O le PCB o se vaega taua o mea faʻaonaponei faʻaonaponei ma le ave o fesoʻotaʻiga eletise o vaega eletise. With the continuous development of electronic technology, the density of PCB is getting higher and higher, so there are more and more requirements for welding process. Therefore, it is necessary to analyze and judge the factors affecting PCB welding quality and find out the causes of welding defects, so as to make targeted improvement and improve the overall quality of Laupapa PCB. Sei o tatou vaʻavaʻai i le mafuaʻaga o maopoopo faʻaletonu luga PCB laupapa.

Aisea PCB welds i ai faaletonu?

Mafuaʻaga o le matagaluega laupapa maopoopo faʻaletonu o:

1. O le weldability o le matagaluega laupapa matagaluega aafia ai le lelei maopoopo

O le pu weldability o matagaluega laupapa e le lelei, o le a maua ai tafaʻilagi maopoopo faʻaletonu, aafia ai le tapulaʻa o vaega i le matagaluega, taʻitaʻia ai i le le mautu o le multilayer laupapa vaega ma conduction laina totonu, mafua ai le le manuia o le atoa matagaluega galuega.

Yuan Kunzhi fale gaosimea ua tuuto atu i le tuʻuina atu i tagata faʻatau ma le tasi-taofi vaega eletise i luga o le upega tafaʻilagi tautua, faʻatauina atu le faitau afe o eletise vaega faʻatauina, tau suʻesuʻe ma fefaʻatauaiga, ia mautinoa o vaega uma e mai le uluaʻi fale gaosi poʻo soʻoga masani auala e mautinoa ai o le muamua moni, o le lotoifale polofesa eletise vaega vaega faʻatauina ‘upega tafaʻilagi

O le autu mafuaʻaga aafia ai le solderability o lolomi laupapa matagaluega o:

(1) o le tuufaatasiga o le solder ma le natura o le solder. Solder o se taua vaega o uelo vailaʻau togafitiga togafitiga, e aofia ai vailaʻau mea o loʻo i ai fluks, masani faʻaaogaina maualalo liusuavai liusuavai uʻamea o Sn-Pb po o Sn-Pb-Ag. O mea o loʻo le mama e tatau ona taofiofia e puipuia ai le oxide gaosia e le mama mai le faʻamaʻapeina e flux. O le gaioiga o flx o le fesoasoani i le solder faʻasusu le faʻataʻamilosaga luga o le soldered ipu e ala i le fesiitaʻia o le vevela ma aveʻese le ele. White rosin ma isopropyl ‘ava malosi e masani ona faʻaaogaina.

(2) ueloina vevela ma uʻamea ipu luga mama o le a aʻafia ai foi weldability. O le vevela e maualuga tele, o le solder diffusion saosaoa ua faʻatelevaveina, i lenei taimi ua i ai se maualuga tele gaioiga, o le a faia le matagaluega laupapa ma solder liusuavai luga faʻavavevave faʻamalosiʻau, maopoopo faʻaletonu, matagaluega laupapa faʻalapotopotoga luga o le a afaina ai foi le weldability e gaosia faaletonu, e aofia ai apa lopa, apa polo, matala taamilosaga, susulu e le lelei.

2. Faʻamau faʻaletonu mafua mai i le femalagaaʻi

Circuit laupapa ma vaega warped i le taimi uelo, mafua ai i faaletonu e pei o tafailagi uelo ma puʻupuʻu ala ona o le faʻaletonu o le mafaufau. Warping e masani ona mafua mai i le vevela le paleni i le va o le pito i luga ma lalo vaega o le matagaluega laupapa. Mo lapoʻa PCBS, taua e tupu foi pe a pa’ū le laupapa i lalo o lona lava mamafa. Masini masani PBGA e tusa ma le 0.5mm le mamao mai le lolomi laupapa laupapa. Afai o vaega i luga o le matagaluega laupapa e tele, o le soʻoga soʻoga o le a i lalo o le mafatiaga mo se taimi umi a o le matagaluega laupapa toe foi i lona masani foliga pe a maeʻa faʻamalulu. Afai e siʻitia le vaega e le 0.1mm, o le a lava e mafua ai le tafaoga faʻamasani tatalaina matagaluega.

3. The design of the circuit board affects the welding quality

I le faʻatulagaina, o le lapoʻa o le matagaluega laupapa e tele tele, e ui lava o le uʻamea e faigofie ona faʻatonutonu, ae o le lolomiga laina e umi, o le impedance faʻateleina, o le tetee-leo gafatia faʻaititia, o le tau faʻateleina; Laʻititi, o le vevela dissipation faʻaititia, uelo e le faigofie ona faʻatonutonu, faigofie e foliga mai laina vavalalata faʻalavelave le tasi i le isi, pei o le electromagnetic faʻalavelaveina o le matagaluega laupapa. O le mea lea, PCB laupapa mamanu e tatau ona faʻaleleia:

(1) Faʻapuupuuina le fesoʻotaʻiga i le va o vaega maualuga-taimi ma faʻaititia EMI faʻalavelave.

(2) Vaega ma le mamafa tele (pei o le sili atu nai lo 20g) tatau ona faʻaleleia ma le lagolago ona ueloina lea.

(3) O le faʻamamaina o le vevela o elemeni faʻavevela e tatau ona mafaufauina e puipuia ai le lapoʻa o le δ T i luga ma toe faʻafouina, ma o mea vevela maaleale e tatau ona taofia ese mai mea faʻavevela.

(4) Le faʻatulagaina o vaega e tutusa ma mafai, ina ia le gata matagofie ma faigofie ona uʻamea, talafeagai mo vaega tele gaosiga. 4∶3 sikuea faatafafa laupapa faʻafanua e sili ona lelei. Aua le suia mutia uaea e aloese ai discontinuities i uaea. Afai e vevela le laupapa matagaluega mo se taimi umi, e faigofie ona faʻalautele ma paʻu ese le pepa alumini apamemea. O le mea lea, lapoʻa apamemea foil tatau ona aloese mai.

I le aotelega, ina ia mautinoa le aotelega tulaga lelei o le laupapa PCB, e tatau ona faʻaaoga sili ona lelei solder, faʻaleleia le solderability o PCB laupapa, ma puipuia warping e puipuia faʻaletonu i le gaosiga gaioiga.