PCB Uphuhliso lweinki

Ukuze kuphuculwe ukusebenza kakuhle kwe-welding kwaye kuthintelwe ukonakala kwiindawo ezingadingi kudityaniswa ngethuba lokuveliswa kwe-PCB, ezi ndawo kufuneka zikhuselwe nge-inki ebhloka. Ukuphuhliswa kwe-inki ye-PCB inxulumene ngokusondeleyo nobuchwepheshe bezixhobo, iimeko zokuwelda kunye neemfuno zomgca. Ngoxinaniso olungaphezulu lwePCB kunye nenkangeleko yeteknoloji yokuwelda engenalothe, iimfuno ezintsha zibekwe phambili ukuze diluent ukunyenyisa i-inki viscosity kwaye iyenze ihlangabezane neemfuno ze-inki yejethi yoshicilelo oluncangathi lwe-inki ye-solder. I-inki ye-solder ye-PCB inezigaba ezine zophuhliso, ukusuka kuhlobo lwefilimu eyomileyo yokuqala kunye nohlobo lwe-thermosetting ngokuthe ngcembe luphuhliswe kwi-ULTRAVIOLET (UV) uhlobo lokulungiswa kokukhanya, kwaye emva koko kwavela i-inki yokuphuhlisa i-solder.

1. I-viscosity ephantsi ingaba yi-inki-jet welding inki

Ngophuhliso lwamashishini e-elektroniki, itekhnoloji eshicilelweyo epheleleyo ye-elektroniki enendlela yokongeza iyavela ngomzuzu olungileyo. Inkqubo yendlela yokudibanisa ineenzuzo zokugcinwa kwezinto, ukhuseleko lokusingqongileyo, inkqubo eyenziwe lula, njl. Ngenxa yokusetyenziswa koshicilelo lwe-inkjet njengeyona ndlela ingundoqo yobugcisa, kukho iimfuno ezintsha kwiipropati ze-inki kunye nezixhobo zomzimba, ezibonakaliswa ngokuyintloko njenge:

(1) lawula i-viscosity ye-inki, ukuqinisekisa ukuba inokutshizwa ngokuqhubekayo ngombhobho, ukuthintela ukuhlangana kweplagi.

(2) lawula isantya sokuphendula ukunyanga, ukuphumeza okuqinileyo kokuqala, ukuthintela inki kwi-substrate ngenxa yokungena kunye nokusasazeka;

(3) Lungisa i-inki thixotropy ukuqinisekisa umgangatho kunye nokuphindaphinda komgca wokushicilela. Kuphuhliso lwe-inki ye-solder ye-viscosity ephantsi, usetyenziso oluphambili lwezinto zokuguqula izinto ze-solder, zongezwa ngeemfuno zesidanga esisebenzayo okanye esingasebenziyo.

2. FPC welding inki

Ngophuhliso loshishino lwePCB, imfuno yeFPC ikhula ngokukhawuleza, kwaye iimfuno ezintsha zibekwe phambili kwizinto ezihambelanayo. Ngenxa yokuba ucingo lobhedu kwi-flexo plate lulula ukwenza i-oxidize, i-welding resistance material ye-flexo copper wire ibe yindawo yophando. Ifilimu yendabuko yokumelana ne-epoxy ibonisa i-brittleness ephezulu emva kokunyanga kwaye ayifanelekanga kwi-flexography. Ngoko ke, isitshixo sokusombulula ingxaki kukwazisa icandelo lekhonkco eliguquguqukayo kwisakhiwo se-resin yendabuko kunye nokugcina ukusebenza kwe-welding ye-original. I-inki inozinzo oluhle lokugcina, inokunyibilika kakuhle kwisisombululo se-sodium carbonate, isisombululo se-ammonia, ukunyanga ifilimu ye-mechanics, i-thermal, i-asidi kunye ne-alkali corrosion properties ihlangabezana neemfuno ezifanelekileyo.

3. Uphuhliso lwealkali olunyibilikayo lwamanzi lwe-inki yokufota

Ukuze kuncitshiswe ukukhutshwa kwezinyibilikisi organic kwinkqubo yokuvelisa PCB kunye nokunciphisa impembelelo izinyibilikisi kokusingqongileyo, solder blocking inki iye ngokuthe ngcembe iphuhliswe ukusuka kwinkqubo yophuhliso organic isinyibilikisi ukungxenga uphuhliso lwamanzi alkaline, kwaye kwiminyaka yakutshanje, iye yaphuhliswa amanzi. itekhnoloji yophuhliso. Kwangaxeshanye, ukuze kuhlangatyezwane neemfuno zetekhnoloji ye-lead-free welding yefilimu yokumelana, phucula ukuchasana nokusebenza kobushushu obuphezulu.

4. I-LED ene-inki yokubonisa i-solder emhlophe ephezulu

I-TaiyoInk yaqala ukubonisa i-inki evaliweyo ye-solder emhlophe yokupakishwa kwe-LED kwi-2007. Xa kuthelekiswa ne-inki ye-solder yemveli, i-inki ye-solder emhlophe idinga ukusombulula iingxaki zokutshintsha kwebala kunye nokuguga okukhawulezileyo okubangelwa kukuvezwa kwexesha elide kumthombo wokukhanya. I-inki ye-epoxy solder yesiko ngenxa yesakhiwo semolekyuli equlethe i-benzene ring, ukukhanya kwexesha elide kulula ukubangela ukujika kwemibala. Kumthombo wokukhanya we-LED, i-solder ukumelana ne-solder igqunywe ngaphantsi kwezinto ezikhanyayo, ngoko ke kuyimfuneko ukuphucula ukukhanya okubonakalayo kwe-solder resistance coating ekukhanyeni, emva koko kuphuculwe ukukhanya komthombo wokukhanya. Oku kuzisa umceli mngeni omtsha kuphando lwezixhobo zokumelana ne-welding.

isiphelo

Uphando lwe-inki ye-solder luhlala lunzima kwishishini le-PCB. Ngesekethe yoshicilelo ukusuka kwindlela yokuthabatha ngokuthe ngcembe ukuya kwindlela yokongeza, ushicilelo lwe-inkjet njengeyona ndlela iphambili yobugcisa bokudibanisa inkqubo, i-viscosity ye-inki ye-solder, i-thixotropy kunye ne-reactivity ibeka phambili iimfuno eziphezulu; Ukuthandwa kobuchwephesha bokuwelda bubeke phambili iimfuno ezintsha zokumelana nobushushu obuphezulu befilimu ye-solder, ukuphuhliswa kwe-solder flux entsha kufuna ngokukhawuleza inani elikhulu labaphandi, kunye nophando lwe-inki ye-solder ekunyukeni, enomdla omkhulu. ezinokubakho.