PCB itekhnoloji yonyango lomphezulu ibhekiselele kwinkqubo yokwenza umaleko owenziwe ngobuqhetseba kumalungu e-PCB kunye neendawo zoqhagamshelo lombane olwahlukileyo kumatshini, iipropathi zomzimba kunye neekhemikhali zesubstrate. Injongo yalo kukuqinisekisa solderability elungileyo okanye iimpawu zombane PCB. Ngenxa yokuba ubhedu ludla ngokubakho ngendlela yeeoksidi emoyeni, nto leyo echaphazela kakhulu ukuthengiswa kunye neempawu zombane zePCB, kuyimfuneko ukwenza unyango olungaphezulu kwi-PCB.

Okwangoku, iindlela zonyango eziqhelekileyo zomphezulu zezi zilandelayo:

1. Umgangatho womoya oshushu

Umphezulu we-PCB uqatywe nge-solder ye-tin-lead etyhidiweyo kwaye yahlwaywa ngomoya ofudumeleyo ocinezelekileyo (umcaba ovuthelweyo) ukuze wenze umaleko wokugquma okwaziyo ukumelana ne-oxidation yobhedu kwaye unikeze ukuthengiselana okulungileyo. Ngethuba lokulinganisa umoya oshushu, i-solder kunye nobhedu zenza i-copper-tin metal compound kwi-junction, kwaye ubukhulu bu malunga ne-1 ukuya kwi-2 mils;

2. I-Organic Anti-oxidation (OSP)

Kumhlaba wobhedu ococekileyo ongenanto, ifilimu ephilayo ikhuliswa ngamachiza. Olu luhlu lwefilimu lune-anti-oxidation, ukuxhathisa ukutshatyalaliswa kobushushu, kunye nokuchasana nomswakama ukukhusela ubuso bobhedu kwi-rust (i-oxidation okanye i-sulfidation, njl.) kwindawo eqhelekileyo; ngelo xesha, kufuneka incediswe ngokulula kwi-welding elandelayo ukushisa okuphezulu I-flux ikhutshwe ngokukhawuleza ukuze iququzelele i-welding;

3. Igolide yenikeli engenambane

Umaleko oshinyeneyo we-nickel-gold alloy eneempawu ezilungileyo zombane usongelwe kumphezulu wobhedu kwaye unokukhusela iPCB ixesha elide. Ngokungafaniyo ne-OSP, esetyenziswa kuphela njenge-anti-rust barrier layer, inokuba luncedo ekusebenziseni ixesha elide le-PCB kunye nokufezekisa ukusebenza kakuhle kombane. Ukongeza, ikwanayo nokunyamezelana nokusingqongileyo ukuba ezinye iinkqubo zonyango ezingaphezulu azinayo;

4. ISilivere yokuntywiliselwa kwemichiza

Phakathi kwe-OSP kunye ne-electroless nickel / igolide yokuntywila, inkqubo ilula kwaye ikhawuleza. Xa ibonakaliswe kubushushu, ukufuma kunye nongcoliseko, isenokubonelela ngokusebenza kakuhle kombane kwaye igcine i-solderability entle, kodwa iya kulahlekelwa ukuqaqamba kwayo. Ngenxa yokuba akukho nickel phantsi komgangatho wesilivere, isilivere yokuntywiliselwa ayinawo amandla afanelekileyo omzimba we-nickel engena-electro / igolide yokuntywiliselwa;

5. Electroplating nickel igolide

I-conductor kumphezulu we-PCB i-electroplated kunye nomaleko we-nickel kwaye emva koko i-electroplated ngomaleko wegolide. Injongo ephambili ye-nickel plating kukuthintela ukusasazwa phakathi kwegolide kunye nobhedu. Kukho iindidi ezimbini zegolide ye-nickel ene-electroplated: igolide ethambileyo (igolide esulungekileyo, igolide ibonisa ukuba ayibonakali iqaqambile) kunye negolide eqinile (umphezulu ugudile kwaye uqinile, awunxibi, unecobalt kunye nezinye izinto, kunye nomphezulu. ibonakala iqaqambile). Igolide ethambileyo isetyenziswa ikakhulu kucingo lwegolide ngexesha lokupakishwa kwetshiphu; igolide eqinileyo isetyenziswa ikakhulu kuqhagamshelo lombane kwiindawo ezingaxutywanga (njengeminwe yegolide).

6. Iteknoloji yonyango lwe-PCB exutyiweyo

Khetha iindlela ezimbini okanye ngaphezulu zonyango olungaphezulu kunyango lomphezulu. Iifom eziqhelekileyo zezi: I-Nickel ye-Immersion Gold + i-Anti-oxidation, i-Electroplating Nickel Gold + I-Nickel ye-Nickel ye-Electroplating, i-Electroplating Nickel Gold + i-Hot Air Leveling, i-Nickel ye-Immersion Gold + i-Hot Air Leveling.

Umgangatho womoya oshushu (okungenalo ilothe/okukhokelayo) yeyona ndlela ixhaphakileyo kwaye inexabiso eliphantsi kulo lonke unyango lomphezulu, kodwa nceda unikele ingqalelo kwimithetho ye-EU’s RoHS.

I-RoHS: I-RoHS ngumgangatho osinyanzelo osekwe ngumthetho we-EU. Igama layo elipheleleyo lithi “Ukuthintelwa kwezinto ezinobungozi” (Ukuthintelwa kwezinto ezinobungozi). Umgangatho uphunyezwe ngokusemthethweni ngomhla we-1 kaJulayi, i-2006, kwaye isetyenziselwa ukulungelelanisa izinto kunye nemigangatho yenkqubo yeemveliso zombane kunye nombane, okwenza kube lula ngakumbi kwimpilo yabantu kunye nokukhuselwa kokusingqongileyo. Injongo yalo mgangatho kukuphelisa izinto ezintandathu ezibandakanya ilothe, i-mercury, i-cadmium, i-hexavalent chromium, i-polybrominated biphenyls kunye ne-polybrominated diphenyl ethers kwiimveliso zombane kunye ne-elektroniki, kwaye ichaza ngokukodwa ukuba umxholo okhokelayo awunakudlula i-0.1%.