PCB ukuthuthukiswa koyinki we-solder

Ukuze uthuthukise ukusebenza kahle kwe-welding futhi ugweme ukulimala ezingxenyeni ezingadingi ukushiselwa ngesikhathi sokukhiqizwa kwe-PCB, lezi zingxenye zidinga ukuvikelwa ngoyinki wokuvinjwa. Ukuthuthukiswa kukayinki we-PCB kuhlobene eduze nobuchwepheshe bemishini, izimo zokushisela kanye nezidingo zomugqa. Nge-PCB eyengeziwe enobukhulu obuphezulu kanye nokubukeka kobuchwepheshe bokushisela obungenamthofu, izidingo ezintsha zibekwa phambili ukuze i-diluent ilungise i-viscosity ye-inki futhi iyenze ihlangabezane nezidingo ze-ink jet yokuphrinta uyinki onamathelayo we-solder. I-PCB solder inki inezigaba ezine zokuthuthuka, kusukela ohlotsheni lwefilimu eyomile yasekuqaleni kanye nohlobo lwe-thermosetting kancane kancane lwathuthukiswa lwaba yi-ULTRAVIOLET (UV) uhlobo lokulungiswa kokukhanya, bese kwavela uyinki okhulayo we-solder.

1. I-viscosity ephansi ingaba inki ye-ink-jet welding

Ngokuthuthuka kwemboni ye-elekthronikhi, ubuchwepheshe be-elekthronikhi obugcwele obuphrintiwe obunendlela yokwengeza buvela ngesikhathi esifanele. Inqubo yendlela yokwengeza inezinzuzo zokonga izinto ezibonakalayo, ukuvikelwa kwemvelo, inqubo eyenziwe lula, njll. Ngenxa yokusebenzisa kwayo inkjet yokuphrinta njengendlela yobuchwepheshe eyinhloko, kunezidingo ezintsha zezakhiwo zikayinki nezinto zomzimba, ezibonakala ikakhulukazi njengokuthi:

(1) lawula i-viscosity ye-inki, ukuqinisekisa ukuthi ingafafazwa ngokuqhubekayo ngokusebenzisa umlomo, ukuvimbela ipulaki ukuthi ihlangane

(2) lawula ijubane lokuphendula lokwelapha, finyelela okuqinile kokuqala, vimbela uyinki ku-substrate ngenxa yokungena nokusabalala;

(3) Lungisa i-thixotropy kayinki ukuze uqinisekise ikhwalithi nokuphindaphinda komugqa wokuphrinta. Ukuze kuthuthukiswe uyinki ephansi ye-viscosity solder, ukusetshenziswa okuyinhloko kokuguqulwa kwezinto ze-solder zendabuko, kulekelelwa yizidingo zedigri ezisebenzayo noma ezingasebenzi.

2. FPC welding inki

Ngokuthuthukiswa komkhakha we-PCB, isidingo se-FPC sikhula ngokushesha, futhi izidingo ezintsha zibekwa phambili zezinto ezihambisanayo. Ngenxa yokuthi ucingo lwethusi ku-flexo plate kulula ukwenza i-oxidize, impahla yokumelana ne-welding ye-flexo copper wire isiphenduke i-hotspot yocwaningo. Ifilimu yendabuko yokumelana ne-epoxy ibonisa ukuqina okuphezulu ngemva kokuphulukiswa futhi ayifaneleki i-flexography. Ngakho-ke, ukhiye wokuxazulula inkinga ukwethula ingxenye yeketango eguquguqukayo esakhiweni se-resin yendabuko futhi ugcine ukusebenza kwe-welding yasekuqaleni yokumelana. Uyinki unokusimama okuhle kwesitoreji, ungancibilika kahle esixazululweni se-sodium carbonate, isixazululo se-ammonia, okokusebenza kwefilimu elaphayo, izakhiwo ezishisayo, ze-asidi kanye ne-alkali zihlangabezana nezidingo ezifanele.

3. Inki ye-alkali encibilikayo emanzini

Ukuze kuncishiswe ukukhishwa kwamakhemikhali awuketshezi enqubeni yokukhiqiza ye-PCB futhi kunciphise umthelela wezixazululo kumvelo, inki yokuvimba i-solder iye yathuthuka kancane kancane kusuka enqubeni yokuthuthuka kwe-solvent ukuze inciphise ukuthuthukiswa kwamanzi ane-alkaline, futhi eminyakeni yamuva nje, ithuthukiselwe ukunisela ubuchwepheshe bokuthuthukisa. Ngesikhathi esifanayo, ukuze kuhlangatshezwane nezidingo zobuchwepheshe be-welding obungenayo i-lead yefilimu yokumelana, thuthukisa ukumelana nokusebenza kokushisa okuphezulu.

4. I-LED enoyinki omhlophe we-solder okhombisa phezulu

I-TaiyoInk yaqala ukubonisa uyinki wayo omhlophe wokuvinjwa kwe-solder yokupakishwa kwe-LED ngo-2007. Uma kuqhathaniswa noyinki wendabuko we-solder, uyinki omhlophe we-solder udinga ukuxazulula izinkinga zokushintsha umbala nokuguga okusheshayo okubangelwa ukuchayeka isikhathi eside emthonjeni wokukhanya. Uyinki ojwayelekile we-epoxy solder ngenxa yesakhiwo samangqamuzana aqukethe iringi ye-benzene, ukukhanya kwesikhathi eside kulula ukubangela ukushintsha kombala. Ukuze uthole umthombo wokukhanya we-LED, ukumbozwa kokunamathisela i-solder kufakwe ngaphansi kwento ekhanyayo, ngakho-ke kuyadingeka ukuthi kuthuthukiswe ukusebenza kahle kokukhanyisa kokumboza kwe-solder ekukhanyeni, bese kuthuthukisa ukukhanya komthombo wokukhanya. Lokhu kuletha inselele entsha ocwaningweni lwezinto zokushisela ukumelana.

Isiphetho

Ucwaningo lweyinki ye-solder luhlala luyiphuzu elinzima embonini ye-PCB. Ngesekethe yokuphrinta kusuka endleleni yokukhipha kancane kancane kuya endleleni yokwengeza, ukuphrinta kwe-inkjet njengezindlela zobuchwepheshe eziyinhloko zenqubo yokwengeza, i-viscosity ye-solder ink, i-thixotropy nokusebenza kabusha kubeka phambili izidingo eziphakeme; Ukuthandwa kobuchwepheshe bokushisela okungenamthofu kuye kwabeka phambili izidingo ezintsha zokumelana nokushisa okuphezulu kwefilimu ye-solder, ukuthuthukiswa kwe-solder flux entsha kudinga ngokushesha inani elikhulu labacwaningi, futhi ucwaningo lwe-ink ye-solder luyakhuphuka, olunobukhulu obukhulu. okungenzeka.