1. The signal line that needs to be impedance should be set in strict accordance with the line width and line distance calculated by the stack. For example, radio frequency signal (normal 50R control), important single-ended 50R, differential 90R, differential 100R and other signal lines, the specific line width and line spacing can be calculated by stacking (pictured below).

How to set the line width and line spacing in PCB design

2. The designed line width and line spacing should consider the production process capability of the selected PCB production factory. If the line width and line spacing is set to exceed the process capability of the cooperating PCB manufacturer during the design, unnecessary production costs need to be added, and the The design cannot be produced. Generally, the line width and line spacing are controlled to 6/6mil under normal circumstances, and the via hole is 12mil (0.3mm). Basically, more than 80% of PCB manufacturers can produce it, and the production cost is the lowest. The minimum line width and line spacing is controlled to 4/4mil, and the via hole is 8mil (0.2mm). Basically, more than 70% of PCB manufacturers can produce it, but the price is slightly more expensive than the first case, not too expensive. The minimum line width and line spacing is controlled to 3.5/3.5mil, and the via hole is 8mil (0.2mm). At this time, some PCB manufacturers cannot produce it, and the price will be more expensive. The minimum line width and line spacing is controlled to 2/2mil, and the via hole is 4mil (0.1mm, at this time, it is generally HDI blind buried via design, and laser vias are required). At this time, most PCB manufacturers can’t produce it, and the price is the most expensive of. The line width and line spacing here refer to the size between elements such as line-to-hole, line-to-line, line-to-pad, line-to-via, and hole-to-disk when setting rules.

3. Deji shuruuc si aad u tixgeliso cilada naqshadeynta ee faylka naqshadeynta. Haddii uu jiro 1mm BGA chip, qoto dheer ee biinku waa mid qoto dheer, kaliya hal xariiq oo calaamad ah ayaa loo baahan yahay inta u dhaxaysa labada saf ee biinanka, kaas oo lagu dhejin karo 6/6 mil, qoto dheer ee biinku waa qoto dheer yahay, laba saf oo biinanka ayaa loo baahan yahay. Xariiqda calaamadda waxaa lagu dejiyay 4/4mil; waxaa jira 0.65mm BGA chip, kaas oo guud ahaan loo dhigay 4/4mil; waxa jira 0.5mm BGA chip, ballaca xariiqda guud iyo kala dheeraynta laynka waa in la dejiyaa 3.5/3.5mil; Waxaa jira 0.4mm BGA Chips guud ahaan waxay u baahan yihiin naqshad HDI. Guud ahaan, cirifka naqshadeynta, waxaad dejin kartaa xeerarka gobolka (fiiri dhammaadka maqaalka [AD software si loo dejiyo ROOM, ALLEGRO software si loo dejiyo xeerarka gobolka]), deji ballaca xariiqda maxalliga ah iyo kala dheeraynta laynka meel yar, oo deji xeerarka qaybaha kale ee PCB si ay u weynaadaan wax soo saarka. Hagaajinta heerka u qalma ee PCB ee la soo saaray.

4. Waxay u baahan tahay in loo dejiyo iyadoo loo eegayo cufnaanta naqshadda PCB. Cufnaanta ayaa ka yar oo looxa waa dabacsan yahay. Balaadhka xariiqda iyo kala dheeraynta laynka ayaa loo dejin karaa inay ka sii weynaadaan, iyo lidkeeda. Habka caadiga ah waxaa loo dejin karaa iyadoo loo eegayo tillaabooyinka soo socda:

1) 8/8mil, 12mil (0.3mm) oo loogu tala galay daloolka.

2) 6/6mil, 12mil (0.3mm) oo loogu tala galay daloolka.

3) 4/4mil, 8mil (0.2mm) oo loogu tala galay daloolka.

4) 3.5/3.5mil, 8mil (0.2mm) oo loogu tala galay daloolka.

5) 3.5/3.5mil, 4mil loogu talagalay daloolka (0.1mm, qodista laser).

6) 2/2mil, 4mil loogu talagalay daloolka (0.1mm, qodista laser).