Awoṣe: 2+N+2 Mobile Main Board

Awọn ipele: 8 Layers

Ohun elo: TG170 FR4

Ikole: 2+4+2 HDI PCB

Sisanra ti pari: 0.8mm

Sisanra Ejò: 0.5OZ

Awọ: Alawọ ewe/funfun

Itọju Oju: Immersion Gold+OSP

Itọpa min / aaye: 3mil/3mil

Min Iho: Lesa Iho 0.1mm

Ohun elo: Mobile Main Board