Modelo : 2+N+2 Mobile Main Board

Mga Layer: 8 Layers

Materyal: TG170 FR4

Konstruksyon : 2+4+2 HDI PCB

Tapos na Kapal：0.8mm

Kapal ng tanso: 0.5OZ

Kulay : Berde/Puti

Surface Treatment：Immersion Gold+OSP

Min Trace / Space：3mil/3mil

Min Hole：Laser Hole 0.1mm

Aplikasyon: Mobile Main Board