1. Ya kamata a saita layin siginar da ke buƙatar zama impedance daidai da faɗin layin da nisan layin da aka lissafta ta tari. Misali, siginar mitar rediyo (masu sarrafa 50R na yau da kullun), 50R mai mahimmanci guda ɗaya mai ƙarewa, 90R daban-daban, 100R daban-daban da sauran layin sigina, ƙayyadaddun faɗin layi da tazarar layi ana iya ƙididdige su ta hanyar stacking (hoton ƙasa).

Yadda ake saita faɗin layi da tazarar layi a ciki PCB zane

2. The tsara line nisa da line tazara ya kamata la’akari da samar da damar iya aiki na PCB samarwa factory. Idan an saita faɗin layin da tazarar layi don ƙetare ikon aiwatar da masana’antun PCB masu haɗin gwiwa yayin ƙira, ana buƙatar ƙara farashin samarwa da ba dole ba, kuma ƙirar ba za a iya samar da ita ba. Gabaɗaya, faɗin layin da tazarar layi ana sarrafa su zuwa 6/6mil a ƙarƙashin yanayi na al’ada, kuma ta hanyar rami shine 12mil (0.3mm). Ainihin, fiye da 80% na masana’antun PCB na iya samar da shi, kuma farashin samarwa shine mafi ƙasƙanci. Ana sarrafa mafi ƙarancin faɗin layi da tazarar layi zuwa 4/4mil, kuma ta rami shine 8mil (0.2mm). Ainihin, fiye da 70% na masana’antun PCB na iya samar da shi, amma farashin ya ɗan fi tsada fiye da na farko, ba tsada sosai ba. Ana sarrafa mafi ƙarancin faɗin layi da tazarar layi zuwa 3.5/3.5mil, kuma ta rami shine 8mil (0.2mm). A wannan lokacin, wasu masana’antun PCB ba za su iya samar da shi ba, kuma farashin zai fi tsada. Ana sarrafa mafi ƙarancin faɗin layi da tazarar layi zuwa 2/2mil, kuma ta hanyar rami shine 4mil (0.1mm, a wannan lokacin, gabaɗaya HDI makafi ne binne ta hanyar ƙira, kuma ana buƙatar laser vias). A wannan lokacin, yawancin masana’antun PCB ba za su iya samar da shi ba, kuma farashin ya fi tsada. Faɗin layi da tazarar layi anan suna nufin girman tsakanin abubuwa kamar layi-zuwa-rami, layi-zuwa-layi, layi-zuwa-pad, layi-zuwa-via, da rami-zuwa-faifai lokacin saita dokoki.

3. Sanya dokoki don yin la’akari da ƙirar ƙira a cikin fayil ɗin ƙira. Idan akwai guntu BGA 1mm, zurfin fil ɗin ba shi da zurfi, ana buƙatar layin sigina ɗaya kawai tsakanin layuka biyu na fil, wanda za’a iya saita shi zuwa mil 6/6, zurfin fil ya fi zurfi, kuma ana buƙatar layuka biyu na fil. An saita layin siginar zuwa 4/4mil; akwai guntu BGA 0.65mm, wanda gabaɗaya an saita shi zuwa 4/4mil; akwai guntu BGA 0.5mm, faɗin layin gabaɗaya da tazarar layi dole ne a saita zuwa 3.5/3.5mil; akwai Chips BGA 0.4mm gabaɗaya suna buƙatar ƙirar HDI. Gabaɗaya, don ƙaƙƙarfan ƙira, zaku iya saita ƙa’idodin yanki (duba ƙarshen labarin [ software na AD don saita daki, software na ALLEGRO don saita ƙa’idodin yanki]), saita faɗin layin gida da tazarar layi zuwa ƙaramin wuri, sannan saita shi. Dokokin ga sauran sassan PCB su zama mafi girma don samarwa. Haɓaka ƙimar ƙimar PCB da aka samar.

4. Yana buƙatar saita shi gwargwadon girman ƙirar PCB. Yawan yawa ya fi ƙanƙanta kuma allon ya fi sauƙi. Za a iya saita faɗin layin da tazarar layi don zama mafi girma, kuma akasin haka. Ana iya saita tsarin yau da kullun bisa ga matakai masu zuwa:

1) 8/8mil, 12mil (0.3mm) don rami.

2) 6/6mil, 12mil (0.3mm) don rami.

3) 4/4mil, 8mil (0.2mm) don rami.

4) 3.5/3.5mil, 8mil (0.2mm) don rami.

5) 3.5/3.5mil, 4mil don ta rami (0.1mm, hakowa laser).

6) 2/2mil, 4mil don ta rami (0.1mm, hakowa laser).