Samfurin: 2+N+2 Mobile Main Board

Layer: 8 Layers

Saukewa: TG170FR4

Gina: 2+4+2 HDI PCB

Ƙarshen Kauri: 0.8mm

Kauri na jan ƙarfe: 0.5OZ

Launi: Kore/Fara

Maganin Sama: Immersion Gold+OSP

Min Trace / Space: 3mil/3mil

Min Hole: Laser Hole 0.1mm

Aikace-aikace : Mobile Main Board