Lapho kuklanywa PCB pads ekwakhiweni kwebhodi le-PCB, kubalulekile ukuklama ngokuqinile ngokuya ngezidingo namazinga afanele. Ngoba idizayini ye-PCB pad ibaluleke kakhulu ekusetshenzisweni kwe-SMT, ukwakheka kwephedi kuzothinta ngqo ukungabi namandla, ukuzinza nokudluliswa kokushisa kwezingxenye, okuhlobene nekhwalithi yokucubungula kwe-SMT, ngakho-ke liyini idizayini ye-PCB pad?

Design ejwayelekile ukuma nosayizi PCB pad:

1. Shayela umtapo wolwazi wokupakisha ojwayelekile we-PCB.

2, i-pad eyodwa ye-unilateral pad ayikho ngaphansi kwe-0.25mm, ubukhulu obukhulu bephedi yonke abukho ngaphezu kwezikhathi ezi-3 ukuvula kwento.

3. Zama ukuqinisekisa ukuthi ibanga phakathi kwemiphetho yamaphakethe amabili likhulu kune-0.4mm.

4. Amapayipi anobubanzi obudlula i-1.2mm noma i-3.0mm kufanele aklanywe njengamadayimane noma ama-plum pads

5. Esimweni sokuxhuma izintambo, amapuleti okuxhuma ama-oval nama-oblong anconyiwe. Ububanzi noma ububanzi obuncane bephaneli elilodwa le-1.6mm; Iphaneli ephindwe kabili yomugqa wamanje obuthakathaka udinga kuphela umgodi wobubanzi kanye no-0.5mm, iphedi enkulu kakhulu kulula ukudala insimbi eqhubekayo engadingekile.

Ababili, PCB pad ngokusebenzisa usayizi imbobo ejwayelekile:

Umgodi wangaphakathi wephedi ngokuvamile awukho ngaphansi kuka-0.6mm, ngoba akulula ukucubungula lapho umgodi ungaphansi kuka-0.6mm. Imvamisa, ububanzi bepini yensimbi kanye no-0.2mm busetshenziswa njengobubanzi bomgodi wangaphakathi wephedi. Uma ubukhulu bepini yensimbi bokumelana bungu-0.5mm, ububanzi bomgodi wangaphakathi wephedi ngu-0.7mm, nobubanzi bephedi buxhomeke kububanzi bomgodi wangaphakathi.

Amaphuzu abalulekile wokwethenjelwa kokuklanywa kwe-PCB pad

1.Ukulinganisa, ukuze kuqinisekiswe ukuthi ibhalansi yokungezwani kobuso be-solder encibilikisiwe, yomibili imikhawulo yephedi kumele ilingane.

2. Isikhala sephedi, isikhala sephedi sikhulu kakhulu noma sincane kakhulu sizobangela ukukhubazeka kwe-welding, ngakho-ke qiniseka ukuthi ingxenye iyaphela noma izikhonkwane zihlukaniswe kahle kuphedi.

3. Usayizi osalayo wephedi. Usayizi oyinsalela wokuphela kwengxenye noma iphini ngemuva kwephiko nephedi kumele kuqinisekise ukuthi ukuhlangana kwe-solder kungakha indawo ye-meniscus.

4. Ububanzi bephedi kufanele ngokulinganayo bulingane nobubanzi bengxenye yento noma iphini.

Idizayini efanelekile ye-PCB pad, uma kunenani elincane le-skew ngesikhathi semishini ye-SMT, ingalungiswa ngesikhathi sokushisela kabusha kwe-welding ngenxa yokuphakama komhlaba kwe-solder encibilikisiwe. Uma ukwakheka kwephedi ye-PCB kungalungile, noma ngabe isikhundla esikhulayo sinembile kakhulu, kulula ukuvela ukuphambuka kwesikhundla, ukumiswa kwebhuloho nokunye ukukhubazeka kwe-welding ngemuva kokufaka kabusha i-welding. Ngakho-ke, PCB pad design kufanele sinakwe lapho ukuklama PCB.