Model : 2+N+2  Mobile Main Board

Layers : 8Layers

Material : TG170 FR4

Konstruksje: 2+4+2 HDI PCB

Foltôge dikte: 0.8mm

Koperdikte: 0.5 OZ

Kleur: Grien/wyt

Oerflakbehanneling: Immersion Gold + OSP

Min Trace / Space: 3mil / 3mil

Min gat: Laser gat 0.1 mm

Application : Mobile Main Board