Inqanaba lokufaka idatha

1. Nokuba idatha efunyenwe kwinkqubo igqityiwe (kubandakanya umzobo wesikim. Ifayile ye-BRD, uluhlu lwezinto, PCB uyilo iinkcukacha kunye noyilo PCB okanye imfuneko utshintsho, standardization iinkcukacha kunye nenkqubo uyilo iinkcukacha)

2. Qiniseka ukuba itemplate ye-PCB ihlaziyiwe

3. Ensure that the positioning components of the template are correctly located

4.PCB design description and PCB design or change requirements, standardization requirements are clear

5. Qinisekisa ukuba izixhobo ezingavumelekanga kunye neendawo zokufaka iintambo kumzobo wesakhiwo ziboniswa kwitemplate yePCB

6. Thelekisa umzobo womzobo ukuqinisekisa ukuba ubukhulu kunye nokunyamezelana okuphawulwe kwi-PCB kuchanekile, kwaye inkcazo yomngxunya owenziwe ngentsimbi kunye nomngxunya ongagungqiyo ichanekile

7. Emva kokuqinisekisa ukuchaneka kwetemplate ye-PCB, kungcono ukuvala ifayile yesakhiwo ukunqanda ukushukunyiswa kukungasebenzi kakuhle

Okwesibini, emva kwenqanaba lokuhlola ubeko

A. Jonga izinto

8. Qinisekisa ukuba zonke iipakethi zezixhobo ziyahambelana nelayibrari emanyeneyo yenkampani nokuba ithala lencwadi lihlaziyiwe (jonga iziphumo ezisebenzayo nge-viewlog). Ukuba akunjalo, Hlaziya iiMpawu

9, ibhodi yomama kunye nebhodi esezantsi, ibhodi kunye nebhodi engasemva, qiniseka ukuba uphawu luyahambelana, indawo iyahambelana, isikhombisi sokudibanisa kunye nokuchongwa kwesikrini sesilika kuchanekile, kwaye ibhodi encinci ineendlela zokulwa nokusetyenziswa gwenxa, kunye nezinto ibhodi encinci kunye nebhodi yomama akufuneki iphazamise

10. Nokuba izinto zibekwe kwi-100%

11. Open place-bound for the TOP and BOTTOM layers of the device to see if DRC caused by overlap is allowed

12. Nokuba amanqaku kaMarko anele na kwaye ayimfuneko

13. Izinto ezinzima kufuneka zibekwe kufutshane nendawo yenkxaso ye-PCB okanye icala lenkxaso ukunciphisa i-warpage ye-PCB

14. Kungcono ukutshixa izixhobo ezinxulumene nolwakhiwo emva kokuba zilungisiwe ukuthintela ukungasebenzi kakuhle ekushukumiseni indawo

15. Within 5mm around the crimping socket, the front side is not allowed to have components whose height exceeds the height of the crimping socket, and the back side is not allowed to have components or solder joints

16. Qinisekisa ukuba ngaba ubeko lwesixhobo luyazifezekisa iimfuno zobuchwepheshe (jolisa kwi-BGA, i-PLCC kunye nesokethi yepatch)

17, izinto zeqokobhe lesinyithi, nikela ingqalelo ekhethekileyo ukuba ingangqubani namanye amacandelo, ukushiya indawo eyaneleyo

Izinto ezinxulumene nokunxibelelana kufuneka zibekwe kufutshane nonxibelelwano, kwaye umqhubi webhasi yangemva kufuneka abekwe kufutshane nesinxibelelanisi seenqwelo moya

19. Nokuba isixhobo se-CHIP kumgangatho we-wave soldering siguqulwe saba yiphakheji ye-wave soldering,

20. Whether there are more than 50 manual solder joints

21. Ukunyuka okuthe tye kufuneka kuthathelwe ingqalelo yokunyusa i-axial yezinto eziphezulu kwi-PCB. Leave room for sleeping. Kwaye jonga imowudi emiselweyo, njengekristal esisigxina iphedi

22. Qinisekisa ukuba kukho isithuba esaneleyo phakathi kwezixhobo kusetyenziswa isinki yokufudumeza kunye nezinye izixhobo, kwaye ujonge ukuphakama kwezixhobo eziphambili kububanzi besinki yobushushu.

B. Umsebenzi wokujonga

23. Whether the layout of digital circuit and analog circuit components of the digital-analog hybrid board has been separated, and whether the signal flow is reasonable

24, A / D abaguquli babekwa kwizahlulelo ze-analog.

25, clock device layout is reasonable

26. Nokuba ubeko lwezixhobo zesiginali yesantya esiphezulu lusengqiqweni

27, nokuba isixhobo esibulalayo sibekwe ngokufanelekileyo (umthombo wokudibanisa uthotho kufuneka ubekwe kwisiphelo sendlela yesiginali; Ukuxhathisa komtya okuphakathi kubekwe kwindawo esembindini; Ukuxhathisa uthotho lwetheminali kufuneka lubekwe esiphelweni sokufumana umqondiso)

28. Nokuba inani kunye nendawo yokuchithwa kwee-capacitors zezixhobo ze-IC zisengqiqweni

29. Imigca yemiqondiso ithatha iinqwelomoya ezinamanqanaba ahlukeneyo njengeenqwelomoya. Xa uwela lo mmandla wahlulwe ziinqwelomoya, nokuba amandla okudibanisa phakathi kweenqwelomoya kusondele kumda wendlela yomqondiso.

30. Nokuba ubeko lwesekethe yokhuseleko lusengqiqweni kwaye lulungele ukwahlulwa

31. Nokuba ngaba ifuse yombane webhodi ibekwe kufutshane nesinxibelelanisi kwaye akukho candelo lesekethe phambi kwayo

32. Qinisekisa ukuba umqondiso onamandla kunye nomqondiso obuthathaka (umahluko wamandla kwi-30dB) imijikelezo ilungiselelwe ngokwahlukeneyo

33. Nokuba izixhobo ezinokuchaphazela uvavanyo lwe-EMC zibekwe ngokwezikhokelo zoyilo okanye ukubhekisa kumava aphumeleleyo. Umzekelo: isekethe yokusetha kwakhona iphaneli kufuneka isondele kancinci kwiqhosha lokusetha kwakhona

C. umkhuhlane

I-34, yezinto ezinobuzaza bobushushu (kubandakanya amandla aphakathi olwelo, ukungcangcazela kwekristale) kude kangangoko kunokwenzeka kude nezinto zombane eziphezulu, irediyetha kunye neminye imithombo yobushushu.

35. Nokuba uyilo luyahlangabezana neemfuno zoyilo lobushushu kunye namajelo osasazo lobushushu (ngokwenkqubo yamaxwebhu ayiliweyo)

D. amandla

36. Jonga ukuba ngaba umbane we-IC ukude kakhulu kwi-IC

37. Nokuba ubeko lwe-LDO kunye nesekethe ejikelezileyo iyavakala

38. Is the circuit layout around the module power supply reasonable

39. Ngaba ubeko lulonke lonikezelo lwamandla lusengqiqweni

Izicwangciso zolawulo

40. Jonga ukuba ingaba zonke izithintelo zokulinganisa zongezwe ngokuchanekileyo kwiContraint Manager

41. Ngaba imigaqo yomzimba neyombane ibekwe ngokuchanekileyo (imiqobo yenqaku ebekelwe uthungelwano lwamandla kunye nenethiwekhi yomhlaba)

42. Nokuba isithuba phakathi koVavanyo Via kunye nePin yovavanyo sanele

43. Nokuba ubukhulu be-lamination kunye neskim ziyahlangabezana neemfuno zoyilo kunye nokulungiswa

44. Nokuba impedance yayo yonke imigca yokwahlulahlula eneemfuno zeempawu zempembelelo iye yabalwa yaza yalawulwa yimigaqo