Model : 2+N+2  Mobile Main Board

Layers : 8Layers

Material : TG170 FR4

Hana: 2 + 4 + 2 HDI PCB

Mānoanoa Hoʻopau: 0.8mm

Mānoanoa keleawe: 0.5OZ

Kala: ʻOmaomao/Keʻokeʻo

Hoʻomaʻamaʻa ʻili: Immersion Gold+OSP

Min Trace / Space：3mil/3mil

Min Hole: Laser Hole 0.1mm

Application : Mobile Main Board