I. ogbo ntinye data

1. Ma data enwetara na usoro ezuola (gụnyere eserese atụmatụ. Faịlụ BRD, ndepụta ihe, PCB Nkọwapụta imewe yana imebe PCB ma ọ bụ mgbanwe chọrọ, nkọwapụta ọkọlọtọ na nkọwapụta nhazi usoro)

2. Jide n’aka na ndebiri PCB bụ nke ọhụrụ

3. Ensure that the positioning components of the template are correctly located

4.PCB design description and PCB design or change requirements, standardization requirements are clear

5. Gbaa mbọ hụ na etinyere ngwaọrụ ndị amachibidoro na mpaghara wiring na eserese eserese na eserese PCB

6. Tulee eserese eserese iji gosi na nha na nnwere onwe akara na PCB ziri ezi, na nkọwapụta oghere mepere emepe na oghere na -adabaghị adaba ziri ezi.

7. Mgbe ekwenyechara nzizi nke ndebiri PCB, ọ kacha mma igbachi faịlụ nhazi ahụ ka ọ ghara ime ka misorụ onwe ya megharịa ya

Nke abụọ, mgbe usoro nyocha ahụ gachara

A. Lelee akụrụngwa

8. Kwenye ma ngwungwu ngwaọrụ niile dabara na ọba akwụkwọ jikọtara ọnụ nke ụlọ ọrụ yana ma emelitela ọbaakwụkwọ ngwugwu (lelee nsonaazụ na -agba ọsọ na nlele). Ọ bụrụ na ọ bụghị, melite Symbols

9, motherboard na okpuru osisi, bọọdụ na azụ azụ, gbaa mbọ hụ na akara ngosi kwekọrọ, ọnọdụ ya kwekọrọ, ntụnye njikọ na njirimara ihuenyo silk ziri ezi, okpuru okpuru osisi nwere ihe mgbochi mgbochi, yana ihe ndị dị na ya. sub-board na motherboard ekwesịghị igbochi

10. Ma etinyere ihe mejupụtara 100%

11. Open place-bound for the TOP and BOTTOM layers of the device to see if DRC caused by overlap is allowed

12. Ma akara Mark ezuola ma ọ dị mkpa

13. Ekwesịrị idobe ihe dị arọ n’akụkụ ebe nkwado PCB ma ọ bụ akụkụ nkwado iji belata mkpọsa PCB

14. Ọ kacha mma ka akpọchie ngwaọrụ ndị metụtara ihe ahụ mgbe emechara ha iji gbochie misoperation ibugharị ọnọdụ ahụ

15. Within 5mm around the crimping socket, the front side is not allowed to have components whose height exceeds the height of the crimping socket, and the back side is not allowed to have components or solder joints

16. Kwenye ma nhazi ngwaọrụ ahụ emezu ihe achọrọ teknụzụ (gbado anya na BGA, PLCC na soket patch)

17, ngwongwo shei ọla, lebara anya nke ọma ka ị ghara ịjikọ na ihe ndị ọzọ, ịhapụ ọnọdụ oghere zuru oke

18. Ekwesịrị idobe ihe ndị metụtara ihu na nso interface ahụ, na ekwesịrị idobe ọkwọ ụgbọ ala backplane n’akụkụ njikọ azụ.

19. Ma agbanwere ngwaọrụ CHIP nke dị n’elu mmiri na -efegharị efegharị ka ọ bụrụ ngwugwu ịgbagharị ọkụ,

20. Whether there are more than 50 manual solder joints

21. Ekwesịrị ịtụle nkwalite kwụ ọtọ maka itinye axial nke ihe ndị dị elu na PCB. Leave room for sleeping. Cheekwa echiche maka ọnọdụ kwụ ọtọ, dị ka kristal ofu

22. Gbaa mbọ hụ na enwere oghere zuru oke n’etiti ngwaọrụ ndị na -eji mgbanye ọkụ na ngwaọrụ ndị ọzọ, ma leba anya n’ịdị elu nke ngwaọrụ ndị bụ isi dị n’etiti oke ọkụ.

B. Nyocha ọrụ

23. Whether the layout of digital circuit and analog circuit components of the digital-analog hybrid board has been separated, and whether the signal flow is reasonable

24, A/D ntụgharị na -etinye n’ofe akụkụ analog.

25, clock device layout is reasonable

26. Ma nhazi nke ngwaọrụ mgbaama dị elu nwere ezi uche

27, ma etinyerela ọdụ ụgbọ ala ahụ nke ọma (ekwesịrị idobe usoro nsonye dabara na njedebe akara mbinye aka; A na -etinye nguzogide eriri dabara na etiti n’etiti ọnọdụ etiti; Ekwesịrị itinye nkwụchi usoro nke ọnụ ọnụ na njedebe nke mgbaama)

28. Ma ọnụ ọgụgụ na ọnọdụ nke decoupling capacitors nke ngwaọrụ IC nwere ezi uche

29. Ahịrị akara na -eburu ụgbọ elu nke ọkwa dị iche iche dịka ụgbọ elu nrụtụ aka. Mgbe ị na -agafe mpaghara ụgbọ elu kewara, ma njikọ njikọta n’etiti ụgbọ elu ntụnyere aka dị nso na mpaghara mgbagharị mgbaàmà.

30. Ma nhazi okirikiri nchedo nwere ezi uche ma dịkwa mma na nkewa

31. Ma etinyere fuse nke ike ọkọnọ bọọdụ n’akụkụ njikọ ahụ na enweghị akụkụ sekit n’ihu ya

32. Kwenye na edoziri akara ngosi siri ike na akara adịghị ike (ọdịiche ike 30dB) iche iche

33. Edebere ngwaọrụ ọ bụla nwere ike imetụta nnwale EMC dịka ntuziaka imewe si dị ma ọ bụ rụtụ aka na ahụmịhe na -aga nke ọma. Dịka ọmụmaatụ: okirikiri nrụpụta nke panel kwesịrị ịdị nso na bọtịnụ nrụpụta

C. ahụ ọkụ

34, maka ihe ndị nwere mmetụta na-ekpo ọkụ (gụnyere capacitance mmiri mmiri, ịma jijiji kristal) ka enwere ike pụọ na ngwa nwere nnukwu ike, radiator na isi ọkụ ndị ọzọ.

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D. ike

36. Lelee ma ọkụ eletrik IC dị anya na IC

37. Ma nhazi nke LDO na okirikiri gbara ya gburugburu nwere ezi uche

38. Is the circuit layout around the module power supply reasonable

39. Ọdịdị mkpokọta ọkụ eletrik nwere ezi uche

E. Ntọala Iwu

40. Lelee ma etinyegoro ihe mgbochi ịme anwansị nke ọma na njikwa Njikwa

A na -edobe iwu anụ ahụ na ọkụ eletrik nke ọma (mgbochi ndetu edobere maka netwọk ike na netwọkụ ala)

42. Ma oghere dị n’agbata Ule Via na Pin Pin ezuru

43. Ma ọkpụrụkpụ nke lamination na atụmatụ na -emezu nhazi na nhazi chọrọ

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