkinga ngesithombe, singalungiswa futhi silungiswe nge-PHOTOSHOP.

Isinyathelo 6: Ukulinganiswa kwesithombe: Qala isoftware yokukopisha ye-PCB i-QuickPcb2005 bese ungenisa izithombe ze-PCB eziskeniwe kumenyu yefayela. Isibonelo, izikhundla ze-PAD ne-VIA ngokusebenzisa izingqimba ezimbili ngokuyisisekelo ziyafana, okukhombisa ukuthi izinyathelo zangaphambili zenziwe kahle. Uma kukhona ukuphambuka, phinda isinyathelo 5.

Isinyathelo 7: ukukhiqizwa kokupakisha kanye nomugqa wokudweba: ngenisa isithombe se-BMP sesendlalelo se-TOP kusoftware ye-QuickPcb2005, ngokulandelana kusendlalelo esihambelanayo, bese ufaka idivaysi, ngokulandelana ibonisa ungqimba lwe-TOP no-BOTTOM ungqimba womugqa.

Isinyathelo 8: Thumela ifayela le-PCB: Ngemuva kokuthi umdwebo omningi wenziwe kusoftware ye-QuickPC 2005, thumela ifayela bese uligcina njengefayela le-. Ifomethi ye-PCB.

Isinyathelo 9: Ifayela emva kokulungiswa nokwenza kahle: Ngenisa okuthekelisiwe. Ifomethi yefomethi ye-PCB kusoftware ye-EDA yokwenza ngcono. Kunconywa ukusebenzisa i-Alitum Desiger 19 ukwengeza ifayili nokuhlola i-DRC, bese ukhipha ifayili le-GENERATED PCB.