1. The signal line that needs to be impedance should be set in strict accordance with the line width and line distance calculated by the stack. For example, radio frequency signal (normal 50R control), important single-ended 50R, differential 90R, differential 100R and other signal lines, the specific line width and line spacing can be calculated by stacking (pictured below).

How to set the line width and line spacing in PCB dizajn

2. The designed line width and line spacing should consider the production process capability of the selected PCB production factory. If the line width and line spacing is set to exceed the process capability of the cooperating PCB manufacturer during the design, unnecessary production costs need to be added, and the The design cannot be produced. Generally, the line width and line spacing are controlled to 6/6mil under normal circumstances, and the via hole is 12mil (0.3mm). Basically, more than 80% of PCB manufacturers can produce it, and the production cost is the lowest. The minimum line width and line spacing is controlled to 4/4mil, and the via hole is 8mil (0.2mm). Basically, more than 70% of PCB manufacturers can produce it, but the price is slightly more expensive than the first case, not too expensive. The minimum line width and line spacing is controlled to 3.5/3.5mil, and the via hole is 8mil (0.2mm). At this time, some PCB manufacturers cannot produce it, and the price will be more expensive. The minimum line width and line spacing is controlled to 2/2mil, and the via hole is 4mil (0.1mm, at this time, it is generally HDI blind buried via design, and laser vias are required). At this time, most PCB manufacturers can’t produce it, and the price is the most expensive of. The line width and line spacing here refer to the size between elements such as line-to-hole, line-to-line, line-to-pad, line-to-via, and hole-to-disk when setting rules.

3. Stanovte pravidlá na zohľadnenie úzkych miest návrhu v súbore návrhu. Ak existuje 1 mm BGA čip, hĺbka kolíkov je plytká, medzi dvoma radmi kolíkov je potrebná iba jedna signálna linka, ktorú možno nastaviť na 6/6 mil, hĺbka kolíkov je hlbšia a sú potrebné dva rady kolíkov Signálne vedenie je nastavené na 4/4mil; existuje 0.65 mm BGA čip, ktorý je všeobecne nastavený na 4/4 mil; existuje 0.5 mm BGA čip, všeobecná šírka riadku a riadkovanie musia byť nastavené na 3.5/3.5 mil; existuje 0.4 mm BGA čipy vo všeobecnosti vyžadujú HDI dizajn. Vo všeobecnosti pre problémové miesto v dizajne môžete nastaviť regionálne pravidlá (pozrite si koniec článku [AD softvér na nastavenie ROOM, softvér ALLEGRO na nastavenie regionálnych pravidiel]), nastaviť lokálnu šírku čiar a riadkovanie na malý bod a nastaviť pravidlá pre ostatné časti DPS, aby boli väčšie pre výrobu. Zlepšite kvalifikovanú mieru vyrobenej PCB.

4. Je potrebné nastaviť podľa hustoty návrhu DPS. Hustota je menšia a doska voľnejšia. Šírka riadkov a riadkovanie môžu byť väčšie a naopak. Rutinu je možné nastaviť podľa nasledujúcich krokov:

1) 8/8 mil., 12 mil. (0.3 mm) pre priechodný otvor.

2) 6/6 mil., 12 mil. (0.3 mm) pre priechodný otvor.

3) 4/4 mil., 8 mil. (0.2 mm) pre priechodný otvor.

4) 3.5/3.5 mil., 8 mil. (0.2 mm) pre priechodný otvor.

5) 3.5/3.5 mil., 4 mil. Pre priechodný otvor (0.1 mm, laserové vŕtanie).

6) 2/2 mil., 4 mil. Pre priechodný otvor (0.1 mm, laserové vŕtanie).