Model : 2+N+2  Mobile Main Board

Layers : 8Layers

Material : TG170 FR4

Ukwakhiwa : 2+4+2 HDI PCB

Ubukhulu obuqediwe: 0.8mm

Ubukhulu Bethusi: 0.5OZ

Umbala : Oluhlaza/Omhlophe

Ukwelashwa Okungaphezulu:I-Immersion Gold+OSP

I-Min Trace / Isikhala: 3mil/3mil

I-Min Hole: Imbobo ye-Laser 0.1mm

Application : Mobile Main Board