- 29
- Oct
2 + N + 2 Mobile Main Board
Qauv: 2 + N + 2 Mobile Main Board
Layers: 8 Layers
Khoom siv: TG170 FR4
Kev tsim kho: 2 + 4 + 2 HDI PCB
Ua tiav Thickness: 0.8mm
Tooj Tooj: 0.5OZ
Xim: Ntsuab / Dawb
Kev kho deg: Immersion Kub + OSP
Min Trace / Chaw: 3mil / 3mil
Min Qhov: Laser Qhov 0.1mm
Daim Ntawv Thov: Mobile Main Board