Mabhodhi e-lead-tin anodiwa muzvigadzirwa zvakawanda, kunyanya PCB multilayer board nemhando dzakawanda uye shoma shoma. Kana iyo inopisa mhepo yekuenzanisa nzira inoshandiswa, mari yekugadzira ichawedzerwa, kutenderera kwekugadzirisa kuchave kwakareba, uye kuvaka kuchave kwakaoma zvikuru. Nokuda kwechikonzero ichi, mahwendefa e-lead-tin anowanzoshandiswa mukugadzira, asi kune mamwe matambudziko ehutano panguva yekugadzirisa. Dambudziko guru remhando ndeyePCB delamination uye mablistering. Ndezvipi zvikonzero? Chikonzero che:

Zvikonzero zvePCB mhando matambudziko

1. Kudzvinyirira kusina kunaka kunokonzera mhepo, unyoro uye zvinosvibisa kupinda;

2. Munguva yekutsikirira, nekuda kwekushayikwa kwekupisa, kupfupika kutenderera, hurombo husina kunaka hwe prepreg, uye basa risiri iro remapepanhau, zvichikonzera matambudziko nedhigirii rekurapa;

3. Kusaita blackening kurapwa kwemukati mutsara kana nzvimbo yakasvibiswa panguva yekusviba;

4. Iyo yemukati ply kana prepreg yakasvibiswa;

5. Kuyerera kweglue kusina kukwana;

6. Yakawandisa glue inoyerera-inenge glue yese iri mu prepreg inoburitswa kunze kwebhodhi;

7. Panyaya yezvinodiwa zvisingashandisi, bhodhi remukati remukati rinofanira kuderedza kutaridzika kwemhangura huru (nokuti simba rekubatanidza resin kune mhangura yemhangura yakanyanya kuderera kupfuura simba rekubatanidza resin uye resin);

8. Kana kushandiswa kwevacuum kunoshandiswa, kudzvinyirira hakuna kukwana, izvo zvinokuvadza kuyerera kweglue uye kunamatira (kushungurudzika kwakasara kwebhodhi re-multilayer rakamanikidzwa nemhepo yakaderera zvakare shoma).

Kune mafirimu akaonda, nokuti huwandu hweglue hushoma, dambudziko rekusakwana resin resin rinowanzoitika, saka kushandiswa kwemafirimu akaonda kunofanira kubatwa zvakanyatsonaka. Parizvino, chikamu chendiro dzakatetepa chiri kuramba chichikwira nekukwira. Kuti uchengetedze kugadzikana kwehupamhi, kuumbwa kwemafekitari ezvigadzirwa zvepasi kunogadziriswa kune kutungamira kwekuyerera kwakaderera. Kuti uvandudze zvinhu zvemuviri zvezvinhu, mafirita akasiyana anowedzerwa kune resin formulations. Panguva yekushanda kwe substrate, dzivisa iyo colloid inowira panguva yekushanda, iyo inogona kukonzera dambudziko remhepo inoputika paplate yepasi inokonzerwa neresin yakaonda kana cream layer.