Xa uyila PCB iipads kuyilo lwebhodi ye-PCB, kubalulekile ukuyila ngokungqongqo ngokweemfuno ezifanelekileyo kunye nemigangatho. Ngenxa yokuba uyilo lwepcb lubaluleke kakhulu ekusetyenzisweni kwe-SMT, uyilo lwephedi luyakuchaphazela ngokuthe ngqo ukuqiniswa, uzinzo kunye nokudluliswa kobushushu kwezinto, ezinxulumene nomgangatho wokuqhubekeka kwe-SMT, ke uthini umgangatho woyilo lwe-PCB pad?

Uyilo oluqhelekileyo lobume kunye nobungakanani bephedi yePCB:

1. Tsalela umnxeba ilayibrari yokupakisha esemgangathweni.

2, ubuncinci bephedi enye yecala elinye abukho ngaphantsi kwe-0.25mm, ubukhulu bepali yonke ayisiyiyo ngaphezulu kwamaxesha ama-3 ukuvula kwecandelo.

3. Zama ukuqinisekisa ukuba umgama phakathi kwemiphetho yeepads ezimbini mkhulu kune-0.4mm.

4. Iipads ezinobubanzi obungaphezulu kwe-1.2mm okanye i-3.0mm ziya kuyilwa njengedayimani okanye iiplamu

5. Kwimeko ye-wiring eshinyeneyo, iipleyiti ze-oval kunye ne-oblong zokudibanisa ziyacetyiswa. Ububanzi okanye ubuncinci bobubanzi bepaneli enye yeepaneli yi-1.6mm; Iphaneli ephindwe kabini yomtya okhoyo ngoku ifuna kuphela ububanzi bomngxunya kunye ne-0.5mm, iphedi enkulu kakhulu kulula ukuba ibangele ukuwelda okuqhubekayo ngokungeyomfuneko.

Ezimbini, iphedi yePCB ngokulingana komgangatho womngxuma:

Umngxunya wangaphakathi wephedi ngokubanzi awukho ngaphantsi kwe-0.6mm, kuba akukho lula ukuqhubekeka xa umngxunya ungaphantsi kwe-0.6mm. Ngokwesiqhelo, ubukhulu bepini yentsimbi kunye ne-0.2mm isetyenziswa njengendawo engaphakathi emngxunyeni wephedi. Ukuba ubukhulu bepini yensimbi yokuxhathisa yi-0.5mm, ububanzi bomngxunya ongaphakathi wephedi yi-0.7mm, kwaye ububanzi bephedi buxhomekeke kububanzi bomngxunya ongaphakathi.

Amanqaku aphambili kuyilo lokuthembeka kwephedi yePCB

1. Ulingano macala, ukuze kuqinisekiswe ukuba uxinizelelo lomgangatho we-solder etyhidiweyo, omabini amacala ephedi kufuneka alingane.

2. Isithuba phakathi kwephedi, isithuba seephedi sikhulu kakhulu okanye sincinci kakhulu siya kubangela iziphene ze-welding, ke qiniseka ukuba icandelo liyaphela okanye izikhonkwane zishiyane ngokufanelekileyo kwiphedi.

3. Intsalela yobukhulu bephedi. Ubungakanani obuyintsalela yokuphela kwecandelo okanye i-pin emva kwesithuba kunye nephedi kufuneka kuqinisekiswe ukuba indibaniselwano ye-solder inokwenza umphezulu we-meniscus.

4. Ububanzi bephedi kufuneka ngokulinganayo bulingane nobubanzi becandelo okanye ipini.

Uyilo lwepcb oluchanekileyo, ukuba kukho inani elincinci le-skew ngexesha le-SMT machining, linokulungiswa ngexesha lokufakelwa kwakhona kwe-welding ngenxa yokuxinana komphezulu we-solder etyhidiweyo. Ukuba uyilo pad PCB ayichanekanga, nokuba indawo obandayo ichanekile kakhulu, kulula ukuba ukuvela ukuphambuka indawo icandelo, ibhulorho ukunqunyanyiswa kunye nezinye iziphene welding emva reflow iwelding. Ngoko ke, uyilo pad PCB kufuneka ihlawulwe xa kuyilwa PCB.