1. Ulayini wesignali odinga ukuvinjelwa kufanele usethwe ngokuhambisana ngokuqinile nobubanzi bomugqa nebanga lomugqa elibalwa yisitaki. Isibonelo, isignali yefrikhwensi yomsakazo (ukulawula okujwayelekile kwe-50R), i-50R ebalulekile ene-single-end, umehluko we-90R, umehluko we-100R neminye imigqa yesignali, ububanzi bomugqa othize kanye nesikhala somugqa singabalwa ngokupakisha (okufanekiselwe ngezansi).

Ungamisa kanjani ububanzi bomugqa nesikhala somugqa phakathi PCB design

2. Ububanzi bomugqa oklanyelwe kanye nesikhala somugqa kufanele kucabangele amandla enqubo yokukhiqiza yemboni yokukhiqiza ye-PCB ekhethiwe. Uma ububanzi bomugqa kanye nesikhala somugqa kusethwe ukuthi kudlule amandla enqubo yomkhiqizi we-PCB obambisanayo phakathi nomklamo, izindleko zokukhiqiza ezingadingekile zidinga ukwengezwa, futhi Idizayini ayikwazi ukukhiqizwa. Ngokuvamile, ububanzi bomugqa kanye nesikhala somugqa kulawulwa ku-6/6mil ngaphansi kwezimo ezijwayelekile, kanti i-via hole ingu-12mil (0.3mm). Ngokuyisisekelo, ngaphezu kwe-80% yabakhiqizi be-PCB abangayikhiqiza, futhi izindleko zokukhiqiza ziphansi kakhulu. Ubuncane bobubanzi bomugqa kanye nesikhala somugqa kulawulwa ku-4/4mil, kanti i-via hole ngu-8mil (0.2mm). Ngokuyisisekelo, ngaphezu kwe-70% yabakhiqizi be-PCB bangayikhiqiza, kodwa intengo ibiza kancane kunecala lokuqala, ayibizi kakhulu. Ububanzi obuncane bomugqa kanye nesikhala somugqa kulawulwa ku-3.5/3.5mil, kanti i-via hole ngu-8mil (0.2mm). Ngalesi sikhathi, abanye abakhiqizi be-PCB abakwazi ukuyikhiqiza, futhi intengo izobiza kakhulu. Ububanzi obuncane bomugqa kanye nesikhala somugqa kulawulwa ku-2/2mil, futhi i-via hole ingu-4mil (0.1mm, ngalesi sikhathi, ngokuvamile ayiboni i-HDI egqitshwe ngokuklama, futhi i-laser vias iyadingeka). Ngalesi sikhathi, abakhiqizi abaningi be-PCB abakwazi ukuyikhiqiza, futhi intengo ibiza kakhulu. Ububanzi bomugqa kanye nesikhala somugqa lapha kubhekisela kusayizi ophakathi kwezinto ezifana nomugqa-kuya-umgodi, umugqa-kuya-umugqa, umugqa-kuya-phedi, umugqa wokudlula, kanye nembobo kuya kudiski lapho ubeka imithetho.

3. Beka imithetho yokucabangela ibhodlela lokuklama efayeleni lokuklama. Uma kukhona i-chip ye-BGA engu-1mm, ukujula kwephini akujulile, kudingeka umugqa wesignali owodwa kuphela phakathi kwemigqa emibili yamaphini, angasethwa ku-6/6 mil, ukujula kwephini kujule, futhi kudingeka imigqa emibili yamaphini. Ulayini wesignali usethelwe ku-4/4mil; kukhona i-chip ye-BGA engu-0.65mm, ngokuvamile isethwe ku-4/4mil; kukhona i-chip ye-BGA engu-0.5mm, ububanzi bomugqa ojwayelekile kanye nesikhala somugqa kufanele kusethwe ku-3.5/3.5mil; kukhona 0.4mm BGA Chips ngokuvamile adinga HDI design. Ngokuvamile, ngebhodlela lokuklama, ungasetha imithetho yesifunda (bheka ekupheleni kwesihloko [isofthiwe ye-AD ukuze usethe i-ROOM, isofthiwe ye-ALLEGRO ukuze usethe imithetho yesifunda]), setha ububanzi bomugqa wendawo kanye nesikhala somugqa endaweni encane, bese usetha imithetho yokuthi ezinye izingxenye ze-PCB zibe zinkulu ukuze zikhiqize. Thuthukisa izinga elifanelekile le-PCB elikhiqiziwe.

4. Idinga ukusethwa ngokuvumelana nokuminyana komklamo we-PCB. Ukuminyana kuncane futhi ibhodi lixega. Ububanzi bomugqa kanye nesikhala somugqa kungasethwa kube kukhudlwana, futhi ngokuphambene nalokho. Umjikelezo ungasethwa ngokwezinyathelo ezilandelayo:

1) 8 / 8mil, 12mil (0.3mm) ye ngembobo.

2) 6 / 6mil, 12mil (0.3mm) ye ngembobo.

3) 4 / 4mil, 8mil (0.2mm) ye ngembobo.

4) 3.5 / 3.5mil, 8mil (0.2mm) ye ngembobo.

5) 3.5 / 3.5mil, 4mil ye nge imbobo (0.1mm, laser imishini).

6) 2 / 2mil, 4mil ye nge imbobo (0.1mm, laser imishini).