In PCB ibhodi ukuklama, konjiniyela, umklamo wesifunda uyisisekelo kakhulu. Kodwa-ke, onjiniyela abaningi bavame ukuqapha nokucophelela ekwakhiweni kwamabhodi e-PCB ayinkimbinkimbi futhi anzima, kuyilapho bewashaya indiva amaphuzu athile okufanele anakwe ekwakhiweni kwamabhodi e-PCB ayisisekelo, okuholela emaphutheni. Umdwebo wesifunda omuhle ngokuphelele ungaba nezinkinga noma uphuke ngokuphelele lapho uguqulwa ube yi-PCB. Ngakho-ke, ukuze usize onjiniyela behlise izinguquko zedizayini futhi bathuthukise ukusebenza kahle komsebenzi ekwakhiweni kwe-PCB, izici ezimbalwa okufanele zinakwe kunqubo yokuklama ye-PCB zihlongozwa lapha.

Idizayini yesistimu yokukhipha ukushisa ekwakhiweni kwebhodi le-PCB

Ekwakhiweni kwebhodi le-PCB, idizayini yesistimu yokupholisa ihlanganisa indlela yokupholisa nokukhetha kwezingxenye zokupholisa, kanye nokucatshangelwa kwe-coefficient yokwandisa okubandayo. Njengamanje, izindlela zokupholisa ezivame ukusetshenziswa zebhodi le-PCB zifaka: ukupholisa ngebhodi le-PCB uqobo, ukwengeza irediyetha kanye nebhodi lokuqhuba ukushisa ebhodini le-PCB, njll.

Ekudizayinweni kwendabuko kwebhodi le-PCB, i-substrate yendwangu yethusi / i-epoxy ingilazi noma i-phenolic resin ingubo yendwangu isetshenziswa kakhulu, kanye nenani elincane lephepha elenziwe ngephepha lethusi, lezi zinto zinokusebenza okuhle kagesi nokusebenza kokusebenza, kepha ukungahambi kahle kokushisa okushisayo. Ngenxa yokusetshenziswa okukhulu kwe-QFP, i-BGA nezinye izinto ezifakwe ebusweni ekwakhiweni kwebhodi le-PCB yamanje, ukushisa okwenziwe izingxenye kudluliselwa ebhodini le-PCB ngobuningi. Ngakho-ke, indlela ephumelela kunazo zonke yokuxazulula ukushabalalisa ukushisa ukwenza ngcono ukushisa kokushisa kwebhodi le-PCB ngqo lapho kuthintwa into yokushisa, futhi kuyenziwa noma kukhishwe ebhodini le-PCB.

Amanothi okuklama isistimu yokukhipha ukushisa ebhodini le-PCB

Umfanekiso 1: Idizayini yebhodi le-PCB _ Idizayini yesistimu yokukhipha ukushisa

Lapho inani elincane lezingxenye ebhodini le-PCB linokushisa okuphezulu, usinki wokushisa noma ithubhu yokuqhuba ukushisa kungenziwa kwengezwe kudivayisi yokushisa yebhodi le-PCB; Uma izinga lokushisa lingenakwehliswa, i-radiator ene-fan ingasetshenziswa. Uma kunenani elikhulu lamadivayisi okushisa ebhodini le-PCB, isinki esikhulu sokushisa singasetshenziswa. I-sink yokushisa ingahlanganiswa ebusweni bengxenye ukuze ikwazi ukupholisa ngokuthinta ingxenye ngayinye ebhodini le-PCB. Amakhompyutha ochwepheshe asetshenziswa ekukhiqizweni kwevidiyo nopopayi adinga ngisho nokupholiswa ngokupholisa amanzi.

Ukukhethwa nokuhlelwa kwezingxenye kudizayini yebhodi le-PCB

Ekwakhiweni kwebhodi le-PCB, akungabazeki ukuthi uzobhekana nokukhethwa kwezingxenye. Ukucaciswa kwengxenye ngayinye kuhlukile, futhi izici zezingxenye ezikhiqizwa abakhiqizi abahlukene zingase zehluke kumkhiqizo ofanayo. Ngakho-ke, lapho ukhetha izingxenye ze-PCB board design, kuyadingeka ukuthintana nomphakeli ukuze wazi izici zezingxenye futhi uqonde umthelela walezi zici ekwakhiweni kwebhodi le-PCB.

Kulezi zinsuku, ukukhetha imemori efanele nakho kubaluleke kakhulu ekwakhiweni kwe-PCB. Ngenxa yokuthi i-DRAM nememori ye-Flash zivuselelwa njalo, kuyinselelo enkulu kubaklami be-PCB ukugcina umklamo omusha ethonyeni lemakethe yenkumbulo. Abaklami be-PCB kufanele babheke imakethe yenkumbulo futhi balondoloze ubuhlobo obuseduze nabakhiqizi.

Umfanekiso 2: Idizayini yebhodi le-PCB _ Izingxenye zokushisisa nokushiswa

Ngaphezu kwalokho, ezinye izingxenye ezinokushisa okukhulu kokushisa kufanele zibalwe, futhi ukuhlelwa kwazo kudinga ukucatshangelwa okukhethekile. Lapho inani elikhulu lezinto zihlangene, zingakhiqiza ukushisa okwengeziwe, okuholele ekusombulukeni nasekuhlukanisweni kwesendlalelo sokumelana nokushisela, noma ngisho nokushisa lonke ibhodi le-PCB. Ngakho-ke, onjiniyela be-PCB nonjiniyela besakhiwo kumele basebenzisane ukuze baqinisekise ukuthi izingxenye zinesakhiwo esifanele.

Isakhiwo kufanele siqale sicabangele ubukhulu bebhodi le-PCB. Lapho usayizi webhodi le-PCB likhulu kakhulu, ubude bomugqa ophrintiwe, ukwanda kwe-impedance, ikhono lokulwa nomsindo liyancipha, izindleko nazo ziyanda; Uma ibhodi le-PCB lilincane kakhulu, ukuchithwa kokushisa akukuhle, futhi imigqa eseduze kulula ukuphazanyiswa. Ngemva kokunquma ubukhulu PCB ibhodi, thola indawo izingxenye ezikhethekile. Ekugcineni, ngokuya ngeyunithi esebenzayo yesekethe, zonke izingxenye zesekethe zibekiwe.

Idizayini yokuhlola ekwakhiweni kwebhodi le-PCB

Ubuchwepheshe obukhiye bokuhlolwa kwe-PCB bufaka ukulinganiswa kokuhlolwa, ukuklanywa nokwenza kahle kwendlela yokuhlolwa, ukucutshungulwa kolwazi lokuhlola nokuxilongwa kwephutha. Eqinisweni, ukwakheka kokuhlolwa kwebhodi le-PCB ukwethula enye indlela yokuhlola ebhodini le-PCB elingenza lula ukuhlolwa

Ukuhlinzeka ngeshaneli yolwazi ukuze kutholwe ulwazi lokuhlola lwangaphakathi lwento ehlolwayo. Ngakho-ke, idizayini ephusile nesebenzayo yendlela yokuhlola iyisiqinisekiso sokuthuthukisa izinga lokuhlola lebhodi le-PCB ngempumelelo. Thuthukisa ikhwalithi nokuthembeka komkhiqizo, unciphise izindleko zomjikelezo wokuphila komkhiqizo, ubuchwepheshe bomklamo wokuhlola bungathola kalula ulwazi lwempendulo yokuhlolwa kwebhodi le-PCB, kungenza kalula ukuxilongwa kwephutha ngokusho kolwazi lwempendulo. Ekwakhiweni kwebhodi le-PCB, kuyadingeka ukuqinisekisa ukuthi indawo yokuthola nendlela yokungena ye-DFT namanye amakhanda okuthola ngeke kuthinteke.

Nge-miniaturization yemikhiqizo ye-elekthronikhi, ukuphakama kwezingxenye kuya kuba kuncane futhi kuncane, futhi ukuminyana kokufaka kuyanda. Kunama-circuit node ambalwa nambalwa atholakalayo ukuze ahlolwe, ngakho kuba nzima nakakhulu ukuhlola umhlangano we-PCB ku-inthanethi. Ngakho-ke, izimo zikagesi nezomzimba nezomshini zokuhlolwa kwe-PCB kufanele zibhekwe ngokugcwele lapho kuklanywa ibhodi le-PCB, futhi imishini efanele nemishini kagesi kufanele isetshenziselwe ukuhlola.

Umfanekiso 3: Idizayini yebhodi le-PCB _ Idizayini yokuhlola

Idizayini yebhodi le-PCB yebanga lokuzwela umswakama MSL

Umfanekiso 4: Idizayini yebhodi le-PCB _ Izinga lokuzwela komswakama

I-MSL: Izinga Elizwela Umswakama. Imakwe kulebula futhi ihlukaniswe yaba amazinga 1, 2, 2A, 3, 4, 5, 5A, kanye no-6. Izingxenye ezinezidingo ezikhethekile kumswakama noma ezimakwe ngezingxenye ezizwelayo umswakama ephaketheni kufanele ziphathwe ngendlela efanele ukuze zinikeze uhla lokulawula izinga lokushisa nomswakama endaweni yokugcina impahla kanye nemvelo yokukhiqiza, ngaleyo ndlela kuqinisekiswe ukwethembeka kokusebenza kwezinga lokushisa nomswakama izingxenye ezizwelayo. Lapho ubhaka, i-BGA, i-QFP, i-MEM, i-BIOS nezinye izidingo zokupakisha kwe-vacuum ziphelele, izinga lokushisa eliphezulu kanye ne-high-temperature resistant components zibhakwa emazingeni okushisa ahlukene, qaphela isikhathi sokubhaka. Izidingo zokubhaka zebhodi le-PCB kuqala zibhekisela ezidingweni zokupakisha zebhodi le-PCB noma izidingo zekhasimende. Ngemva kokubhaka, izingxenye ezizwela umswakama kanye nebhodi le-PCB akufanele lidlule i-12H ekamelweni lokushisa. Umswakama ongasetshenziswanga noma ongasetshenziswanga izingxenye ezibucayi noma ibhodi le-PCB kufanele livalwe ngokupakisha komshini noma ligcinwe ebhokisini lokomisa.

Amaphuzu amane angenhla kufanele anakwe ekwakhiweni kwebhodi le-PCB, ngethemba lokusiza onjiniyela abadonsa kanzima ekwakhiweni kwebhodi le-PCB.