1. Ngembobo: I-PlatingThroughHole, ebizwa nge-PTH

Lolu uhlobo oluvame kakhulu futhi olulula lokungena emgodini, inqobo nje uma i- PCB ibanjelwe ekukhanyeni, ukukhanya komgodi kudlula emgodini. Ngoba ngokusebenzisa ukukhiqizwa kwemigodi inqobo nje uma ukusetshenziswa kokubhola noma ukukhanya kwe-laser ngqo ebhodini lesifunda ukwenza konke ukubhola kungaba, ngakho-ke izindleko ziphansi kakhulu. Ngokusebenzisa izimbobo kushibhile, kepha kwesinye isikhathi kuthatha isikhala esiningi se-PCB.

2.I-BlindViaHole (BVH)

Xhuma isifunda esingaphandle se-PCB nocingo lwangaphakathi oluseduze ngokufaka imbobo ye-electroplating, ngoba awukwazi ukubona uhlangothi oluhlukile, ngakho-ke ibizwa ngokuthi imbobo engaboni. Ukuze kwandiswe ukusetshenziswa isikhala PCB wesifunda ungqimba, impumputhe hole inqubo waba khona. I-PCB efakazela le ndlela yokukhiqiza idinga ukunaka ngokukhethekile ukujula kokubhola ukuze ilunge, ingaxhunyaniswa kusengaphambi kwesendlalelo sesifunda kusendlalelo sesifunda ngasinye esiboshwe kahle, futhi ekugcineni sinamathele ndawonye, ​​kepha sidinga ukuma okuningiliziwe nokubeka idivayisi.

3. Imbobo Engcwatshiwe: I-BuriedViaHole (BVH)

Lokhu kubhekisela ekuxhumekeni kwanoma iyiphi ungqimba wesifunda ngaphakathi kwe-PCB kodwa hhayi kungqimba olungaphandle. Le nqubo ayinakufinyelelwa ngokubhola ngemuva kokubopha. Ukubhola kufanele kwenziwe ngesikhathi sezingqimba zesifunda ngasinye. Okokuqala, ungqimba lwangaphakathi luhlanganiswe kancane bese kuthi i-electroplating iyadingeka ngaphambi kokuba kwenziwe konke ukubopha. Le nqubo isetshenziswa kuphela kumabhodi wesifunda we-high density (HDI) ukukhulisa isikhala esisebenzisekayo kwezinye izingqimba zesekethe.