Everyone knows how to prevent PCB bending and board warping from going through the reflow furnace. The following is an explanation for everyone:

1. Reduce the influence of temperature on PCB board stress

Ji ber ku “germ” çavkaniya sereke ya stresa panelê ye, heya ku germahiya sobeya vegerandinê kêm bibe an jî rêjeya germkirin û sarbûna panelê di firina vegerandinê de hêdî bibe, dibe ku rûdana pîvaz û şerpezê pir zêde bibe. kêm kirin. Lêbelê, bandorên aliyî yên din jî dikarin çêbibin, wek kurteya kelijandinê.

2. Bikaranîna pelê Tg bilind

Tg germahiya derbasbûna camê ye, ango germahiya ku tê de madde ji rewşa camê diguhere bo rewşa lastîkî. Her ku nirxa Tg ya materyalê kêm bibe, ew qas zûtir dest pê dike ku piyan piştî ku bikeve firina vejenê nerm bibe, û wextê ku pêdivî ye ku bibe haleta gomayek nerm Ew ê jî dirêjtir bibe, û deformasyona panelê bê guman dê girantir be. . Bikaranîna plakaya Tg ya bilindtir dikare kapasîteya wê ya li hember stres û deformasyonê zêde bike, lê bihayê materyalê bi nisbet bilind e.

3. Zêdekirina stûrbûna board circuit

In order to achieve the purpose of lighter and thinner for many electronic products, the thickness of the board has left 1.0mm, 0.8mm, and even a thickness of 0.6mm. It is really difficult for such a thickness to keep the board from deforming after the reflow furnace. It is recommended that if there is no requirement for lightness and thinness, the board* can use a thickness of 1.6mm, which can greatly reduce the risk of bending and deformation of the board.

4. Reduce the size of the circuit board and reduce the number of puzzles

Since most of the reflow furnaces use chains to drive the circuit board forward, the larger the size of the circuit board will be due to its own weight, dent and deformation in the reflow furnace, so try to put the long side of the circuit board as the edge of the board. On the chain of the reflow furnace, the depression and deformation caused by the weight of the circuit board can be reduced. The reduction in the number of panels is also based on this reason. Low dent deformation.

5. Tepsiya firnê tê bikaranîn

If the above methods are difficult to achieve, *reflow carrier/template is used to reduce the amount of deformation. The reason why the reflow carrier/template can reduce the bending of the plate is because it is hoped whether it is thermal expansion or cold contraction. The tray can hold the circuit board and wait until the temperature of the circuit board is lower than the Tg value and start to harden again, and can also maintain the size of the garden.

Ger paleta yek-qatî nikaribe deformasyona panelê kêm bike, pêdivî ye ku pêvek were zêdekirin da ku panelê bi paletên jorîn û jêrîn ve were girêdan. Ev dikare pirsgirêka deformasyonê ya panelê bi navgîniya firna vegerandinê pir kêm bike. Lêbelê, ev tepsiya sobeyê pir biha ye, û pêdivî ye ku ew bi destan were danîn û vegerandin.

6. Li şûna V-Cut Router bikar bînin da ku jêr-board bikar bînin
Ji ber ku V-Cut dê hêza avahîsaziya panelê ya di navbera lewheyên çerxê de hilweşîne, hewl bidin ku jêr-boarda V-Cut bikar neynin an jî kûrahiya V-Cut kêm nekin.