I-PCB yinxalenye ebalulekileyo yeelektroniki zale mihla kunye nomphathi woqhagamshelo lombane lwezinto zombane. With the continuous development of electronic technology, the density of PCB is getting higher and higher, so there are more and more requirements for welding process. Therefore, it is necessary to analyze and judge the factors affecting PCB welding quality and find out the causes of welding defects, so as to make targeted improvement and improve the overall quality of Ibhodi PCB. Makhe sijonge oonobangela welding iziphene kwibhodi PCB.

Kutheni PCB welds kufuneka iziphene?

Izinto ezibangela iziphene zokuwelda kwibhodi yesekethe zezi:

1. I-weldability yomngxuma webhodi yesekethe ichaphazela umgangatho we-welding

Umngxunya we welding webhodi yesekethe ayilunganga, iya kuvelisa iintsilelo ze-welding, ichaphazele iiparameter zezinto kwisekethe, zikhokelele ekungazinzini kwezinto zebhodi ye-multilayer kunye nokuqhutywa komgca wangaphakathi, kubangele ukusilela kwawo wonke umsebenzi wesekethe.

Umzi mveliso we Yuan Kunzhi uzibophelele ekunikezeleni abathengi ngeenkonzo zokuthenga ezenziwa ngekhompyuter kwindawo enye, ukubonelela ngamawaka ezinto zokuthengwa kwe-elektroniki, ukubuza ngexabiso kunye nokuthengisa, ukuqinisekisa ukuba onke amacandelo avela kumzi mveliso wokuqala okanye iiarhente amajelo aqhelekileyo okuqinisekisa ukuba eyentsusa eyiyo, ziziko lokuthenga izinto zeekhompyuter zobuchwephesha basekhaya

Izinto eziphambili ezichaphazela ukuthengiswa kweebhodi zesekethe eziprintiweyo zezi:

(1) ukwakhiwa kwe-solder kunye nohlobo lwe-solder. I-Solder yinxalenye ebalulekileyo yenkqubo yokwenziwa kweekhemikhali yonyango, yenziwe ngezinto zeekhemikhali eziqulethe ukuhambisa, okusetyenziswa ngokunyibilikayo kwinqanaba le-eutectic yentsimbi yi-Sn-Pb okanye i-Sn-Pb-Ag. Umxholo wokungcola kufuneka ulawulwe ukukhusela i-oxide eveliswa ngokungcola ukuba inyibilikiswe yi-flux. Umsebenzi we-flux kukunceda i-solder imanzise i-solder surface ye-soldered plate ngokuhambisa ubushushu kunye nokususa umhlwa. I-rosin emhlophe kunye ne-isopropyl alcohol isetyenziswa ngokubanzi.

(2) Ubushushu be-welding kunye nepleyiti yentsimbi ukucoceka komphezulu kuya kuchaphazela ukuwelda. Iqondo lobushushu liphezulu kakhulu, isantya sokusasaza kwe-solder siyakhawuleziswa, ngeli xesha linomsebenzi ophakamileyo kakhulu, uya kwenza ibhodi yesekethe kunye ne-solder inyibilike umphezulu ngokukhawuleza i-oxidation, iziphene ze-welding, ungcoliseko lomgangatho webhodi yesekethe iya kuchaphazela ukungabinakho ukuvelisa iziphene, kubandakanya amaso e-tin, iibhola ze-tin, isekethe evulekileyo, i-gloss ayilunganga.

2. Iziphene ze-Welding ezibangelwa yi-warping

Iibhodi zesekethe kunye namacandelo ajijekileyo ngexesha le-welding, ekhokelela kwiziphene ezifana ne-welding ebonakalayo kunye nesekethe emfutshane ngenxa yoxinzelelo loxinzelelo. Ukujijisana kuhlala kubangelwa kukungalingani kobushushu phakathi kwamacandelo aphezulu nasezantsi kwibhodi yesekethe. Kwi-PCBS enkulu, i-warping iyenzeka kwakhona xa ibhodi iwela phantsi kobunzima bayo. Izixhobo zePBGA eziqhelekileyo zimalunga ne-0.5mm kude nebhodi yesekethe eprintiweyo. Ukuba amacandelo ebhodini yesiphaluka makhulu, i-solder joint iya kuba phantsi koxinzelelo ixesha elide njengoko ibhodi yesiphaluka ibuyela kwimo yayo eqhelekileyo emva kokupholisa. Ukuba icandelo liphakanyiswe nge-0.1mm, kuya kwanela ukubangela ukujikeleza okuvulekileyo kwesekethe.

3. The design of the circuit board affects the welding quality

Kubeko, ubungakanani bebhodi yesekethe inkulu kakhulu, nangona iwelding kulula ukuyilawula, kodwa umgca wokuprinta mde, ukunyuka kwemithambo kuyenyuka, amandla okulwa nengxolo ayancipha, ukunyuka kweendleko; Incinci kakhulu, ukutshatyalaliswa kobushushu kuyancipha, ukuwelda akukho lula ukulawula, kulula ukubonakala imigca emeleneyo iphazamisana, njengokuphazamiseka kwe-electromagnetic yebhodi yesekethe. Ke ngoko, uyilo lwebhodi yePCB kufuneka luphuculwe:

(1) Ukunciphisa uxhulumaniso phakathi kwamacandelo aphezulu-frequency kunye nokunciphisa ukuphazamiseka kwe-EMI.

(2) Izixhobo ezinobunzima obukhulu (ezinje ngaphezu kwe-20g) kufuneka zilungiswe kunye nenkxaso kwaye zidibanise.

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4 Uyilo lwebhodi yesekethe engunxantathu eyi-4 yeyona ilungileyo. Musa ukuguqula ububanzi bocingo ukunqanda ukungaqhubeki kwiingcingo. Xa ibhodi yesekethe ishushu ixesha elide, ifoyile yobhedu kulula ukuyandisa nokuwa. Ke ngoko, ifoyile enkulu yobhedu kufuneka ithintelwe.

Isishwankathelo, ukuze kuqinisekiswe umgangatho uwonke webhodi PCB, kuyimfuneko ukusebenzisa solder ebalaseleyo, ukuphucula solderability yebhodi PCB, nokuthintela warping ukuthintela iziphene kwinkqubo yemveliso.