Wonke umntu uyayazi indlela yokuthintela PCB ukugoba kunye nokujika kwebhodi ukusuka ekungeneni kwiziko lokubuyela kwakhona. Oku kulandelayo yingcaciso kumntu wonke:

1. Ukunciphisa impembelelo yobushushu kwi-PCB yoxinzelelo lwebhodi

Ekubeni “iqondo lokushisa” lingowona mthombo oyintloko woxinzelelo lwebhodi, nje ukuba iqondo lokushisa le-oven yokubuyisela liyancipha okanye izinga lokufudumeza kunye nokupholisa kwebhodi kwi-oven yokubuyisela iyancipha, ukwenzeka kokugoba kweplate kunye ne-warpage kunokuba kakhulu. kuncitshisiwe. Nangona kunjalo, ezinye iziphumo zecala zinokuthi zenzeke, njenge-solder short circuit.

2. Ukusebenzisa iphepha leTg eliphezulu

I-Tg yiqondo lokushisa lokutshintsha kweglasi, oko kukuthi, iqondo lokushisa apho izinto zitshintsha ukusuka kwiglasi ukuya kwimeko yerabha. Ixabiso eliphantsi le-Tg lezinto eziphathekayo, ngokukhawuleza ibhodi iqala ukuthamba emva kokungena kwi-oven yokubuyisela, kwaye ixesha elithathayo ukuze libe yimeko yerabha ethambileyo iya kuba yinde, kwaye ukuguqulwa kwebhodi kuya kuba nzima ngakumbi. . Ukusebenzisa i-Tg plate ephezulu kunokunyusa amandla ayo okumelana noxinzelelo kunye nokuguqulwa, kodwa ixabiso lezinto eziphathekayo liphezulu.

3. Ukwandisa ubukhulu bebhodi yesekethe

Ukuze ufezekise injongo yokukhanya kunye nokuncinci kwiimveliso ezininzi ze-elektroniki, ubukhulu bebhodi bushiye i-1.0mm, 0.8mm, kunye nobunzima be-0.6mm. Kunzima ngokwenene kubukhulu obunjalo ukugcina ibhodi ingakhubazeki emva kwesithando somlilo. Kucetyiswa ukuba ukuba akukho mfuneko yokukhanya kunye nokunciphisa, ibhodi * ingasebenzisa ubukhulu be-1.6mm, enokunciphisa kakhulu umngcipheko wokugoba kunye nokuguqulwa kwebhodi.

4. Ukunciphisa ubungakanani bebhodi yesekethe kwaye unciphise inani leepuzzle

Ekubeni uninzi lweziko lokutshiza zisebenzisa amatyathanga ukuqhubela phambili ibhodi yesekethe, ubukhulu bebhodi yesekethe buya kuba bubunzima bayo, i-dent kunye nokuguqulwa kwesithando somlilo, ngoko zama ukubeka icala elide lebhodi yesekethe. njengomphetho webhodi. Kwikhonkco lesithando somlilo, ukudakumba kunye nokuguqulwa okubangelwa ubunzima bebhodi yesiphaluka kunokunciphisa. Ukuncitshiswa kwenani leepaneli nako kusekelwe kwesi sizathu. I-deformation ephantsi.

5. Ukusetyenziswa kwetreyi yesithando somlilo

Ukuba ezi ndlela zingentla zinzima ukuphumeza, *i-reflow carrier/template isetyenziselwa ukunciphisa inani le-deformation. Isizathu sokuba i-reflow carrier / template inokunciphisa ukugoba kwepleyiti kukuba kuthenjwa ukuba kukwandiswa kwe-thermal okanye ukucutha okubandayo. I-tray ingabamba ibhodi yesiphaluka kwaye ilinde de ukushisa kwebhodi yesiphaluka kuphantsi kwexabiso le-Tg kwaye uqale ukuqina kwakhona, kwaye unokugcina ubungakanani begadi.

Ukuba i-pallet ye-single-layer ayikwazi ukunciphisa i-deformation yebhodi yesekethe, isigqubuthelo kufuneka songezwe kwi-clamp ibhodi yesiphaluka kunye neepaliti eziphezulu kunye nezantsi. Oku kunokunciphisa kakhulu ingxaki yokuguqulwa kwebhodi yesiphaluka ngokusebenzisa isithando somlilo. Nangona kunjalo, le tray ye-oveni ibiza kakhulu, kwaye kufuneka ibekwe ngesandla kwaye isetyenziswe kwakhona.

6. Sebenzisa i-Router endaweni ye-V-Cut ukusebenzisa i-sub-board
Ekubeni i-V-Cut iya kutshabalalisa amandla okwakhiwa kwepaneli phakathi kweebhodi zeesekethe, zama ukungasebenzisi i-V-Cut sub-board okanye ukunciphisa ubunzulu be-V-Cut.