1. The signal line that needs to be impedance should be set in strict accordance with the line width and line distance calculated by the stack. For example, radio frequency signal (normal 50R control), important single-ended 50R, differential 90R, differential 100R and other signal lines, the specific line width and line spacing can be calculated by stacking (pictured below).

How to set the line width and line spacing in PCB disain

2. The designed line width and line spacing should consider the production process capability of the selected PCB production factory. If the line width and line spacing is set to exceed the process capability of the cooperating PCB manufacturer during the design, unnecessary production costs need to be added, and the The design cannot be produced. Generally, the line width and line spacing are controlled to 6/6mil under normal circumstances, and the via hole is 12mil (0.3mm). Basically, more than 80% of PCB manufacturers can produce it, and the production cost is the lowest. The minimum line width and line spacing is controlled to 4/4mil, and the via hole is 8mil (0.2mm). Basically, more than 70% of PCB manufacturers can produce it, but the price is slightly more expensive than the first case, not too expensive. The minimum line width and line spacing is controlled to 3.5/3.5mil, and the via hole is 8mil (0.2mm). At this time, some PCB manufacturers cannot produce it, and the price will be more expensive. The minimum line width and line spacing is controlled to 2/2mil, and the via hole is 4mil (0.1mm, at this time, it is generally HDI blind buried via design, and laser vias are required). At this time, most PCB manufacturers can’t produce it, and the price is the most expensive of. The line width and line spacing here refer to the size between elements such as line-to-hole, line-to-line, line-to-pad, line-to-via, and hole-to-disk when setting rules.

3. Seadke reeglid, et arvestada disainifailis esineva disaini kitsaskohaga. Kui on 1 mm BGA kiip, on tihvti sügavus madal, kahe tihvtirea vahele on vaja ainult ühte signaaliliini, mille saab määrata 6/6 milile, tihvti sügavus on sügavam ja vaja on kahte rida kontakte Signaaliliin on seatud 4/4mil; seal on 0.65 mm BGA kiip, mis on üldiselt seatud 4/4mil; on 0.5 mm BGA kiip, üldine rea laius ja reavahe tuleb määrata 3.5/3.5mil; seal on 0.4 mm BGA kiibid, mis nõuavad üldiselt HDI-disaini. Üldiselt saab disaini kitsaskoha jaoks määrata piirkondlikud reeglid (vt artikli lõppu [AD-tarkvara RUUMI seadmiseks, tarkvara ALLEGRO piirkondlike reeglite määramiseks]), määrata kohaliku rea laiuse ja reavahe väikeseks punktiks ning määrata reeglid, et PCB muud osad oleksid tootmiseks suuremad. Parandage toodetud PCB kvalifitseeritud määra.

4. See tuleb seadistada vastavalt PCB disaini tihedusele. Tihedus on väiksem ja laud on lahtisem. Rea laiuse ja reavahe saab määrata suuremaks ja vastupidi. Rutiini saab seadistada järgmiste sammude järgi:

1) 8/8mil, 12mil (0.3mm) läbiva ava jaoks.

2) 6/6mil, 12mil (0.3mm) läbiva ava jaoks.

3) 4/4mil, 8mil (0.2mm) läbiva ava jaoks.

4) 3.5/3.5mil, 8mil (0.2mm) läbiva ava jaoks.

5) 3.5/3.5mil, 4mil ava jaoks (0.1 mm, laserpuurimine).

6) 2/2mil, 4mil ava jaoks (0.1 mm, laserpuurimine).