A amfani da Farashin PCB

Bari mu dubi tasirin sosai. Ƙara yawan fakitin yana ba mu damar rage hanyoyin lantarki tsakanin abubuwan. Tare da HDI, mun ƙara adadin tashoshin wayoyi a cikin yadudduka na ciki na PCB, don haka rage jimlar adadin yadudduka da ake buƙata don ƙira. Rage adadin yadudduka na iya sanya ƙarin haɗin kai a kan jirgi ɗaya da inganta sanyawa, wayoyi da haɗi. From there, we can focus on a technique called interconnect per Layer (ELIC), which helps design teams move from thicker boards to thinner flexible ones to maintain strength while allowing the HDI to see functional density.

HDI PCB rely on lasers rather than mechanical drilling. In turn, the HDI PCB design results in a smaller aperture and smaller pad size. Rage buɗewa ya ba da damar ƙungiyar ƙira ta ƙara shimfidar yankin hukumar. Rage hanyoyin wutar lantarki da ba da damar ƙarin wayoyi masu ƙarfi suna haɓaka amincin siginar ƙira da haɓaka aikin sigina. Muna samun ƙarin fa’ida a cikin yawa saboda muna rage damar shigar da matsalolin matsalolin haɓaka.

Tsarin HDB PCB ba sa amfani da ramuka, amma makafi da ramukan da aka binne. Tsaye da madaidaicin sanya jana’iza da ramukan makafi yana rage matsin lamba na injin akan farantin kuma yana hana kowane damar warkewa. Bugu da ƙari, zaku iya amfani da ramukan da aka tara don haɓaka wuraren haɗin kai da haɓaka dogaro. Amfani da ku akan pads na iya rage asarar sigina ta rage jinkirin giciye da rage tasirin cutar.

Ƙirƙirar HDI yana buƙatar haɗin gwiwa

Tsarin ƙira (DFM) yana buƙatar tunani, madaidaicin tsarin ƙirar PCB da daidaitaccen sadarwa tare da masana’antun da masana’antun. Kamar yadda muka ƙara HDI a cikin fayil ɗin DFM, hankali ga daki -daki a ƙira, ƙira, da matakan ƙira ya zama mafi mahimmanci kuma dole ne a magance batutuwan taro da gwaji. A taƙaice, ƙira, ƙerawa da aiwatarwa na HDI PCBS yana buƙatar haɗin gwiwa tare da kulawa ga takamaiman dokokin DFM da suka shafi aikin.

Ofaya daga cikin mahimman fannonin ƙirar HDI (amfani da hakowa na laser) na iya ƙetare ƙarfin mai ƙera, mai tarawa, ko mai ƙira, kuma yana buƙatar sadarwar jagora game da daidaituwa da nau’in tsarin hakowa da ake buƙata. Saboda ƙimar buɗewa ta ƙasa da ƙimar shimfidar wuri mai girma na HDI PCBS, ƙungiyar ƙira dole ne ta tabbatar da cewa masana’antun da masana’antun na iya saduwa da taro, sake yin aiki da buƙatun buƙatun ƙirar HDI. Don haka, ƙungiyoyin ƙira da ke aiki akan ƙirar HDI PCB dole ne su ƙware a cikin dabaru masu rikitarwa da ake amfani da su don samar da allon.

Sanin kayan aikin da’irar ku da bayanai dalla -dalla

Saboda samar da HDI yana amfani da nau’ikan hanyoyin hakowa na laser daban -daban, tattaunawa tsakanin ƙungiyar ƙira, mai ƙira da masana’anta dole ne su mai da hankali kan nau’in allon lokacin tattauna batun hakowa. Aikace -aikacen samfur wanda ke haifar da tsarin ƙira na iya samun buƙatun girma da nauyi waɗanda ke motsa tattaunawar ta wata hanya ko wata. Manyan aikace -aikacen mitar na iya buƙatar kayan ban da daidaitattun FR4. Bugu da ƙari, yanke shawara game da nau’in kayan FR4 yana shafar yanke shawara game da zaɓin tsarin hakowa ko wasu albarkatun masana’antu. Yayin da wasu tsarin ke hakowa ta hanyar tagulla cikin sauƙi, wasu ba sa shiga cikin filayen gilashi akai -akai.

Baya ga zaɓar nau’in kayan da ya dace, ƙungiyar ƙira dole ne ta tabbatar cewa mai ƙera da masana’anta na iya amfani da madaidaicin farantin faifai da dabarun sakawa. Tare da yin amfani da hakowa na laser, ramin buɗewa yana raguwa kuma ramin zurfin ramukan da aka yi amfani da shi don murɗa cikawa yana raguwa. Kodayake faranti masu kauri suna ba da damar ƙaramin buɗewa, buƙatun injin na aikin na iya ƙayyade faranti mafi ƙanƙanta waɗanda ke iya yin rauni a ƙarƙashin wasu yanayin muhalli. Dole ƙungiyar ƙira ta bincika cewa mai ƙera yana da ikon yin amfani da fasahar “interconnect Layer” da haƙa ramuka a daidai zurfin, da kuma tabbatar da cewa maganin sinadarin da ake amfani da shi don yin amfani da wutar lantarki zai cika ramukan.

Amfani da fasahar ELIC

DESIGN na HDI PCBS a kusa da fasahar ELIC ya ba ƙungiyar ƙira damar haɓaka PCBS masu ci gaba, waɗanda suka haɗa da yadudduka da yawa na tarin jan ƙarfe cike da madara a cikin kushin. Sakamakon ELIC, ƙirar PCB na iya amfani da fa’ida mai yawa, hadaddun haɗe-haɗe da ake buƙata don da’irori masu saurin gudu. Saboda ELIC yana amfani da microholes cike da jan ƙarfe don haɗawa, ana iya haɗa shi tsakanin kowane yadudduka biyu ba tare da raunana hukumar da’irar ba.

Zaɓin ɓangaren yana shafar shimfidawa

Duk wani tattaunawa tare da masana’antun da masana’antun dangane da ƙirar HDI suma ya kamata su mai da hankali kan madaidaicin shimfidar abubuwan da ke da ƙarfi. Zaɓin abubuwan da aka gyara yana shafar faɗin wayoyi, matsayi, tari da girman rami. Misali, ƙirar HDI PCB galibi sun haɗa da tsararren ƙwallon ƙwallon ƙwallon ƙafa (BGA) da BGA mai nisan gaske wanda ke buƙatar tserewa fil. Dole ne a gane abubuwan da ke lalata wutan lantarki da mutuncin sigina gami da mutuncin hukumar a lokacin amfani da waɗannan na’urori. Waɗannan abubuwan sun haɗa da samun keɓancewar da ta dace tsakanin saman da ƙasa don rage raɗaɗin juna da sarrafa EMI tsakanin yadudduka siginar ciki.Abubuwan da ke da alaƙa da alama za su taimaka hana damuwa mara daidaituwa akan PCB.

Kula da sigina, iko da mutuncin jiki

Baya ga inganta mutuncin sigina, Hakanan zaka iya haɓaka amincin ikon. Saboda HDB PCB tana motsa murfin ƙasa kusa da farfajiya, an inganta amincin ikon. Layer na saman jirgin yana da faɗin ƙasa da mai samar da wutar lantarki, wanda za a iya haɗa shi da layin ƙasa ta hanyar ramukan makafi ko microholes, kuma yana rage yawan ramukan jirgin.

HDI PCB yana rage adadin ramukan ta cikin layin jirgin. Hakanan, rage yawan ramuka a cikin jirgin wutar lantarki yana ba da manyan fa’idodi guda uku:

Yankin jan ƙarfe mafi girma yana ciyar da AC da DC a cikin fil ɗin guntu

L juriya yana raguwa a cikin hanyar yanzu

L Saboda ƙarancin haɓaka, madaidaicin madaidaicin halin yanzu yana iya karanta fil ɗin wutar.

Wani mahimmin batun tattaunawa shine a kiyaye mafi ƙarancin faɗin layin, tazara mai aminci da daidaiton waƙa. A kan fitowar ta ƙarshe, fara cimma kaurin jan ƙarfe iri ɗaya da daidaiton wayoyi yayin aikin ƙira kuma ci gaba da aiwatar da ƙira da ƙira.

Rashin amintaccen tazara na iya haifar da ragowar fina -finai a yayin aikin fim ɗin bushewar ciki, wanda zai iya haifar da gajerun da’irori. A ƙasa mafi ƙarancin faɗin layin kuma na iya haifar da matsaloli yayin aiwatar da rufi saboda rauni mai ƙarfi da buɗewa. Ƙungiyoyin ƙira da masana’antun dole ne su yi la’akari da riƙe daidaiton waƙa a matsayin hanyar sarrafa ƙarancin siginar siginar.

Kafa da amfani da takamaiman dokokin ƙira

Tsarin shimfida mai yawa yana buƙatar ƙaramin girma na waje, mafi kyawun wayoyi da tazara mai ƙarfi, sabili da haka yana buƙatar tsarin ƙirar daban. Tsarin masana’antu na HDI PCB ya dogara da hakowa na laser, CAD da software na CAM, hanyoyin sarrafa kai tsaye na laser, kayan aikin masana’antu na musamman, da ƙwarewar mai aiki. Nasarar dukkan tsarin ya dogara da sashi akan ƙa’idodin ƙira waɗanda ke gano buƙatun rashin ƙarfi, faɗin jagora, girman rami, da sauran abubuwan da ke shafar shimfidar. Developing detailed design rules helps select the right manufacturer or manufacturer for your board and lays the foundation for communication between teams.