1. The signal line that needs to be impedance should be set in strict accordance with the line width and line distance calculated by the stack. For example, radio frequency signal (normal 50R control), important single-ended 50R, differential 90R, differential 100R and other signal lines, the specific line width and line spacing can be calculated by stacking (pictured below).

How to set the line width and line spacing in PCB proxecto

2. The designed line width and line spacing should consider the production process capability of the selected PCB production factory. If the line width and line spacing is set to exceed the process capability of the cooperating PCB manufacturer during the design, unnecessary production costs need to be added, and the The design cannot be produced. Generally, the line width and line spacing are controlled to 6/6mil under normal circumstances, and the via hole is 12mil (0.3mm). Basically, more than 80% of PCB manufacturers can produce it, and the production cost is the lowest. The minimum line width and line spacing is controlled to 4/4mil, and the via hole is 8mil (0.2mm). Basically, more than 70% of PCB manufacturers can produce it, but the price is slightly more expensive than the first case, not too expensive. The minimum line width and line spacing is controlled to 3.5/3.5mil, and the via hole is 8mil (0.2mm). At this time, some PCB manufacturers cannot produce it, and the price will be more expensive. The minimum line width and line spacing is controlled to 2/2mil, and the via hole is 4mil (0.1mm, at this time, it is generally HDI blind buried via design, and laser vias are required). At this time, most PCB manufacturers can’t produce it, and the price is the most expensive of. The line width and line spacing here refer to the size between elements such as line-to-hole, line-to-line, line-to-pad, line-to-via, and hole-to-disk when setting rules.

3. Establece regras para considerar o pescozo de botella do deseño no ficheiro de deseño. Se hai un chip BGA de 1 mm, a profundidade do pin é pouca, só se necesita unha liña de sinal entre as dúas filas de pinos, que se pode configurar en 6/6 mil, a profundidade do pin é máis profunda e son necesarias dúas filas de pinos. A liña de sinal está configurada en 4/4mil; hai un chip BGA de 0.65 mm, que xeralmente está configurado en 4/4 mil; hai un chip BGA de 0.5 mm, o ancho xeral de liña e o espazo entre liñas deben configurarse en 3.5/3.5 mil; Hai un chip BGA de 0.4 mm xeralmente require un deseño HDI. Xeralmente, para o pescozo de botella do deseño, pode establecer regras rexionais (consulte o final do artigo [Software AD para configurar ROOM, software ALLEGRO para establecer regras rexionais]), establecer o ancho de liña local e o espaciado entre liñas nun punto pequeno e establecer as regras para que outras partes do PCB sexan máis grandes para a produción. Mellora a taxa cualificada de PCB producido.

4. Debe configurarse segundo a densidade do deseño do PCB. A densidade é menor e o taboleiro é máis solto. O ancho de liña e o espazo entre liñas pódense configurar para que sexan maiores e viceversa. A rutina pódese configurar segundo os seguintes pasos:

1) 8 / 8mil, 12mil (0.3mm) para orificio vía.

2) 6 / 6mil, 12mil (0.3mm) para orificio vía.

3) 4 / 4mil, 8mil (0.2mm) para orificio vía.

4) 3.5 / 3.5mil, 8mil (0.2mm) para orificio vía.

5) 3.5 / 3.5mil, 4mil para orificio vía (0.1mm, perforación láser).

6) 2 / 2mil, 4mil para orificio vía (0.1mm, perforación láser).