1. Umgca wesignali omele ube ne-impedance kufuneka usekwe ngokungqongqo ngokuhambelana nobubanzi bomgca kunye nomgama womgca obalwa yi-stack. Ngokomzekelo, isignali yomsakazo werediyo (ulawulo oluqhelekileyo lwe-50R), i-50R ebalulekileyo ye-single-end, i-90R eyahlukileyo, i-100R eyahlukileyo kunye neminye imigca yesignali, ububanzi obucacileyo bomgca kunye nesithuba somgca singabalwa ngokupakisha (okuchazwe ngezantsi).

Indlela yokuseta ububanzi bomgca kunye nesithuba somgca phakathi PCB uyilo

2. Ububanzi bomgca obuyiliweyo kunye nesithuba somgca kufuneka siqwalasele isakhono senkqubo yemveliso yefektri yemveliso yePCB ekhethiweyo. Ukuba ububanzi bomgca kunye nesithuba somgca simiselwe ukuba sigqithise ubuchule benkqubo yomenzi we-PCB osebenzisanayo ngexesha loyilo, iindleko zemveliso ezingeyomfuneko kufuneka zongezwe, kunye noyilo alukwazi ukuveliswa. Ngokubanzi, ububanzi bomgca kunye nezithuba zomgca zilawulwa ukuya ku-6/6mil phantsi kweemeko eziqhelekileyo, kwaye umngxuma odlulayo yi-12mil (0.3mm). Ngokusisiseko, ngaphezu kwe-80% yabavelisi bePCB banokuyivelisa, kwaye iindleko zemveliso zezona ziphantsi. Ububanzi bomgca obuncinane kunye nesithuba somgca silawulwa ukuya ku-4/4mil, kwaye umngxuma odlulayo yi-8mil (0.2mm). Ngokusisiseko, ngaphezu kwe-70% yabavelisi bePCB banokuyivelisa, kodwa ixabiso libiza kakhulu kunemeko yokuqala, alibizi kakhulu. Ubuncinane bobubanzi bomgca kunye nesithuba somgca silawulwa ukuya ku-3.5/3.5mil, kwaye umngxuma odlulayo yi-8mil (0.2mm). Ngeli xesha, abanye abavelisi bePCB abakwazi ukuyivelisa, kwaye ixabiso liya kuba likhulu. Ubuncinci bobubanzi bomgca kunye nesithuba somgca silawulwa ukuya ku-2/2mil, kwaye umngxuma odlulayo yi-4mil (0.1mm, ngeli xesha, ngokuqhelekileyo yi-HDI eyimfama engcwatywe ngokuyila, kwaye i-laser vias iyafuneka). Ngeli xesha, abavelisi abaninzi bePCB abakwazi ukuyivelisa, kwaye ixabiso lelona libiza kakhulu. Ububanzi bomgca kunye nesithuba somgca apha sibhekisa kubungakanani phakathi kwezinto ezifana nomgca ukuya kumngxunya, umgca ukuya kumgca, umgca ukuya kwiphedi, umgca-ukuya-udlula, kunye nomngxuma ukuya kwidiski xa umisela imithetho.

3. Misela imithetho yokuqwalasela i-bottleneck yoyilo kwifayile yoyilo. Ukuba kukho i-chip ye-1mm ye-BGA, ubunzulu be-pin bunzulu, kufuneka umgca wesignali omnye kuphela phakathi kwemiqolo emibini yezikhonkwane, enokuthi ibekwe kwi-6/6 mil, ubunzulu be-pin bunzulu, kwaye kufuneka imiqolo emibini yezikhonkwane. Umgca wesignali usethelwe kwi-4/4mil; kukho itshiphu ye-0.65mm ye-BGA, ebekwe ngokubanzi kwi-4/4mil; kukho itshiphu ye-0.5mm ye-BGA, ububanzi bomgca jikelele kunye nesithuba somgca kufuneka sibekwe kwi-3.5 / 3.5mil; kukho 0.4mm BGA Chips ngokubanzi zifuna uyilo HDI. Ngokubanzi, kwi-bottleneck yoyilo, unokuseta imithetho yengingqi (jonga isiphelo senqaku [isoftware ye-AD ukuseta i-ROOM, isoftware ye-ALLEGRO ukuseta imithetho yengingqi]), seta ububanzi bomgca wendawo kunye nesithuba somgca kwindawo encinci, kwaye usete. imithetho kwezinye iindawo PCB ukuba nkulu kwimveliso. Ukuphucula izinga elifanelekileyo le-PCB eveliswayo.

4. Kufuneka imiselwe ngokobuninzi boyilo lwePCB. Ubuninzi buncinci kwaye ibhodi ikhululekile. Ububanzi bomgca kunye nezithuba zomgca zingasetwa ukuba zibe zikhulu, kwaye ngokuphambene. Inkqubo inokumiselwa ngokwala manyathelo alandelayo:

1) 8 / 8mil, 12mil (0.3mm) ngokuba nge umngxuma.

2) 6 / 6mil, 12mil (0.3mm) ngokuba nge umngxuma.

3) 4 / 4mil, 8mil (0.2mm) ngokuba nge umngxuma.

4) 3.5 / 3.5mil, 8mil (0.2mm) ngokuba nge umngxuma.

5) 3.5 / 3.5mil, 4mil nge nge umngxuma (0.1mm, laser ukubhola).

6) 2 / 2mil, 4mil nge nge umngxuma (0.1mm, laser ukubhola).