I. Data input stage

1. Whether the data received in the process are complete (including schematic diagram. BRD file, material list, PCB design specification and PCB design or change requirement, standardization specification and process design specification)

2. Make sure the PCB template is up to date

3. Ensure that the positioning components of the template are correctly located

4.PCB design description and PCB design or change requirements, standardization requirements are clear

5. Ensure that forbidden devices and wiring areas on the outline diagram are reflected on the PCB template

6. Compare the outline drawing to confirm that the dimensions and tolerances marked on PCB are correct, and the definition of metalized hole and nonmetalized hole is accurate

7. After confirming the accuracy of PCB template, it is best to lock the structure file to avoid being moved by misoperation

Second, after the layout inspection stage

A. Check components

8. Confirm whether all device packages are consistent with the unified library of the company and whether the package library has been updated (check the running results with viewlog). If not, Update Symbols

9, motherboard and sub-board, board and backboard, make sure that the signal is corresponding, the position is corresponding, the connector direction and silk screen identification is correct, and the sub-board has anti-misinsertion measures, and the components on the sub-board and the motherboard should not interfere

10. Whether the components are 100% placed

11. Open place-bound for the TOP and BOTTOM layers of the device to see if DRC caused by overlap is allowed

12. Whether Mark point is sufficient and necessary

13. Heavy components should be placed close to the PCB support point or support side to reduce the warpage of the PCB

14. It is best to lock the structure-related devices after they are arranged in order to prevent misoperation from moving the position

15. Within 5mm around the crimping socket, the front side is not allowed to have components whose height exceeds the height of the crimping socket, and the back side is not allowed to have components or solder joints

16. Confirm whether the device layout meets the technological requirements (focus on BGA, PLCC and patch socket)

17, metal shell components, pay special attention to do not collide with other components, to leave enough space position

18. Interface-related components should be placed close to the interface, and the backplane bus driver should be placed close to the backplane connector

19. Whether the CHIP device on the wave soldering surface has been converted into wave soldering package,

20. Whether there are more than 50 manual solder joints

21. Horizontal mounting should be considered for axial mounting of higher components on PCB. Leave room for sleeping. And consider the fixed mode, such as crystal fixed pad

22. Ensure that there is sufficient spacing between the devices using the heat sink and other devices, and pay attention to the height of the main devices within the heat sink range

B. Function check

23. Whether the layout of digital circuit and analog circuit components of the digital-analog hybrid board has been separated, and whether the signal flow is reasonable

24, A/D converters are placed across analog partitions.

25, clock device layout is reasonable

26. Whether the layout of high-speed signal devices is reasonable

27, whether the terminal device has been properly placed (source matching series resistance should be placed at the signal drive end; The intermediate matching string resistance is placed in the middle position; Terminal matching series resistance should be placed at the receiving end of the signal)

28. Whether the number and location of decoupling capacitors of IC devices are reasonable

29. Signal lines take planes of different levels as reference planes. When crossing the region divided by planes, whether the connecting capacitance between the reference planes is close to the signal routing region.

30. Whether the layout of the protection circuit is reasonable and conducive to segmentation

31. Whether the fuse of the power supply of the board is placed near the connector and there is no circuit component in front of it

32. Confirm that strong signal and weak signal (power difference 30dB) circuits are arranged separately

33. Whether devices that may affect EMC experiments are placed according to design guidelines or reference to successful experiences. For example: the reset circuit of the panel should be slightly close to the reset button

C. fever

34, for heat sensitive components (including liquid medium capacitance, crystal vibration) as far as possible away from high-power components, radiator and other heat sources

35. Whether the layout meets the requirements of thermal design and heat dissipation channels (according to the process design documents)

D. the power

36. Check whether the IC power supply is too far from the IC

37. Whether the layout of LDO and surrounding circuit is reasonable

38. Is the circuit layout around the module power supply reasonable

39. Is the overall layout of the power supply reasonable

E. Rule Settings

40. Check whether all simulation constraints have been correctly added to the Constraint Manager

41. Are physical and electrical rules set correctly (note constraints set for power network and ground network)

42. Whether the spacing between Test Via and Test Pin is sufficient

43. Whether the thickness of the lamination and the scheme meet the design and processing requirements

44. Whether the impedance of all differential lines with characteristic impedance requirements has been calculated and controlled by rules