Mai ka makahiki 1950 mua, papa kaapuni i paʻi ʻia (PCB) ʻo ia ke kumu hana kumu o ka ʻeke uila, ma ke ʻano he mea lawe o nā ʻāpana uila like ʻole a me ka hub o ka hoʻouna ʻana i nā hōʻailona kaapuni, ʻo kona ʻano a me ka hilinaʻi e hoʻoholo ai i ka maikaʻi a me ka hilinaʻi o ka ʻeke uila holoʻokoʻa. Me ka miniaturization, māmā a me nā hana he nui o nā huahana uila, a me ka hoʻolaha ʻana i nā kaʻina alakaʻi-free a me ka halogen-free, ʻoi aku ka kiʻekiʻe o nā koi no ka hilinaʻi PCB. No laila, pehea e ʻimi wikiwiki ai i nā pilikia hilinaʻi PCB a hana i ka hoʻomaikaʻi ʻana i ka hilinaʻi kūpono i lilo i mea nui no nā ʻoihana PCB.

Common PCB reliability problems and typical legends

ʻAʻole hiki ke hoʻokuʻu ʻia

(ʻAʻohe pulu)

ʻAʻole hiki ke hoʻoheheʻe ʻia (ʻaʻole pulu)

ʻO ka wiliwili uila

(Hana uluna)

ʻilihune hilinaʻi

Layered plate pahū

Open circuit (through hole)

Kaapuni ākea

(Puka makapō Laser)

Kaapuni ākea

Kaapuni wehe (ICD)

Kaapuni pōkole (CAF)

Kaapuni pōkole (ECM)

Papa puhi

Eia nō naʻe, i ka nānā ʻole ʻana i nā pilikia hilinaʻi kūpono, hiki ke paʻakikī a ʻokoʻa paha ke ʻano hana hemahema o ke ʻano like ʻole. No laila, e like me ka noiʻi ʻana i kahi hihia, pono ka noʻonoʻo analytical pololei, noʻonoʻo noʻonoʻo koʻikoʻi a me nā ʻano loiloi like ʻole e ʻike i ke kumu hemahema maoli. In this process, any link is slightly negligent, may cause “unjust, false and wrong case”.

ʻIke Nui o ka hilinaʻi Nā pilikia ʻO ka ʻike hope ʻohi

ʻO ka ʻike hope ʻo ia ke kumu o ka nānā ʻole ʻana o nā pilikia hilinaʻi, pili pono i ke ʻano o nā loiloi hāʻule hope a pau, a he mana koʻikoʻi i ka hoʻoholo ʻana i ka mīkini hope. Therefore, prior to failure analysis, information behind failure should be collected as much as possible, usually including but not limited to:

(1) Laulā hāʻule: ʻike pūʻulu hemahema a me ka helu hāʻule kūpono

(1) Inā ʻo ka hui hoʻokahi o nā pilikia hana nui, a i ʻole ka haʻahaʻa haʻahaʻa haʻahaʻa, a laila ʻoi aku ka nui o ka mana o ke kaʻina hana maʻamau;

(2) Inā loaʻa nā pilikia i ka pūʻulu mua/nui, a i ʻole ke kiʻekiʻe o ka hāʻule ʻole, ʻaʻole hiki ke haʻalele ʻia ka mana o nā mea waiwai a me nā kumu hoʻolālā;

(2) Ma mua o ka hāʻule ʻole: inā paha ua hele ʻo PCB a i ʻole PCBA i nā kaʻina hana mua ma mua o ka hiki ʻole. ʻO ka hoʻomaʻamaʻa maʻamau ka reflux ma mua o ka kuke ʻana, / ke alakaʻi-free reflow soldering a me/lea-free wave crest welding a me ka manual welding, a me nā mea ʻē aʻe, inā pono e hoʻomaopopo i nā kikoʻī i nā mea āpau i hoʻohana ʻia i ke kaʻina hana pretreatment (e like me ka solder paste, stencil, solder wire, etc.), nā mea hana (ka mana hao hao, a me nā mea ʻē aʻe) a me nā ʻāpana (ka kahe kahe a me nā ʻāpana o ka hoʻoheheʻe ʻana i ka nalu, ka wela kūʻai lima, a me nā mea ʻē aʻe) ʻike;

(3) Kūlana hāʻule: ka ʻike kikoʻī i ka wā i hāʻule ʻole ai ka PCB a i ʻole PCBA, kekahi o ia mau mea i hāʻule i ke kaʻina hana mua e like me ka welding a me ka hui ʻana, e like me ka maikaʻi ʻole o ka solderability, stratification, etc.; Aia kekahi i ka ʻelemakule ma hope, hoʻāʻo a me ka hoʻohana ʻana i ka hāʻule ʻole, e like me CAF, ECM, pā ahi, etc.; ʻIke kikoʻī o ke kaʻina hana hāʻule a me nā ʻāpana pili;

ʻAʻole ka nānā ʻana i ka PCB/PCBA

ʻO ka ʻōlelo maʻamau, ua kaupalena ʻia ka helu o nā huahana i hāʻule ʻole, a i ʻole hoʻokahi ʻāpana wale nō, no laila, pono ka nānā ʻana o nā huahana i hāʻule ʻole e hahai i ka loina o ka papa ma ka ʻatikala ʻana mai waho a i loko, mai ka luku ʻole a hiki i ka luku ʻana, ma nā ʻano āpau e pale i ka luku mua ʻana. o ka paena hemahema:

(1) Nānā hiʻona

ʻO ka nānā ʻana i nā hiʻohiʻona ʻo ia ka hana mua o ka hōʻike ʻana i ka huahana hemahema. Ma o ka ʻike ʻia ʻana o ka pūnaewele hāʻule a hui pū ʻia me ka ʻike hope, hiki i nā ʻenekini hoʻomaʻamaʻa ʻike ʻike ʻole ke hoʻoholo pono i nā kumu kūpono o ka hemahema a hana i ka nānā ʻana e like me ia. Eia nō naʻe, pono e hoʻomaopopo ʻia he nui nā ala e nānā ai i ke ʻano, ʻo ia hoʻi ka ʻike, ke aniani hoʻonui lima, ke aniani hoʻonui papa, ka microscope stereoscopic a me ka microscope metallographic. Eia nō naʻe, ma muli o ka ʻokoʻa o ke kumu māmā, ka loina kiʻi a me ka hohonu o ka nānā ʻana, pono e nānā ʻia ka morphology i ʻike ʻia e nā mea hana e pili ana ma muli o nā kumu mea hana. ʻAʻole ʻae ʻia ka hoʻoholo wikiwiki ʻana a hana i ka preconceived subjective guesswork, e alakaʻi ana i ke ala hewa o ka nānā ʻana i ka hemahema a hoʻopau i nā huahana maikaʻi ʻole a me ka manawa loiloi.

(2) Ka hoʻonaʻauao hōʻinoʻole

No kekahi mau hāʻule, ʻaʻole hiki i ka nānā ʻana ke hōʻiliʻili i ka ʻike kūpono ʻole, a ʻaʻole hiki ke ʻike ʻia ka helu hemahema, e like me ka delamination, virtual welding a me ka wehe ʻana i loko, a me nā mea ʻē aʻe. e hōʻiliʻili i nā ʻike hou aʻe, e like me ka ʻike ʻana i ka hewa kani ultrasonic, 3D X-ray, infrared thermal imaging, short-circuit location detection, etc.

Ma ke kahua o ka nānā ʻana i ka helehelena a me ka nānā ʻana nondestructive, pono e hoʻolohe i nā ʻano maʻamau a i ʻole nā ​​​​ʻano like ʻole o nā huahana hāʻule ʻole, hiki ke hoʻohana ʻia no ke kuhikuhi ʻana no ka hoʻoholo hope ʻole. Ma hope o ka hōʻiliʻili ʻia ʻana o ka ʻike i ka wā o ke kaʻina nondestructive analysis, hiki ke hoʻomaka ka nānā ʻana i ka hemahema.

(3) Ke kālailai hāʻule

He mea nui ka nānā ʻana i ka hemahema, a ʻo ia ka hana koʻikoʻi loa, e hoʻoholo pinepine i ka kūleʻa a i ʻole ka hāʻule ʻole. There are many methods for failure analysis, such as scanning electron microscopy & elemental analysis, horizontal/vertical section, FTIR, etc., which will not be described in this section. I kēia pae, ʻoiai he mea nui ke ʻano o ka loiloi hemahema, ʻo ka mea nui aʻe ka ʻike a me ka hoʻoholo ʻana i ka pilikia kīnā, a me ka ʻike pololei a me ka maopopo o ke ʻano hana hemahema a me ka hana hemahema, i ʻike ʻia ke kumu maoli o ka hemahema.

Ka nānā ‘ana i ka PCB papa

Ke kiʻekiʻe loa ka helu hāʻule ʻole, pono ka nānā ʻana o ka PCB ʻole ma ke ʻano he mea hoʻohui i ka hōʻemi kumu kumu. I ka wā i loaʻa ai ke kumu hāʻule ʻole i ka pae loiloi he kīnā o ka PCB papa ʻole e alakaʻi ai i ka pau ʻole o ka hilinaʻi ʻana, a laila inā like ka hemahema o ka PCB papa ʻole, e hōʻike ʻia ke ʻano hana like ʻole e like me ka huahana hāʻule ma hope o ka mālama like. kaʻina hana e like me ka huahana hemahema. Inā ʻaʻole i hoʻopuka hou ʻia ke ʻano hāʻule like ʻole, a laila hewa ke kumu kumu o ka huahana i hāʻule ʻole, a i ʻole ʻaʻole i pau.