Mukugadzira nzira ye yakadhindwa redunhu bhodhi, kumwe kukanganisa kwemaitiro kunowanzosangana, sekudonha kubva patambo dzemhangura dzePCB circuit boards (inowanzonziwo dumping mhangura), iyo inokanganisa kunaka kwechigadzirwa.

PCB redunhu bhodhi process zvinhu:

1. Iyo foil yemhangura yakanyanyisa-etched. Iwo emagetsi emagetsi emhangura emhangura anoshandiswa pamusika anowanzo ari ega-side galvanized (anowanzozivikanwa seashing foil) uye imwechete-sided copper plating (inowanzozivikanwa sered foil). Mhangura yakakandwa yakajairika inogaro galvanized copper pamusoro pe70um. Foil, foil tsvuku uye madota foil pazasi 18um hazvina kunyanya kurambwa nebatch copper.

2. Kudhumhana kunoitika munharaunda muPCB process, uye waya yemhangura inoparadzaniswa kubva kune substrate nekunze mechanical simba. Kuita kwakashata uku kusamira zvakanaka kana kutarisika, waya yemhangura ichave yakamonyaniswa zviri pachena, kana kukwenya/kukanganisa mamaki munzira imwe chete. Bvisa tambo yemhangura pane yakakanganisika uye utarise iyo yakaoma pamusoro pefoil yemhangura, unogona kuona kuti ruvara rwekushata kwepepi yemhangura ndeyakajairika, hakuzove nekukukurwa kwedivi, uye simba rekupemha foil yemhangura yakajairika.

3. Iyo PCB yedunhu dhizaini haina musoro, uye yakakora yemhangura foil inoshandiswa kugadzira iyo yakaonda dunhu, iyo ichaitawo kuti dunhu rive rakanyanyisa uye mhangura icharaswa kure. 2. Zvikonzero zvekugadzira laminate process: Mumamiriro akajairwa, chero bedzi laminate ichipisa yakatsikirirwa kweanopfuura maminetsi makumi matatu, foil yemhangura uye prepreg zvakanyatsobatanidzwa, saka kudzvanya hakuzokanganisa foil yemhangura uye substrate mune laminate. Kusunga simba. Nekudaro, mukuita kurongedza uye kurongedza laminates, kana iyo PP yakasvibiswa kana iyo matte pamusoro pefoiri yemhangura ikakuvadzwa, zvinokonzeresa kusakwana kwesimba rekubatanidza pakati pefoiri yemhangura uye substrate mushure mekugadzika, zvichikonzera kumira (chete kune mahwendefa mahombe) Mazwi) kana tambo dzemhangura dzinodonha pano neapo, asi kusimba kweganda refoiri pedyo newaya dzakadzimwa hakuzove zvisina kujairika. 30. Zvikonzero zvelaminate raw materials: 3. Kazhinji electrolytic copper foils zvose zvigadzirwa zvakave nemarara kana mhangura-yakaputirwa pamvere dzemakwai. Kana iyo yepamusoro kukosha kweiyo foil yemvere isina kujairika panguva yekugadzira, kana kana galvanizing / yemhangura plating, iyo plating crystal bazi rakashata, zvichikonzera mhangura Iyo peel simba reiyo foil pachayo haina kukwana. Mushure meiyo foil yakaipa yakatsikirirwa muPCB uye plug-in mufekitori yemagetsi, waya yemhangura inodonha nekuda kwekukanganisa kwesimba rekunze. Rudzi urwu rwekurambwa kwemhangura kwakashata haruzokonzere kuonda kweparutivi mushure mekusvuura waya yemhangura kuti uone kushata kwefoiri yemhangura (kureva kuti, nzvimbo yakatarisana neiyo substrate), asi kusimba kweganda refoiri yese yemhangura kuchave. murombo zvikuru. 1. Kusagona kuchinjika kwefoiri yemhangura neresin: Mamwe maramina ane zvinhu zvakakosha, senge HTg mapepa, anoshandiswa ikozvino nekuda kweakasiyana masisitimu eresin. Mumiririri wekurapa anoshandiswa anowanzo PN resin, uye resin molecular cheni chimiro chiri nyore. Iyo dhigirii yekuyambuka-yakaderera, uye zvinodikanwa kushandisa foil yemhangura ine yakakosha peak kuti ienderane nayo. Kana uchigadzira laminates, kushandiswa kwemhangura foil hakuenderane neresin system, zvichikonzera kusakwana kusvuura simba repepa resimbi-clad metal foil, uye kushayikwa kwewaya yemhangura pakuiswa.