Isigaba sokufaka idatha

1. Ukuthi imininingwane etholwe kwinqubo iphelele (kufaka phakathi umdwebo wesikimu. Ifayela le-BRD, uhlu lwezinto ezibonakalayo, PCB ukucaciswa komklamo kanye ne-PCB design noma imfuneko yokushintsha, ukucaciswa kokumiswa kanye nenqubo yedizayini)

2. Qiniseka ukuthi isifanekiso se-PCB sisesikhathini

3. Ensure that the positioning components of the template are correctly located

4.PCB design description and PCB design or change requirements, standardization requirements are clear

5. Qinisekisa ukuthi amadivayisi angavumelekile nezindawo zokuhlanganisa izintambo kumdwebo wohlaka kuyabonakala kuthempulethi ye-PCB

6. Qhathanisa umdwebo wohlaka ukuze uqinisekise ukuthi ubukhulu kanye nokubekezelelana okuphawulwe ku-PCB kulungile, futhi nencazelo yomgodi oyinsimbi nomgodi ongalinganiselwe unembile

7. Ngemuva kokuqinisekisa ukunemba kwethempulethi ye-PCB, kungcono ukukhiya ifayela lesakhiwo ukugwema ukuhanjiswa ukungasebenzi kahle

Okwesibili, ngemuva kwesigaba sokuhlola ukwakheka

A. Hlola izingxenye

8. Qinisekisa ukuthi ngabe wonke amaphakheji wedivayisi ayahambisana yini nomtapo wezincwadi onobunye wenkampani nokuthi ngabe umtapo wolwazi wephakeji uvuselelwe (hlola imiphumela esebenzayo nge-viewlog). Uma kungenjalo, Buyekeza Izimpawu

9, i-motherboard kanye ne-sub-board, ibhodi kanye ne-backboard, qiniseka ukuthi isignali iyahambelana, isikhundla siyahambelana, inkomba yokuxhuma kanye nokuhlonza isikrini sikasilika kulungile, futhi ibhodi elincane linezinyathelo zokulwa nokufakwa kwe-misinsertion, nezinto ezikuyo ibhodi elincane nebhodi lomama akufanele liphazamise

10. Ukuthi izingxenye zibekwe 100%

11. Open place-bound for the TOP and BOTTOM layers of the device to see if DRC caused by overlap is allowed

12. Ukuthi iphuzu likaMark lanele futhi liyadingeka yini

13. Izinto ezisindayo kufanele zibekwe eduze nendawo yokusekela ye-PCB noma uhlangothi lokusekela ukunciphisa i-warpage ye-PCB

14. Kungcono ukukhiya amadivayisi ahlobene nokwakheka ngemuva kokuthi ahlelelwe ngenhloso yokuvimbela ukungasebenzi kahle ekunyakaziseni isikhundla

15. Within 5mm around the crimping socket, the front side is not allowed to have components whose height exceeds the height of the crimping socket, and the back side is not allowed to have components or solder joints

16. Qinisekisa ukuthi ukwakheka kwedivayisi kuyazifeza yini izidingo zobuchwepheshe (gxila ku-BGA, i-PLCC kanye nesokhethi yepeshi)

17, izingxenye zensimbi yegobolondo, unake ngokukhethekile ukuthi zingashayisani nezinye izingxenye, ukushiya isikhala esanele

Izinto ezihlobene nesixhumi esibonakalayo kufanele zibekwe eduze kwesixhumi esibonakalayo, futhi umshayeli webhasi yangemuva kufanele abekwe eduze kwesixhumi sendiza yangemuva

19. Kungakhathaliseki ukuthi idivayisi ye-CHIP ebusweni be-soldering surface iguqulwe yaba yiphakethe le-wave soldering,

20. Whether there are more than 50 manual solder joints

21. Ukufakwa okuvundlile kufanele kucatshangelwe ukufakwa kwe-axial kwezingxenye eziphakeme ku-PCB. Leave room for sleeping. Futhi cabanga ngemodi engaguquki, enjenge-crystal pad pad

22. Qiniseka ukuthi kunesikhala esanele phakathi kwamadivayisi kusetshenziswa isinki yokushisa namanye amadivayisi, futhi unake ukuphakama kwamadivayisi amakhulu ngaphakathi kwebanga lokushisa.

B. Ukuhlolwa komsebenzi

23. Whether the layout of digital circuit and analog circuit components of the digital-analog hybrid board has been separated, and whether the signal flow is reasonable

24, abaguquleli be-A / D babekwa kumahlukanisi we-analog.

25, clock device layout is reasonable

26. Whether the layout of high-speed signal devices is reasonable

27, noma ngabe idivayisi yokugcina ibekwe kahle yini (ukumelana kochungechunge lokufana komthombo kufanele kubekwe ekugcineni kwe-signal drive; Ukumelana kwentambo okumaphakathi kubekwe endaweni ephakathi; Ukuphikiswa kochungechunge lokufaniswa kwetheminali kufanele kubekwe ekugcineni kokutholwa kwesiginali)

28. Ukuthi inombolo nendawo yokwakhiwa kwama-capacitor wamadivayisi we-IC kunengqondo yini

29. Olayini bezimpawu bathatha izindiza ezinamazinga ahlukene njengezindiza eziyizethenjwa. Lapho unqamula isifunda sihlukaniswe izindiza, noma ngabe amandla okuxhuma phakathi kwezindiza eziyizethenjwa asondele esifundeni esihamba ngomzila.

30. Ukuthi ukuhlelwa kwesekethe yokuvikela kunengqondo yini futhi kunikela ukwahlukaniswa

31. Ukuthi ngabe i-fuse yamandla ebhodi ibekwe eduze kwesixhumi yini futhi akukho okuyingxenye yesifunda ngaphambi kwayo

32. Qinisekisa ukuthi amasiginali aqinile nesiginali engenamandla (umehluko wamandla 30dB) ahlelwe ngokwahlukana

33. Ukuthi amadivayisi angathinta ukuhlolwa kwe-EMC abekwa ngokuya ngemikhombandlela yokuklama noma ukubhekiswa kokuhlangenwe nakho okuyimpumelelo. Isibonelo: isekethe yokusetha kabusha iphaneli kufanele isondele kancane kunkinobho yokusetha kabusha

C. umkhuhlane

34, yezinto ezizwela ukushisa (kufaka phakathi i-liquid medium capacitance, i-crystal vibration) kude ngangokunokwenzeka kude nezinto ezinamandla amakhulu, irediyetha neminye imithombo yokushisa

35. Ukuthi isakhiwo sihlangabezana yini nezidingo zedizayini eshisayo neziteshi zokushabalalisa ukushisa (ngokwenqubo yokwakhiwa kwemibhalo)

D. amandla

36. Hlola ukuthi ingabe ugesi we-IC ukude kakhulu ne-IC

37. Ukuthi ukuhlelwa kwe-LDO nesekethe elizungezile kunengqondo yini

38. Is the circuit layout around the module power supply reasonable

39. Ingabe ukwakheka okuphelele kokuphakelwa kwamandla kunengqondo

Izilungiselelo ze-Rule

40. Bheka ukuthi ngabe zonke izingqinamba zokulingisa zingezwe kahle kuMphathi Wezingqinamba

41. Ingabe imithetho engokomzimba nekagesi isethwe kahle (izingqinamba zenothi ezisethelwe inethiwekhi yamandla nenethiwekhi yomhlaba)

42. Ukuthi isikhala phakathi kwe-Test Via ne-Test Pin sanele yini

43. Ukuthi ukushuba kwe-lamination kanye ne-scheme kuyahlangabezana yini nezidingo zokuklama nokucubungula

44. Ukuthi i-impedance yayo yonke imigqa eyehlukanisiwe enezidingo zesici se-impedance ibaliwe futhi ilawulwa yimithetho