1. BT cob
Lub npe tag nrho ntawm BT cob yog “bismaleimide triazine resin”, uas yog tsim los ntawm Mitsubishi Gas Company ntawm Nyij Pooj. Txawm hais tias lub sijhawm patent ntawm BT resin tau tas sijhawm, Mitsubishi Gas Company tseem nyob hauv txoj haujlwm tseem ceeb hauv ntiaj teb hauv R & D thiab thov BT resin. BT resin muaj ntau qhov zoo xws li Tg siab, tiv tshav kub, tiv taus ya raws, tsis tshua muaj dielectric (DK) thiab poob qis (DF). Txawm li cas los xij, vim yog cov iav fiber ntau txheej, nws nyuaj dua li FC substrate ua los ntawm ABF, teeb meem teeb meem thiab teeb meem nyuaj hauv laser drilling, nws tsis tuaj yeem ua tau raws li qhov xav tau ntawm cov kab zoo, tab sis nws tuaj yeem ruaj khov qhov loj me thiab tiv thaiv kev nthuav dav cua sov thiab txias txias los ntawm cuam tshuam rau cov kab tawm los, Yog li ntawd, BT cov ntaub ntawv feem ntau yog siv rau network chips thiab programmable logic chips nrog kev ntseeg siab xav tau. Tam sim no, BT substrates feem ntau siv hauv xov tooj ntawm tes MEMS chips, kev sib txuas lus chips, nco chips thiab lwm yam khoom lag luam. Nrog kev txhim kho sai ntawm LED chips, daim ntawv thov BT substrates hauv LED ntim ntim kuj tseem tsim tawm sai.

2 、ABF
ABF cov khoom yog cov khoom siv coj los tsim thiab tsim los ntawm Intel, uas yog siv rau kev tsim cov khoom lag luam qib siab xws li ntxeev nti. Piv nrog BT substrate, ABF cov khoom tuaj yeem siv ua IC nrog cov kab hluav taws xob nyias thiab haum rau tus lej tus lej siab thiab kis tau zoo. Nws feem ntau yog siv rau cov qib high-end loj xws li CPU, GPU thiab nti teeb. ABF tau siv los ua cov khoom siv txheej ntxiv. ABF tuaj yeem txuas ncaj qha mus rau cov ntawv tooj liab txheej hauv qab raws li kev siv hluav taws xob yam tsis muaj cua sov txheej txheem. Yav dhau los, abffc muaj teeb meem ntawm tuab. Txawm li cas los xij, vim yog siv tshuab thev naus laus zis ntau ntxiv ntawm tooj liab ntawv ci hauv av, abffc tuaj yeem daws qhov teeb meem ntawm tuab tuab ntev li nws tau txais phaj nyias. Thaum ntxov, feem ntau ntawm CPUs ntawm ABF cov laug cam tau siv hauv khoos phis tawj thiab game consoles. Nrog kev nce ntawm cov xov tooj ntse thiab kev hloov pauv ntim tshuab, ABF kev lag luam ib zaug poob mus rau qhov dej qis. Txawm li cas los xij, nyob rau xyoo tsis ntev los no, nrog kev txhim kho network nrawm thiab kev siv thev naus laus zis, cov ntawv thov tshiab ntawm kev ua kom muaj txiaj ntsig zoo tau tshwm tuaj, thiab qhov kev thov rau ABF tau nthuav dav dua. Los ntawm qhov kev xav ntawm kev lag luam hloov pauv, ABF cov txheej txheem tuaj yeem ua raws li qhov nrawm ntawm cov khoom siv hluav taws xob zoo tshaj plaws, ua tau raws li qhov xav tau ntawm txoj kab nyias, nyias kab dav / kab nrug, thiab kev lag luam kev loj hlob tuaj yeem xav tau yav tom ntej.
Muaj peev xwm tsim khoom tsawg, cov thawj coj hauv kev lag luam pib nthuav kev tsim khoom. Thaum lub Tsib Hlis 2019, Xinxing tshaj tawm tias nws yuav tsum nqis peev 20 billion yuan los ntawm 2019 txog 2022 txhawm rau nthuav dav kev txiav txim siab siab IC cladding carrier cog thiab nquag tsim ABF substrates. Hais txog lwm cov nroj tsuag hauv Taiwan, jingshuo xav kom hloov pauv cov khoom thauj khoom hauv chav kawm mus rau ABF cov khoom lag luam, thiab Nandian tseem tab tom ua kom muaj peev xwm tsim khoom ntxiv. Cov khoom siv hluav taws xob niaj hnub no yuav luag SOC (txheej txheem ntawm nti), thiab yuav luag txhua lub luag haujlwm thiab kev ua haujlwm tau txhais los ntawm IC cov lus qhia tshwj xeeb. Yog li ntawd, thev naus laus zis thiab cov ntaub ntawv ntawm lub hnab ntim rov qab kawg IC tus tsim qauv yuav ua lub luag haujlwm tseem ceeb kom ntseeg tau tias thaum kawg lawv tuaj yeem txhawb nqa kev ua haujlwm siab ntawm IC chips. Tam sim no, ABF (Ajinomoto tsim cov yeeb yaj kiab) yog txheej txheej nrov tshaj plaws ntxiv cov khoom siv rau kev txiav txim siab IC cov khoom lag luam hauv khw, thiab cov khoom lag luam tseem ceeb ntawm ABF cov ntaub ntawv yog cov tuam txhab Nyij Pooj, xws li Ajinomoto thiab Sekisui tshuaj.
Jinghua thev naus laus zis yog thawj lub chaw tsim khoom hauv Suav teb los tsim nws tus kheej cov ntaub ntawv ABF. Tam sim no, cov khoom tau raug txheeb xyuas los ntawm ntau lub tuam txhab tsim khoom hauv tsev thiab txawv teb chaws thiab tau xa tawm hauv qhov me me.

3 、MIS
MIS substrate ntim tshuab yog thev naus laus zis tshiab, uas tab tom txhim kho sai sai hauv kev lag luam ntawm kev sib piv, lub zog IC, cov txiaj ntsig digital thiab lwm yam. Sib txawv los ntawm cov txheej txheem ib txwm muaj, MIS suav nrog ib lossis ntau txheej ntawm cov qauv ua ntej kaw. Txhua txheej yog sib cuam tshuam los ntawm tooj liab electroplating los muab kev sib txuas hluav taws xob hauv cov txheej txheem ntim khoom. MIS tuaj yeem hloov qee cov pob ib txwm xws li QFN pob lossis pob raws cov pob, raws li MIS muaj peev xwm ua haujlwm txuas tau zoo, hluav taws xob zoo dua thiab ua haujlwm tau zoo, thiab cov duab me dua.