1. The signal line that needs to be impedance should be set in strict accordance with the line width and line distance calculated by the stack. For example, radio frequency signal (normal 50R control), important single-ended 50R, differential 90R, differential 100R and other signal lines, the specific line width and line spacing can be calculated by stacking (pictured below).

How to set the line width and line spacing in PCB design

2. The designed line width and line spacing should consider the production process capability of the selected PCB production factory. If the line width and line spacing is set to exceed the process capability of the cooperating PCB manufacturer during the design, unnecessary production costs need to be added, and the The design cannot be produced. Generally, the line width and line spacing are controlled to 6/6mil under normal circumstances, and the via hole is 12mil (0.3mm). Basically, more than 80% of PCB manufacturers can produce it, and the production cost is the lowest. The minimum line width and line spacing is controlled to 4/4mil, and the via hole is 8mil (0.2mm). Basically, more than 70% of PCB manufacturers can produce it, but the price is slightly more expensive than the first case, not too expensive. The minimum line width and line spacing is controlled to 3.5/3.5mil, and the via hole is 8mil (0.2mm). At this time, some PCB manufacturers cannot produce it, and the price will be more expensive. The minimum line width and line spacing is controlled to 2/2mil, and the via hole is 4mil (0.1mm, at this time, it is generally HDI blind buried via design, and laser vias are required). At this time, most PCB manufacturers can’t produce it, and the price is the most expensive of. The line width and line spacing here refer to the size between elements such as line-to-hole, line-to-line, line-to-pad, line-to-via, and hole-to-disk when setting rules.

3. Ṣeto awọn ofin lati ṣe akiyesi igo apẹrẹ ni faili apẹrẹ. Ti chirún BGA 1mm kan ba wa, ijinle pin jẹ aijinile, laini ifihan kan nikan ni a nilo laarin awọn ori ila meji ti awọn pinni, eyiti o le ṣeto si 6/6 mil, ijinle pin jinle, ati pe awọn ori ila meji ti awọn pinni nilo. Awọn ifihan agbara ila ti ṣeto si 4/4mil; 0.65mm BGA ni ërún, eyi ti o wa ni gbogbo ṣeto si 4/4mil; Chirún BGA 0.5mm kan wa, iwọn ila gbogbogbo ati aye laini gbọdọ ṣeto si 3.5/3.5mil; Awọn eerun BGA 0.4mm kan wa ni gbogbogbo nilo apẹrẹ HDI. Ni gbogbogbo, fun igo apẹrẹ, o le ṣeto awọn ofin agbegbe (wo opin nkan naa [sọfitiwia AD lati ṣeto yara, sọfitiwia ALLEGRO lati ṣeto awọn ofin agbegbe]), ṣeto iwọn laini agbegbe ati aye laini si aaye kekere kan, ati ṣeto Awọn ofin fun awọn ẹya miiran ti PCB lati tobi fun iṣelọpọ. Ṣe ilọsiwaju oṣuwọn oṣiṣẹ ti PCB ti a ṣe.

4. O nilo lati ṣeto ni ibamu si iwuwo ti apẹrẹ PCB. Awọn iwuwo jẹ kere ati awọn ọkọ jẹ looser. Iwọn ila ati aaye laini le ṣeto si tobi, ati ni idakeji. Ilana ilana le ṣee ṣeto ni ibamu si awọn igbesẹ wọnyi:

1) 8/8mil, 12mil (0.3mm) fun nipasẹ iho.

2) 6/6mil, 12mil (0.3mm) fun nipasẹ iho.

3) 4/4mil, 8mil (0.2mm) fun nipasẹ iho.

4) 3.5/3.5mil, 8mil (0.2mm) fun nipasẹ iho.

5) 3.5/3.5mil, 4mil fun nipasẹ iho (0.1mm, liluho laser).

6) 2/2mil, 4mil fun nipasẹ iho (0.1mm, liluho laser).