Inqubo ekhethekile yokucubungula kwe-PCB yebhodi lesifunda

1. Inqubo yokwengeza
Kubhekisa kwinqubo yokukhula eqondile yemigqa yabaqhubi bendawo enengqimba yethusi yamakhemikhali ebusweni be-non-conductor substrate ngosizo lwe-agent eyengeziwe yokumelana (bheka ikhasi 62, No. 47, Journal of information board board for imininingwane). Izindlela zokwengeza ezisetshenziswe kumabhodi wesifunda zingahlukaniswa zibe ukugcwaliswa okugcwele, ukungezwa okuncane kanye nokungezwa okuyingxenye.
2. Amapuleti asekelayo
Luhlobo lwebhodi lesifunda elinobukhulu obukhulu (njenge-0.093 “, 0.125”), elisetshenziselwa ngokukhethekile ukuxhuma nokuxhumana namanye amabhodi. Indlela ukufaka okokuqala isixhumi sephini ekucindezeleni umgodi ngaphandle kokufaka, bese uthwebula ngocingo ngakunye ngendlela yokufaka kuphini ngalinye lomhlahlandlela wesixhumi esidlula ebhodini. Ibhodi lesifunda elijwayelekile lingafakwa kusixhumi. Ngoba umgodi webhodi elikhethekile awunakuthengiswa, kepha udonga lomgodi nepini yomhlahlandlela ziboshwe ngqo ukuze zisetshenziswe, ngakho-ke izidingo zekhwalithi nokuvulwa kwazo ziqinile kakhulu, futhi ubukhulu bayo be-oda abukho obuningi. Abakhiqizi bebhodi lesifunda jikelele abafuni futhi kunzima ukwamukela lo myalo, ocishe waba yimboni ekhethekile esezingeni eliphakeme e-United States.
3. Yakha inqubo
Le yindlela ezacile yamapuleti amaningi emkhakheni omusha. Ukukhanyiselwa kwasekuqaleni kwavela enqubeni ye-SLC ye-IBM futhi kwaqala ukukhiqizwa kwecala efektri yaseYasu eJapan ngo-1989. Le ndlela isuselwa kupuleti lendabuko elenziwe emaceleni amabili. Izingcwecwe ezimbili zangaphandle zigcotshwe ngokuphelele ngezandulela zangaphansi ezingamanzi ezinjenge-probmer 52. Ngemuva kokuqina kwesithombe nokuzinza kwesithombe, “isithombe nge” esingajulile esixhunywe nesendlalelo esilandelayo esingezansi senziwa, Ngemuva kokuthi ithusi lamakhemikhali nethusi elethwe ngogesi lisetshenziselwe ukwandisa ngokuphelele ungqimba womqhubi, nangemva kokucabanga nokufakwa emugqeni, izintambo ezintsha nezimbobo ezigqitshwe noma izimbobo eziyimpumputhe ezixhunywe ngongqimba ongezansi zingatholakala. Ngale ndlela, inani elidingekayo lezendlalelo zebhodi le-multilayer lingatholakala ngokungeza izingqimba ngokuphindaphindiwe. Le ndlela ayikwazi nje kuphela ukugwema ezibizayo mechanical imishini izindleko, kodwa futhi ukunciphisa ububanzi imbobo ukuba ngaphansi kuka 10mil. Eminyakeni emihlanu kuya kweyisithupha edlule, izinhlobo ezahlukahlukene zobuchwepheshe bebhodi yama-multilayer ezephula isiko futhi zamukele ungqimba ngongqimba zikhuthazwe ngokuqhubekayo ngabakhiqizi e-United States, Japan nase-Europe, okwenza lezi zakha izinqubo ezidumile, futhi kukhona okungaphezulu izinhlobo eziyishumi zemikhiqizo emakethe. Ngaphezu kwalokhu okungenhla kwe- “pore photosensitive ukwakha”; Kukhona nezindlela ezahlukahlukene ze- “pore ukwakha” ezinjenge-alkaline chemical biting, laser ablation kanye ne-plasma etching yamapuleti emvelo ngemuva kokukhipha isikhumba sethusi endaweni yomgodi. Ngaphezu kwalokho, uhlobo olusha lwe- “resin camera camera foil” oluhlanganiswe ne-resin semi hardening lungasetshenziselwa ukwenza amabhodi ama-multilayer amancane, acinene, amancane futhi ancanyana ngokulandelwa okulandelanayo. Ngokuzayo, imikhiqizo ehlukahlukene yomuntu siqu ye-elekthronikhi izoba ngumhlaba waleli bhodi elizacile, elifushane futhi elinemigqa eminingi.
4. ICermet Taojin
Impuphu ye-ceramic ixutshwe nempuphu yensimbi, bese kuthi okunamathiselwe kufakwe njengokumboza. Ingasetshenziswa njengokubekwa kwendwangu kwe- “resistor” ebusweni bebhodi lesifunda (noma ungqimba lwangaphakathi) ngendlela yefilimu ewugqinsi noma ukuphrinta okuncane kwefilimu, ukuze ungene esikhundleni sesiphikisi sangaphandle ngesikhathi somhlangano.
5. Co ukudubula
Kuyinqubo yokukhiqiza yebhodi lesifunda le-ceramic hybrid. Amasekethe aphrintiwe anezinhlobo ezahlukahlukene zensimbi eyigugu yokunamathisela ifilimu ebhodini elincane akhishwa ngokushisa okuphezulu. Izithwali ezahlukahlukene zemvelo ekubhanqeni kwefilimu obukhulu ziyashiswa, kusale imigqa yabaqhubi bensimbi eyigugu njengezintambo ezixhunyiwe.
6. Ukuwela kweCrossover
Izimpambanweni zemigwaqo emi mpo yamakhondaktha amabili amile futhi avundlile ebusweni bebhodi, futhi ukwehla kwempambana mgwaqo kugcwele indawo yokuvikela izinto. Ngokuvamile, i-carbon film jumper ingezwa kubuso bopende obuluhlaza bephaneli elilodwa, noma i-wiring engenhla nangaphansi kwendlela yokwengeza ungqimba injalo “yokuwela”.
7. Yakha ibhodi lezintambo
Okusho ukuthi, esinye isici sebhodi lezintambo eziningi sakhiwa ngokufaka ucingo oluyindilinga oluyindilinga ebusweni bebhodi nokungeza ngemigodi. Ukusebenza kwalolu hlobo lwebhodi elihlanganisiwe emgqeni wokudlulisa onemvamisa ephezulu kungcono kunesifunda esiyisikwele esiyisicaba esakhiwe yi-PCB ejwayelekile.
8. Dycosttrate plasma etching hole okwandisa ungqimba indlela
Kuyinqubo yokwakha eyenziwe yinkampani ye-dyconex etholakala eZurich, eSwitzerland. Kuyindlela yokufaka ucwecwe lwethusi endaweni ngayinye yomgodi endaweni engaphezulu kwepuleti kuqala, bese uyibeka endaweni evaliwe yomshini, bese ugcwalisa i-CF4, i-N2 ne-O2 ukwenza i-ionize ngaphansi kwamandla amakhulu ukwakha i-plasma ngomsebenzi ophakeme, ukuze qeda i-substrate endaweni yomgodi bese ukhiqiza izimbobo ezincane zokushayela (ngaphansi kwe-10mil). Inqubo yayo yokuhweba ibizwa nge-dycostrate.
9. U-Electro ufake i-photoresist
Kuyindlela entsha yokwakha ye- “photoresist”. Ekuqaleni yayisetshenziselwa “ukupenda ngogesi” kwezinto zensimbi ezinesimo esiyinkimbinkimbi. Kusanda kwethulwa ukusetshenziswa kwe “photoresist”. Uhlelo lusebenzisa indlela ye-electroplating yokufaka ngokulinganayo izinhlayiya ze-colloidal ezikhokhisiwe ze-resin egcwele icala ebucayi ebusweni bethusi bebhodi lesifunda njenge-anti etching inhibitor. Njengamanje, isetshenzisiwe ekukhiqizeni ngobuningi enqubeni eqondile yokufakwa kwethusi kwepuleti langaphakathi. Lolu hlobo lwe-ED photoresist lungabekwa ku-anode noma ku-cathode ngokuya ngezindlela zokusebenza ezihlukile, ezibizwa nge- “anode type electric photoresist” kanye ne- “cathode type electric photoresist”. Ngokuya ngezimiso ezahlukahlukene zokubuka izithombe, kunezinhlobo ezimbili: ukusebenza okungekuhle nokusebenza okuhle. Njengamanje, i-photoresist esebenza kabi iye yathengiswa, kepha ingasetshenziswa kuphela njenge-photoresist ehlelekile. Ngoba kunzima ukwenza i-photosensitize emgodini ogqobayo, ngeke isetshenziselwe ukudluliswa kwesithombe sepuleti langaphandle. Ngokuqondene ne- “ed editive” engasetshenziswa njenge-photoresist yepuleti elingaphandle (ngoba iyifilimu yokubola efiphele, yize ukufiphala komoya obondeni lomgodi kunganele, akunamthelela). Njengamanje, imboni yaseJapan isaqhubeka nokuqinisa imizamo yayo, inethemba lokwenza umkhiqizo omkhulu wentengiso, ukuze kwenziwe ukukhiqizwa kwemigqa emincane kube lula. Leli gama libizwa nangokuthi “i-electrophoretic photoresist”.
10. Umqhubi oshumekiwe wesifunda, umqhubi oyisicaba
Yibhodi lesifunda elikhethekile elinobuso obucwebe ngokuphelele futhi yonke imigqa yabaqhubi icindezelwe kupuleti. Indlela eyodwa yephaneli ukufaka ingxenye yocwecwe lwethusi kupuleti le-substrate elaphekiwe ngakwindlela yokudlulisa isithombe ukuthola isekethe. Bese ucindezela wesifunda ebusweni ibhodi singene ipuleti semi lukhuni ngendlela lokushisa okuphezulu kanye umfutho ophakeme, futhi ngesikhathi esifanayo, ukusebenza lukhuni ipuleti resin kungaqedwa, ukuze abe ibhodi wesifunda nazo zonke imigqa flat ukuhoxiswa ku ubuso. Imvamisa, ungqimba lwethusi oluncane ludinga ukususwa kancane kumjikelezo wesifunda lapho ibhodi lihoxisiwe khona, ukuze enye ungqimba we-nickel engu-0.3mil, ungqimba lwe-20 micro rhodium ungqimba noma ungqimba wegolide oyi-10 intshi ungafakwa, ukuze oxhumana naye ukumelana kungaba phansi futhi kulula ukuslayida lapho ukuthintwa kokuthintana kwenziwa. Kodwa-ke, i-PTH akufanele isetshenziswe kule ndlela ukuvimbela imbobo ekucindezelweni ngenkathi icindezelwa, futhi akulula ukuthi leli bhodi lizuze indawo ebushelelezi ngokuphelele, futhi lingasetshenziswa ezingeni lokushisa eliphezulu ukuvimbela umugqa ukuxoshwa ebusweni ngemuva kokunwetshwa kwe-resin. Lobu buchwepheshe babizwa nangokuthi indlela ye-etch ne-Push, futhi ibhodi eliqediwe libizwa ngokuthi ibhodi elihlanganisiwe, elingasetshenziselwa izinhloso ezikhethekile njengokushintshwa kwe-rotary kanye noxhumana nabo be-wiring.
11. Frit ingilazi frit
Ngaphezu kwamakhemikhali ayigugu ensimbi, ingilazi powder idinga ukungezwa kunamathisela wokuphrinta wefilimu (PTF), ukuze kudlalwe umphumela wokuhlangana nokunamathela ekushiseni okushisa okuphezulu, ukuze unamathisele wokuphrinta endaweni engaphansi ye-ceramic substrate Ungakha uhlelo lwesifunda lwensimbi oluyigugu eliqinile.
Inqubo ephelele yokufaka
Kuyindlela yokukhulisa amasekhethi akhethiwe endaweni engafakwanga ngokuphelele yipuleti ngendlela ye-electrodeposition yensimbi (iningi layo okuyikhemikhali lethusi), ebizwa ngokuthi “indlela yokufaka ephelele”. Esinye isitatimende esingalungile yindlela ye- “full electroless”.
13. Isifunda esihlanganisiwe seHybrid
Imodeli yokusetshenziswa iphathelene nesifunda sokufaka inki eyigugu yokuhambisa insimbi kupuleti elincane lesisekelo esincanyana ngokuphrinta, bese lishisa into ephilayo ku-inki ekushiseni okuphezulu, kushiye isekhethi somqhubi ebusweni bepuleti, nokushisela kobuso obuboshwe izingxenye zingenziwa. Imodeli yokusetshenziswa ihlobene nesithwali sesifunda phakathi kwebhodi lesifunda eliphrintiwe nedivayisi yesekethe edidiyelwe semiconductor, okungeyobuchwepheshe obukhulu bamafilimu. Ezinsukwini zokuqala, yayisetshenziselwa ukusetshenziswa kwezempi noma imvamisa ephezulu. Eminyakeni yamuva nje, ngenxa yentengo ephezulu, ukwehla kwamasosha, nobunzima bokukhiqiza okuzenzakalelayo, kuhambisana nokwanda okuncanyana kanye nokunemba kwamabhodi wesifunda, ukukhula kwale nhlanganisela kuncane kakhulu kunalokho eminyakeni yokuqala.
14. Umqhubi we-interposer interconnect
I-Interposer ibhekisa kunoma yiziphi izingqimba ezimbili zabaqhubi ezithwalwa yinto evimbela ukuxhumeka ngokufaka ezinye izinto zokugcwalisa endaweni ezoxhunywa. Isibonelo, uma izimbobo ezingenalutho zamapuleti anezingqimba eziningi zigcwaliswa ngesinamathisela esiliva noma unamathisele ithusi ukuze kufakwe esikhundleni sodonga lwembobo ye-orthodox yethusi, noma izinto ezifana nohlaka lokunamathela oluqonde mpo lwe-unidirectional, zonke zingezoluhlobo lwe-interposer.