We guarantee value for money through material specifications and quality control. Our quality control standards are much stricter than those of other suppliers, and ensure that our products can give full play to the expected performance.

Even if there is no difference at first sight, high-quality products will eventually be worth more

It is through the surface that we see the differences, which are crucial to the durability and function of PCB in the whole life. Customers do not always see these differences, but they can rest assured that the supplied PCBs meet the most stringent quality standards.

Whether in the manufacturing and assembly process or in practical use, PCB should have reliable performance, which is very important. In addition to relevant costs, defects in the assembly process may be brought into the final product by PCB, and faults may occur in the actual use process, resulting in claims. Therefore, from this point of view, it is not too much to say that the cost of a high-quality PCB is negligible.

In all market segments, especially those producing products in key application areas, the consequences of such failures are unimaginable.

These aspects should be kept in mind when comparing PCB prices. Although the initial cost of reliable, guaranteed and long-life products is high, they are worth it in the long run.

PCB specification exceeds IPC class 2 requirements

High reliability circuit board – 14 most important features selected from 103 features

1. 25 micron hole wall copper thickness

benefit

Enhanced reliability, including improved expansion resistance of the z-axis.

Risk of not doing so

Electrical connectivity problems during hole blowing or degassing, assembly (inner layer separation, hole wall fracture), or faults may occur under load conditions during actual use. IPC class 2 (the standard adopted by most factories) requires 20% less copper plating.

2. No welding repair or open circuit repair

benefit

Perfect circuit can ensure reliability and safety, no maintenance and no risk

Risk of not doing so

If not repaired properly, the circuit board will be open circuit. Even if the repair is’ proper ‘, there is a risk of failure under load conditions (vibration, etc.), which may occur in actual use.

3. Exceeding the cleanliness requirements of IPC specifications

benefit

Improving PCB cleanliness can improve reliability.

Risk of not doing so

The residue and solder accumulation on the circuit board will bring risks to the anti welding layer, and the ion residue will lead to the risk of corrosion and pollution on the welding surface, which may lead to reliability problems (bad solder joint / electrical failure), and finally increase the probability of actual failure.

4. Strictly control the service life of each surface treatment

benefit

Solderability, reliability, and reduce the risk of moisture intrusion

Risk of not doing so

Due to metallographic changes in the surface treatment of old circuit boards, solder problems may occur, and moisture intrusion may lead to delamination, inner layer and hole wall separation (open circuit) in the assembly process and / or actual use.

5. Use internationally known substrates – do not use “local” or unknown brands

benefit

Improve reliability and known performance

Risk of not doing so

Poor mechanical performance means that the circuit board cannot perform as expected under assembly conditions. For example, high expansion performance will lead to delamination, open circuit and warpage. The weakening of electrical characteristics can lead to poor impedance performance.

6. The tolerance of copper clad laminate shall meet the requirements of ipc4101 class B / L

benefit

Strictly controlling the thickness of dielectric layer can reduce the deviation of expected value of electrical performance.

Risk of not doing so

The electrical performance may not meet the specified requirements, and there will be great differences in output / performance of the same batch of components.

7. Define solder resist materials to ensure compliance with ipc-sm-840 class T requirements

benefit

Recognize “excellent” ink, realize ink safety, and ensure that solder resist ink meets UL standards.

Risk of not doing so

Poor quality inks can cause adhesion, flux resistance and hardness problems. All these problems will lead to the separation of the solder resist from the circuit board and eventually lead to copper circuit corrosion. Poor insulation characteristics can cause short circuits due to unexpected electrical connectivity / arcing.

8. Define tolerances for shapes, holes and other mechanical features

benefit

Strict tolerance control can improve the dimensional quality of products – improve fit, shape and function

Risk of not doing so

Problems during assembly, such as alignment / fit (the problem of press fit needle will be found only after assembly is completed). In addition, there will be problems in mounting the base due to the increase of dimensional deviation.

9. The thickness of solder resist is specified, although it is not specified in IPC

benefit

Improved electrical insulation properties reduce the risk of peeling or loss of adhesion and enhance the ability to resist mechanical impact – wherever mechanical impact occurs!

Risk of not doing so

Thin solder resist layer can lead to adhesion, flux resistance and hardness problems. All these problems will lead to the separation of the solder resist from the circuit board and eventually lead to copper circuit corrosion. Poor insulation characteristics due to thin resistance welding layer can cause short circuit due to accidental conduction / arc.

10. Appearance and repair requirements are defined, although not defined by IPC

benefit

In the manufacturing process, careful care and care create safety.

Risk of not doing so

A variety of scratches, minor damage, repair and repair – circuit boards work but don’t look good. In addition to the problems that can be seen on the surface, what are the invisible risks, the impact on the assembly and the risks in actual use?

11. Requirements for plug hole depth

benefit

High quality plug holes will reduce the risk of failure during assembly.

Risk of not doing so

Chemical residues in the gold precipitation process may remain in the holes with insufficient plug holes, resulting in problems such as weldability. In addition, tin beads may be hidden in the hole. During assembly or actual use, tin beads may splash out and cause short circuit.

12. Peters sd2955 specifies the brand and model of peelable blue glue

benefit

The designation of peelable blue glue can avoid the use of “local” or cheap brands.

Risk of not doing so

Inferior or cheap strippable glue may bubble, melt, crack or set like concrete during assembly, so that the strippable glue can not be stripped / ineffective.

13. Perform specific approval and ordering procedures for each purchase order

benefit

The execution of this procedure ensures that all specifications have been confirmed.

Risk of not doing so

If the product specification is not carefully confirmed, the resulting deviation may not be found until the assembly or final product, and then it is too late.

14. Sheathed plates with scrapped units are not acceptable

benefit

Not using partial assembly can help customers improve efficiency.

Risk of not doing so

Test Report

Special assembly procedures are required for defective sheathed boards. If the scrapped unit board (x-out) is not clearly marked or isolated from the sheathed board, it is possible to assemble this known bad board, thus wasting parts and time.