I-PCB iyingxenye ebaluleke kakhulu ye-elekthronikhi yanamuhla kanye nesithwali soxhumano lukagesi lwezinto zikagesi. With the continuous development of electronic technology, the density of PCB is getting higher and higher, so there are more and more requirements for welding process. Therefore, it is necessary to analyze and judge the factors affecting PCB welding quality and find out the causes of welding defects, so as to make targeted improvement and improve the overall quality of PCB ibhodi. Ake sibheke izimbangela zezinkinga zokushisela ebhodini le-PCB.

Kungani PCB welds babe ukukhubazeka?

Izimbangela zokukhubazeka kwe-welding board yizi:

1. Ukushiswa komgodi webhodi lesifunda kuthinta ikhwalithi yokushisela

I-hole weldability yebhodi lesifunda ayilungile, izokhiqiza amaphutha we-welding virtual, ithinte imingcele yezingxenye kumjikelezo, iholele ekungazinzini kwezingxenye zebhodi le-multilayer kanye nokuqhutshwa komugqa wangaphakathi, kubangele ukwehluleka komsebenzi wonke wesifunda.

Ifektri yokukhiqiza yakwaYuan Kunzhi izibophezele ekunikezeni amakhasimende ngezinsiza zokuthengwa kwempahla ezenziwa nge-inthanethi okukodwa, ukuhlinzeka ngezinkulungwane zezinto zokuthengwa kwe-elekthronikhi, uphenyo lwentengo nokuhweba, ukuqinisekisa ukuthi zonke izingxenye zivela efektri yasekuqaleni noma iziteshi zamajenti ezijwayelekile ukuqinisekisa ukuthi okwangempela iyiqiniso, iwebhusayithi yokuthenga yezingxenye ze-elekthronikhi yasekhaya

Izici eziyinhloko ezithinta ukuthengiswa kwamabhodi esekethe aphrintiwe yilezi:

(1) ukwakheka kwe-solder kanye nemvelo ye-solder. I-Solder iyingxenye ebalulekile yenqubo yokwelashwa kwamakhemikhali e-welding, yakhiwe ngezinto zamakhemikhali eziqukethe ukugeleza, okuvame ukusetshenziswa endaweni encibilikayo ephansi yensimbi ye-eutectic i-Sn-Pb noma i-Sn-Pb-Ag. Okuqukethwe kokungcola kufanele kulawulwe ukuvimbela i-oxide ekhiqizwa ukungcola ekuqothulweni yi-flux. Umsebenzi we-flux ukusiza i-solder imanzise ubuso besifunda sepuleti elithengisiwe ngokudlulisa ukushisa nokususa ukugqwala. Kusetshenziswa i-rosin emhlophe kanye ne-isopropyl alcohol.

(2) Ukushisa kwe-welding nensimbi yensimbi ebusweni inhlanzeko izophazamisa ukuthambeka. Izinga lokushisa liphezulu kakhulu, ijubane le-solder diffusion liyasheshiswa, ngalesi sikhathi linomsebenzi ophakeme kakhulu, lizokwenza ibhodi lesifunda ne-solder inyibilike ngokushesha i-oxidation, ukukhubazeka kwe-welding, ukungcola kwebhodi lesifunda kuzophazamisa ukutholakala kokukhiqiza ukukhubazeka, kufaka phakathi ubuhlalu bethini, amabhola kathayela, isekethe evulekile, isicwebezelisi asisihle.

2. Welding amaphutha okubangelwa warping

Amabhodi wesifunda kanye nezingxenye ezisontekile ngesikhathi sokushisela, okuholela ekushiyekeni okufana nokushisela okubonakalayo kanye nokujikeleza okufushane ngenxa yokuguqulwa kwengcindezi. I-Warping ivame ukubangelwa ukungalingani kwamazinga okushisa phakathi kwezingxenye ezingenhla nezingezansi zebhodi lesifunda. Ku-PCBS enkulu, i-warping iyenzeka futhi lapho ibhodi liwela ngaphansi kwesisindo salo. Amadivayisi ajwayelekile e-PBGA cishe angama-0.5mm kude nebhodi lesifunda eliphrintiwe. Uma izingxenye zebhodi lesifunda zikhulu, ijoyini le-solder lizoba ngaphansi kwengcindezi isikhathi eside njengoba ibhodi lesifunda libuyela esimeni salo esijwayelekile ngemuva kokupholisa. Uma ingxenye iphakanyiswe ngo-0.1mm, izokwanela ukubangela ukuvuleka kwesekethe ye-welding ebonakalayo.

3. The design of the circuit board affects the welding quality

Ekuhlelweni, ubukhulu bebhodi lesifunda bukhulu kakhulu, yize i-welding kulula ukuyilawula, kepha ulayini wokuphrinta mude, impedance iyanda, ikhono lokulwa nomsindo liyancipha, izindleko ziyanda; Kuncane kakhulu, ukushabalalisa ukushisa kuyehla, i-welding akulula ukuyilawula, kulula ukuvela imigqa eseduze iyaphazamisana, njengokuphazanyiswa kwamandla kagesi webhodi lesifunda. Ngakho-ke, ukwakhiwa kwebhodi le-PCB kufanele kwenziwe kahle:

(1) Fushanisa ukuxhumana phakathi kwezakhi ezinemvamisa ephezulu futhi unciphise ukuphazamiseka kwe-EMI.

(2) Izinto ezinesisindo esikhulu (ezinjengama-20g ngaphezulu) kufanele zilungiswe ngokusekelwa bese zishiselwe.

(3) Ukuhlakazeka kokushisa kwezinto zokufudumeza kufanele kubhekwe ukuvimbela ukukhubazeka okungaphezulu kwe-T nokusebenza kabusha, futhi izinto ezizwelayo zokushisa kufanele zigcinwe kude nemithombo yokushisa.

(4) Ukuhlelwa kwezinto ngokufana ngangokunokwenzeka, ukuze kungabi kuhle kuphela futhi kube lula ukuwelda, kufanelekile ukukhiqizwa ngobuningi. Umklamo webhodi lesifunda elingunxande ongu-4∶ ungcono kakhulu. Ungashintshi ububanzi bezintambo ukugwema ukuyekiswa kwezintambo. Lapho ibhodi lesifunda lishisa isikhathi eside, i-foil yethusi kulula ukunweba nokuwa. Ngakho-ke, ucwecwe omkhulu wethusi kufanele ugwenywe.

Ngokufingqa, ukuze kuqinisekiswe ikhwalithi ephelele yebhodi le-PCB, kubalulekile ukusebenzisa i-solder enhle kakhulu, ukuthuthukisa ukuthengiswa kwebhodi le-PCB, nokuvimbela ukugoba ukuvimbela ukukhubazeka enqubweni yokukhiqiza.