1. Mutsara wechiratidzo unoda kuva impedance inofanira kuiswa zvakanyatsoenderana nehupamhi hwemutsara uye mutsara wemuganhu wakaverengwa ne stack. Semuenzaniso, redhiyo frequency chiratidzo (yakajairika 50R control), yakakosha imwe-yakaguma 50R, mutsauko 90R, musiyano 100R uye mimwe mitsetse yechiratidzo, iyo chaiyo mutsara upamhi uye mutsara mutsara unogona kuverengerwa ne stacking (inoratidzwa pazasi).

Maitiro ekuseta hupamhi hwemutsara uye mutsara wemutsara mukati PCB patani

2. Iyo yakagadzirirwa mutsara upamhi uye mutsara wemutsara unofanirwa kufunga nezvekugadzirwa kwemaitiro kugona kweiyo yakasarudzwa PCB fekitori yekugadzira. Kana hupamhi hwemutsara uye mutsara wepakati wakaiswa kuti upfuure kugona kwemugadziri wePCB panguva yekugadzira, mari yekugadzira isingakodzeri inofanirwa kuwedzerwa, uye Iyo dhizaini haigone kuburitswa. Kazhinji, hupamhi hwemutsara uye kupatsanurwa kwemutsara kunodzorwa kusvika 6/6mil mumamiriro ezvinhu akajairwa, uye iyo via hole i12mil (0.3mm). Chaizvoizvo, vanopfuura 80% yevagadziri vePCB vanogona kuigadzira, uye mutengo wekugadzira ndiwo wakaderera. Hudiki hwehupamhi hwemutsara uye kupatsanurwa kwemutsara kunodzorwa kusvika pa4/4mil, uye iyo via hole i8mil (0.2mm). Chaizvoizvo, inopfuura 70% yevagadziri vePCB vanogona kuigadzira, asi mutengo unodhura zvishoma pane yekutanga kesi, isingadhure zvakanyanya. Hudiki hwehupamhi hwemutsara uye kupatsanurwa kwemutsara kunodzorwa kusvika pa3.5/3.5mil, uye kuburikidza negomba i8mil (0.2mm). Panguva ino, vamwe vagadziri vePCB havagone kuigadzira, uye mutengo unodhura zvakanyanya. Iyo shoma mutsetse upamhi uye mutsara mutsara inodzorwa kusvika 2/2mil, uye via gomba iri 4mil (0.1mm, panguva ino, kazhinji HDI bofu akavigwa kuburikidza dhizaini, uye Laser vias zvinodiwa). Panguva ino, vazhinji vanogadzira PCB havagone kuigadzira, uye mutengo unodhura zvakanyanya. Upamhi hwemutsara uye kupatsanurwa kwemutsara pano zvinoreva saizi pakati pezvinhu zvakaita semutsetse-kuburi, mutsetse-ku-mutsetse, mutsetse-ku-pedhi, mutsetse-ku-kuburikidza, uye buri-ku-dhisiki pakuisa mitemo.

3. Isa mitemo yekufunga nezvekugadzirisa bhodhoro mufaira rekugadzira. Kana paine 1mm BGA chip, kudzika kwepini hakuna kudzika, mutsara mumwe chete wechiratidzo unodiwa pakati pemitsara miviri yepini, inogona kuiswa ku6/6 mil, kudzika kwepini kwakadzika, uye mitsara miviri yepini inodiwa. Mutsara wechiratidzo wakaiswa ku4/4mil; pane 0.65mm BGA chip, iyo inowanzoiswa ku4/4mil; pane 0.5mm BGA chip, hupamhi hwemutsara uye mutsara wemutsara unofanirwa kuiswa ku 3.5 / 3.5mil; pane 0.4mm BGA Chips kazhinji inoda HDI dhizaini. Kazhinji, kune bhodhoro rekugadzira, unogona kuseta mitemo yedunhu (ona kumagumo kwechinyorwa [AD software yekuseta ROOM, ALLEGRO software yekumisikidza mitemo yedunhu]), isa mutsara wenharaunda upamhi uye mutsara wemutsara kune diki, uye isa. mitemo yezvimwe zvikamu zvePCB kuti zvive zvakakura pakugadzirwa. Kuvandudza mwero wakakodzera wePCB inogadzirwa.

4. Inoda kuiswa maererano nehuwandu hwekugadzirwa kwePCB. Density idiki uye bhodhi rakasununguka. Uhupamhi hwemutsara uye mutsara wemutsara unogona kuiswa kuti uve mukuru, uye zvakasiyana. Iyo routine inogona kusetwa zvichienderana nematanho anotevera:

1) 8 / 8mil, 12mil (0.3mm) yepakati mugomba.

2) 6 / 6mil, 12mil (0.3mm) yepakati mugomba.

3) 4 / 4mil, 8mil (0.2mm) yepakati mugomba.

4) 3.5 / 3.5mil, 8mil (0.2mm) yepakati mugomba.

5) 3.5 / 3.5mil, 4mil yeiyo kuburikidza negomba (0.1mm, laser kuchera).

6) 2 / 2mil, 4mil yeiyo kuburikidza negomba (0.1mm, laser kuchera).