Ingqiqo esisiseko yebhodi yePCB

Ingqiqo esisiseko ye Ibhodi PCB

1. Ingqikelelo ye “Layer”
Ngokufana nengqikelelo “yomaleko” ongeniswe ekusetyenzweni kwamagama okanye kwezinye isoftware ukuqonda ukwakhiwa kwendlwane kunye nokuhlanganiswa kwemizobo, umbhalo, umbala, njl. njl., “Umaleko” weProtel ayisiyonyani, kodwa eyona nto iprintiweyo yebhodi ngokwayo kwiindidi ezahlukeneyo. iileya zefoyile yobhedu. Namhlanje, ngenxa yofakelo oluxineneyo lwamacandelo esekethe ye-elektroniki. Iimfuno ezikhethekileyo ezifana nokuchasana nokuphazamiseka kunye ne-wiring. Iibhodi eziprintiweyo ezisetyenziswe kwezinye iimveliso ze-elektroniki ezitsha azinamacala angaphezulu nasezantsi kuphela ocingo, kodwa zikwanazo neefoyile zobhedu ze-interlayer ezinokucutshungulwa ngokukodwa phakathi kweebhodi. Ngokomzekelo, ii-motherboards zekhompyutha zangoku zisetyenziswa. Uninzi lwezixhobo zebhodi eziprintiweyo zingaphezulu kwe-4 layers. Ngenxa yokuba ezi maleko kunzima ukusetyenzwa ngazo, zisetyenziswa ikakhulu ukuseta iileya zocingo lwamandla ngocingo olulula (ezifana neGround Dever kunye nePower Dever kwisoftware), kwaye kaninzi zisebenzisa iindlela zokuzalisa iindawo ezinkulu zocingo (ezifana ne-ExternaI). P1a11e kwaye Gcwalisa isoftware). ). Apho imigangatho ephezulu kunye nesezantsi kunye nemigangatho ephakathi kufuneka idibaniswe, ebizwa ngokuba yi “vias” ekhankanywe kwisofthiwe isetyenziselwa ukunxibelelana. Ngengcaciso engentla, akunzima ukuqonda iingqiqo ezihambelanayo “ye-multi-layer pad” kunye “nesetting layering wiring”. Ukunika umzekelo olula, abantu abaninzi baye bagqiba i-wiring kwaye bafumanisa ukuba ezininzi zee-terminals ezidibeneyo azikho iipads xa ziprintwa. Ngapha koko, oku kungenxa yokuba abawuhoyanga umgaqo othi “amaleya” xa bongeza ilayibrari yesixhobo kwaye abazoba kwaye bazipakishe ngokwabo. Uphawu lwephedi luchazwa njenge “Multilayer (Mulii-Layer). Kufuneka kukhunjulwe ukuba xa inani leengqimba zebhodi eprintiweyo esetyenzisiweyo likhethiwe, qiniseka ukuba uvale ezo zingqimba ezingasetyenziswanga ukuphepha iingxaki kunye nokuphambuka.

ipcb

2. Nge (Nge)

ngumgca odibanisa amaleko, kwaye umngxuma oqhelekileyo ugrunjwa kwi-Wenhui yeengcingo ezifuna ukudityaniswa kumaleko ngamnye, ohamba ngomngxuma. Kule nkqubo, umaleko wesinyithi utyatyekwa kumphezulu wecylindrical wodonga lomngxuma wendlela ngokubekwa kweekhemikhali ukudibanisa ifoyile yobhedu ekufuneka idityaniswe kumaleko aphakathi, kwaye amacala aphezulu nasezantsi e-via ayenziwa. kwiimilo zeepadi eziqhelekileyo, ezinokuthi zithe ngqo Idibaniswa nemigca emacaleni aphezulu nangaphantsi, okanye ayixhunyiwe. Ngokubanzi, kukho le migaqo ilandelayo yonyango lwe-vias xa kuyilwa isekethe:
(1) Ukunciphisa ukusetyenziswa kwe-vias. Emva kokuba i-via ikhethiwe, qiniseka ukuba uphatha umsantsa phakathi kwayo kunye namaziko ajikelezileyo, ngokukodwa umsantsa phakathi kwemigca kunye nee-vias ezijongeka ngokulula kumaleko aphakathi kunye ne-vias. Ukuba i-Automatic umzila unokusombulula ngokuzenzekelayo ngokukhetha into ethi “on” kwi-“Nciphisa inani le-vias” (Via Minimiz8TIon) submenu.
(2) Ubukhulu bomthamo okhoyo ofunekayo, ubukhulu besayizi ye-vias efunekayo. Umzekelo, i-vias esetyenziselwa ukudibanisa umaleko wamandla kunye nomgangatho womhlaba kwezinye iileyile ziya kuba zikhulu.

3. umaleko wesikrini sesilika (Isigqubuthelo)

Ukuze kuququzelelwe ukufakwa kunye nokugcinwa kwesekethe, iipateni zelogo ezifunekayo kunye neekhowudi zetekisi ziprintwa kwiindawo eziphezulu kunye nezisezantsi zebhodi eprintiweyo, njengeleyibhile yecandelo kunye nexabiso legama, icandelo le-outline shape kunye nelogo yomvelisi, umhla wokuvelisa, njll Kwibhodi eprintiweyo abayiyileyo, abalinganiswa bavalwe yinxalenye okanye bahlasela indawo yokuthambisa kwaye bacinywa, kwaye ezinye zezixhobo ziphawulwe kumacandelo akufuphi. Uyilo olwahlukeneyo olunjalo luya kuzisa okuninzi ekuhlanganiseni nasekugcinweni. engalunganga. Umgaqo ochanekileyo wokubekwa kwabalinganiswa kuluhlu lwesikrini sesilika kukuba: “akukho ngqiqweni, imithungo ngokujonga nje, intle kwaye inesisa”.

4. Ubunjani be-SMD

Kukho inani elikhulu leepakethe ze-SMD kwilayibrari yephakheji yeProtel, oko kukuthi, izixhobo zokuthengisela phezulu. Eyona nto inkulu yolu hlobo lwesixhobo ukongeza kubukhulu balo obuncinci bukusabalalisa kwicala elinye lemingxuma yezikhonkwane. Ngoko ke, xa ukhetha olu hlobo lwesixhobo, kuyimfuneko ukucacisa umphezulu wesixhobo ukuze ugweme “izikhonkwane ezilahlekileyo (iiPlns ezilahlekileyo)”. Ukongeza, iinkcazo zetekisi ezifanelekileyo zolu hlobo lwecandelo zinokubekwa kuphela kumphezulu apho icandelo likhona.

5. Indawo yokuzalisa efana negridi (iPlanethi yangaphandle) kunye nendawo yokuzalisa (Gcwalisa)

Njengamagama amabini, indawo yokuzalisa emise okwenethwekhi kukuqhuba indawo enkulu yefoyile yobhedu kwinethiwekhi, kwaye indawo yokuzalisa igcina kuphela ifoyile yobhedu. Abaqalayo bahlala bengawuboni umahluko phakathi kwezi zimbini kwikhompyuter kwinkqubo yoyilo, enyanisweni, nje ukuba usondeza, unokuyibona ngokukrwaqula. Kungenxa yokuba akulula ukubona umahluko phakathi kwezi zimbini ngamaxesha aqhelekileyo, ngoko xa uyisebenzisa, kukungakhathali ngakumbi ukwahlula phakathi kwezi zibini. Kufuneka kugxininiswe ukuba yangaphambili inempembelelo enamandla yokucinezela ukuphazamiseka kwe-high-frequency kwiimpawu zesekethe, kwaye ifanelekile kwiimfuno. Iindawo ezizaliswe ziindawo ezinkulu, ngakumbi xa iindawo ezithile zisetyenziswa njengeendawo ezikhuselweyo, iindawo ezahlulahlulweyo, okanye iintambo zombane ezisebenza ngokuphezulu zifanelekile ngokukodwa. Le yokugqibela isetyenziswa kakhulu kwiindawo apho kufuneka indawo encinci njengeziphelo zomgca jikelele okanye iindawo ezijikayo.

6. Iphedi

Iphedi yeyona nto idla ngokuqhagamshelwana neyona nto ibalulekileyo kuyilo lwePCB, kodwa abasaqalayo bakholisa ukungaluhoyi ukhetho lwayo kunye nohlengahlengiso, kwaye basebenzise iipads ezijikelezayo kuyilo olufanayo. Ukukhethwa kohlobo lwephedi yecandelo kufuneka kuthathelwe ingqalelo ngokubanzi imilo, ubungakanani, ukwakheka, ukungcangcazela kunye neemeko zokufudumeza, kunye nesalathiso samandla secandelo. I-Protel ibonelela ngoluhlu lweepadi zobukhulu obuhlukeneyo kunye neemilo kwilayibrari yephakeji, njengokujikeleza, isikwere, i-octagonal, i-round and positioning pads, kodwa ngamanye amaxesha oku akwanelanga kwaye kufuneka kuhlelwe nguwe. Ngokomzekelo, kwiipads ezivelisa ukushisa, ziphantsi koxinzelelo olukhulu, kwaye zikhoyo ngoku, zinokuthi ziyilwe “kwisimo se-teardrop”. Kumbala oqhelekileyo we-TV PCB yomgca wemveliso ye-pin pad yoyilo loyilo, abaninzi abavelisi bakule fomu. Ngokubanzi, ukongeza koku kungasentla, le migaqo ilandelayo kufuneka ithathelwe ingqalelo xa uhlela iphedi uwedwa:

(1) Xa imilo ingahambelani ngobude, qwalasela umahluko phakathi kobubanzi bocingo kunye nobude becala elithile lepadi elingekho likhulu kakhulu;

(2) Kuhlala kuyimfuneko ukusebenzisa iipads ezilinganayo kunye nobude be-asymmetric xa uhamba phakathi kwee-angles lead lead;

(3) Ubungakanani bomngxuma wepadi yecandelo ngalinye kufuneka buhlelwe kwaye bumiselwe ngokwahlukeneyo ngokobunzima bephini lecandelo. Umgaqo-siseko kukuba ubukhulu bomngxuma yi-0.2 ukuya kwi-0.4 mm enkulu kunobubanzi bepini.

7. Iintlobo ezahlukeneyo zeembrane (Imaski)

Ezi bhanyabhanya aziyimfuneko kuphela kwinkqubo yemveliso ye-PcB, kodwa nemeko eyimfuneko ye-welding yecandelo. Ngokwendawo kunye nomsebenzi we “membrane”, “imembrane” inokwahlulwa ibe yinxenye yecandelo (okanye i-solder surface) i-solder mask (phezulu okanye ezantsi) kunye nomphezulu wecandelo (okanye i-solder surface) imaski ye-solder (TOp okanye i-BottomPaste Mask) . Njengoko igama lithetha, ifilimu yokudambisa ifilimu ifakwe kwi-pad ukuphucula i-solderability, oko kukuthi, izangqa ezinombala okhanyayo kwibhodi eluhlaza zinkulu kancinci kune-pad. Imeko ye-mask ye-solder ichasene nje, kuba Ukulungelelanisa ibhodi egqityiweyo kwi-soldering ye-wave kunye nezinye iindlela zokudibanisa, kuyafuneka ukuba i-foil yobhedu kwi-non-pad ebhodini ayinakuthotywa. Ngoko ke, umaleko wepeyinti kufuneka ufakwe kuzo zonke iindawo ngaphandle kwe-pad ukuthintela i-tin ukuba ifakwe kula malungu. Kuyabonakala ukuba ezi nwebu zimbini zikubudlelwane obuhambelanayo. Ukusuka kule ngxoxo, akunzima ukumisela imenyu
Izinto ezinjenge “solder Mask En1argement” zisekiwe.

8. Umgca wokubhabha, umgca wokubhabha uneentsingiselo ezimbini:

1 Emva kokulayisha amacandelo ngetafile yothungelwano kunye nokwenza uyilo lwangaphambili, ungasebenzisa “Bonisa umyalelo” ukubona imeko ye-crossover yoqhagamshelo lwenethiwekhi phantsi kobeko, Lungiselela rhoqo indawo yamacandelo ukunciphisa le crossover ukufumana ubuninzi obuzenzekelayo. izinga lomzila. Eli nyathelo libaluleke kakhulu. Kunokuthiwa ukulola imela kwaye ungagawuli iinkuni ngempazamo. Kuthatha ixesha elingakumbi kunye nexabiso! Ukongeza, emva kokuba i-wiring ezenzekelayo igqityiwe, apho uthungelwano lungekasetyenziswa, ungasebenzisa lo msebenzi ukufumana. Emva kokufumana inethiwekhi engaxhunywanga, inokubuyiselwa ngesandla. Ukuba ayinakuhlawulwa, intsingiselo yesibini ye “flying line” isetyenzisiweyo, edibanisa ezi nethiwekhi ngeengcingo kwibhodi eprintiweyo yexesha elizayo. Kufuneka kuvunywe ukuba ukuba ibhodi yesekethe imveliso umgca oluzenzekelayo ukuveliswa ngobuninzi, lo khokelo olubhabhayo lunokuthi luyilwe njengento yokumelana nexabiso le-0 ohm lokumelana kunye ne-uniform pad spacing.