PCB ʻO ka ʻenehana lapaʻau ili e pili ana i ke kaʻina hana o ka hana ʻana i kahi papa honua ma nā ʻāpana PCB a me nā wahi pili uila i ʻokoʻa mai ka mechanical, physical a me nā waiwai kemika o ka substrate. ʻO kāna kumu e hōʻoia i ka solderability maikaʻi a i ʻole nā ​​​​mea uila o ka PCB. No ka mea e noho ana ke keleawe ma ke ʻano o nā oxides i ka lewa, e hoʻopilikia nui i ka solderability a me nā waiwai uila o ka PCB, pono ia e hana i ka mālama ʻana ma ka PCB.

I kēia manawa, penei nā ʻano hana lapaʻau maʻamau:

1. Hoʻopalike ea wela

Hoʻopili ʻia ka ʻili o ka PCB me ka solder tin-lead molten a palahalaha me ka ea i hoʻopaʻa ʻia i hoʻomehana ʻia (puhi palahalaha) e hana i kahi papa uhi i kū i ke keleawe oxidation a hāʻawi i ka solderability maikaʻi. I ka wā o ka pae ʻana o ka ea wela, hoʻokumu ka solder a me ke keleawe i mea metala keleawe-tin ma ka hui, a ʻo ka mānoanoa ma kahi o 1 a 2 mils;

2. Organic Anti-oxidation (OSP)

Ma ka ʻili keleawe maʻemaʻe, hoʻoulu ʻia kahi kiʻiʻoniʻoni kūlohelohe. ʻO kēia papa o ka kiʻiʻoniʻoni he anti-oxidation, ke kū’ēʻana i ka wela, a me ke kū’ēʻana i ka makū no ka paleʻana i kaʻili keleawe mai ka’ōpala (oxidation a sulfidation, a me nā mea’ē aʻe) ma kahi maʻamau; i ka manawa like, pono e kōkua maʻalahi i ka welding ma hope o ka wela kiʻekiʻe.

3. Electroless nickel gula

Hoʻopili ʻia kahi papa mānoanoa o ka nickel-gold alloy me nā waiwai uila maikaʻi ma ka ʻili keleawe a hiki ke pale i ka PCB no ka manawa lōʻihi. ʻAʻole like me OSP, i hoʻohana wale ʻia ma ke ʻano he pale pale anti-rust, hiki ke hoʻohana i ka hoʻohana lōʻihi o ka PCB a hoʻokō i ka hana uila maikaʻi. Eia kekahi, loaʻa iā ia ke ahonui i ke kaiapuni i loaʻa ʻole i nā kaʻina hana lapaʻau ʻē aʻe;

4. Kālā Immersion Chemical

Ma waena o OSP a me electroless nickel/immersion gula, ʻoi aku ka maʻalahi o ke kaʻina hana. Ke ʻike ʻia i ka wela, ka haʻahaʻa a me ka pollution, hiki iā ia ke hāʻawi i ka hana uila maikaʻi a mālama i ka solderability maikaʻi, akā e nalowale kona luster. No ka mea, ʻaʻohe nickel ma lalo o ka ʻāpana kālā, ʻaʻole i loaʻa i ke kālā immersion ka ikaika kino maikaʻi o ka nickel electroless / immersion gula;

5. Electroplating nickel gula

Hoʻopili ʻia ka conductor ma ka ʻili PCB me kahi papa nickel a laila electroplated me kahi papa gula. ʻO ke kumu nui o ka nickel plating ʻo ia ka pale ʻana i ka diffusion ma waena o ke gula a me ke keleawe. ʻElua ʻano o ke gula nickel electroplated: ʻo ke gula maʻemaʻe (ke gula maʻemaʻe, ke hōʻike nei ke gula ʻaʻole ia he nani) a me ka paʻa gula paʻa (ʻo ka ʻili a paʻakikī, ʻaʻahu-pale, aia nā cobalt a me nā mea ʻē aʻe, a me ka ʻili. ʻoi aku ka mālamalama). Hoʻohana nui ʻia ke gula palupalu no ka uea gula i ka wā o ka puʻupuʻu chip; Hoʻohana nui ʻia ke gula paʻakikī no ka hoʻopili uila ma nā wahi kūʻai ʻole (e like me nā manamana gula).

6. PCB hybrid ili lapaʻau ‘enehana

E koho i ʻelua a ʻoi aku paha nā ʻano hana lapaʻau no ka mālama ʻana i ka ʻili. ʻO nā ʻano maʻamau: Immersion Nickel Gold + Anti-oxidation, Electroplating Nickel Gold + Immersion Nickel Gold, Electroplating Nickel Gold + Hot Air Leveling, Immersion Nickel Gold + Hot Air Leveling.

ʻO ka pae ʻana o ka ea wela (lead-free/leaded) ʻo ia ke ʻano maʻamau a ʻoi aku ka liʻiliʻi o nā lapaʻau āpau āpau, akā e ʻoluʻolu e hoʻolohe i nā hoʻoponopono RoHS o EU.

RoHS: ʻO RoHS kahi maʻamau i hoʻokumu ʻia e nā kānāwai EU. ʻO kona inoa piha ʻo “Restriction of Hazardous Substances” (Restriction of Hazardous Substances). Ua hoʻokō ʻia ka maʻamau ma Iulai 1, 2006, a ua hoʻohana nui ʻia e hoʻohālikelike i nā mea a me ka hana ʻana i nā kūlana o nā huahana uila a me nā uila, e ʻoi aku ka maikaʻi o ke olakino kanaka a me ka mālama ʻana i ke kaiapuni. ʻO ke kumu o kēia maʻamau ka hoʻopau ʻana i ʻeono mau mea e pili ana i ke alakaʻi, mercury, cadmium, hexavalent chromium, polybrominated biphenyl a me polybrominated diphenyl ethers i nā huahana uila a me ka uila, a ua kuhikuhi pono ʻo ia ʻaʻole hiki ke ʻoi aku ka nui o ke alakaʻi ma mua o 0.1%.