Model : 2+N+2  Mobile Main Board

Layers : 8Layers

Material : TG170 FR4

Dhismaha: 2+4+2 HDI PCB

Dhumucda dhammaatay: 0.8mm

Dhumucda naxaasta: 0.5OZ

Midabka: Cagaar/ Cadaan

Daaweynta Dusha sare: Immersion Gold+OSP

Min Raadraaca / Meesha: 3mil/3mil

Hole Min: Hole Laser 0.1mm

Application : Mobile Main Board