Model : 2+N+2  Mobile Main Board

Layers : 8Layers

Material : TG170 FR4

Construction : 2+4+2 HDI PCB

Finished Thickness：0.8mm

Copper Thickness : 0.5OZ

Color : Green/White

Surface Treatment：Immersion Gold+OSP

Min Trace / Space：3mil/3mil

Min Hole：Laser Hole 0.1mm

Application : Mobile Main Board