Mohlala : 2+N+2 Mobile Main Board

Likarolo: 8 Layers

lintho tse bonahalang: TG170 FR4

Kaho : 2+4+2 HDI PCB

Botenya bo felileng: 0.8mm

Botenya ba Koporo: 0.5OZ

Mmala : Botala/Bosweu

Kalafo ea Bokaholimo: Immersion Gold + OSP

Min Trace / Space: 3mil/3mil

Min Hole: Laser Hole 0.1mm

Kopo : Mobile Main Board