Everyone knows how to prevent PCB bending and board warping from going through the reflow furnace. The following is an explanation for everyone:

1. Reduce the influence of temperature on PCB board stress

Niwọn igba ti “iwọn otutu” jẹ orisun akọkọ ti aapọn igbimọ, niwọn igba ti iwọn otutu ti adiro isọdọtun ti dinku tabi oṣuwọn alapapo ati itutu agbaiye ninu adiro isọdọtun ti fa fifalẹ, iṣẹlẹ ti atunse awo ati oju-iwe ogun le jẹ pupọ. dinku. Bibẹẹkọ, awọn ipa ẹgbẹ miiran le waye, gẹgẹ bi Circuit kukuru solder.

2. Lilo giga Tg dì

Tg jẹ iwọn otutu iyipada gilasi, iyẹn ni, iwọn otutu eyiti ohun elo naa yipada lati ipo gilasi si ipo roba. Isalẹ awọn Tg iye ti awọn ohun elo, awọn yiyara awọn ọkọ bẹrẹ lati rọ lẹhin titẹ awọn reflow adiro, ati awọn akoko ti o gba lati di rirọ ipinle roba O yoo tun di gun, ati awọn abuku ti awọn ọkọ yoo dajudaju jẹ diẹ to ṣe pataki. . Lilo awo Tg ti o ga julọ le mu agbara rẹ pọ si lati koju aapọn ati abuku, ṣugbọn idiyele ohun elo naa ga julọ.

3. Mu sisanra ti awọn Circuit ọkọ

In order to achieve the purpose of lighter and thinner for many electronic products, the thickness of the board has left 1.0mm, 0.8mm, and even a thickness of 0.6mm. It is really difficult for such a thickness to keep the board from deforming after the reflow furnace. It is recommended that if there is no requirement for lightness and thinness, the board* can use a thickness of 1.6mm, which can greatly reduce the risk of bending and deformation of the board.

4. Reduce the size of the circuit board and reduce the number of puzzles

Since most of the reflow furnaces use chains to drive the circuit board forward, the larger the size of the circuit board will be due to its own weight, dent and deformation in the reflow furnace, so try to put the long side of the circuit board as the edge of the board. On the chain of the reflow furnace, the depression and deformation caused by the weight of the circuit board can be reduced. The reduction in the number of panels is also based on this reason. Low dent deformation.

5. Lo ileru atẹ imuduro

If the above methods are difficult to achieve, *reflow carrier/template is used to reduce the amount of deformation. The reason why the reflow carrier/template can reduce the bending of the plate is because it is hoped whether it is thermal expansion or cold contraction. The tray can hold the circuit board and wait until the temperature of the circuit board is lower than the Tg value and start to harden again, and can also maintain the size of the garden.

Ti pallet nikan-Layer ko le dinku abuku ti igbimọ Circuit, a gbọdọ fi ideri kun lati di igbimọ Circuit pẹlu awọn pallets oke ati isalẹ. Eleyi le gidigidi din isoro ti Circuit ọkọ abuku nipasẹ awọn reflow ileru. Sibẹsibẹ, atẹ adiro yii jẹ gbowolori pupọ, ati pe o ni lati gbe pẹlu ọwọ ati tunlo.

6. Lo olulana dipo V-Cut lati lo iha-ọkọ
Niwọn igba ti V-Ge yoo run agbara igbekalẹ ti nronu laarin awọn igbimọ Circuit, gbiyanju lati ma lo ipin-ipin-ipin V-Gẹ tabi dinku ijinle V-Ge.