PCB cob tshuaj thiab zaj duab xis

1, ABS resin

It is a ternary mixture of Acrylonitrile-Butadine-Styrane (Acrylonitrile-Butadine-Styrane), in which the rubber part of the butadiene can be corroded by chromic acid to form holes, and can be used as a landing point for chemical copper or nickel for further plating. Many parts on the circuit board are assembled by ABS plating.

2, theem A

Varnish refers to the glass fiber cloth or cotton paper that is used to reinforce the Prepreg during its manufacturing process. The Varnish (also translates as Varnish water) of the resin is still in its monomer and diluted by the solvent, known as the A-stage. Thaum iav daim ntaub los yog daim ntawv paj rwb nqus cov kua nplaum, thiab tom qab cua sov thiab lub qhov muag qhuav qhuav, qhov hnyav ntawm tsob ntoo tus ntiv tes yuav nce mus rau qhov nyuaj lossis Oligomer, thiab tom qab ntawd txuas nrog cov khoom siv ntxiv los ua zaj duab xis. Lub xeev cov tshuaj hu ua b-stage. When it is further softened by heat and further polymerized into the final polymer resin, it is called C-stage.

3. Cov ntawv cog lus (txheej) Cov Ntawv Sib Koom, tom qab ntawd txheej

Taw tes rau lub rooj tsav xwm ntau txheej sib zog txhawm rau txhawm rau laminate koom ua ke “zaj duab xis”, lossis pawg thawj coj muag “rooj tiv thaiv txheej” txheej tom ntej ntawm nws lub ntsej muag pawg thawj coj

B) Stage B) Stage

Nws hais txog ib nrab-polymerization thiab ib nrab-lub xeev khov ntawm thermosetting cob, xws li cov kua nplaum txuas rau zaj duab xis iav fiber ntau daim ntaub tom qab ua ntu ntu txheej txheem ntawm epoxy cob, uas tuaj yeem ua kom sov los ntawm kev ua kom sov ntxiv.

5, Copolymer

Nws yog txheej tooj liab nias rau saum npoo ntawm CCL tooj liab ntawv ci txheej. Cov ntawv tooj liab uas xav tau los ntawm PCB kev lag luam tuaj yeem tau txais los ntawm electroplating lossis dov, yav dhau los rau cov txheej txheem tawv tawv, lossis tom kawg rau cov laug cam hloov pauv.

6, Coupling Tus Neeg Saib Xyuas

Circuit board industry refers to the surface of the glass fiber cloth coated by a layer of “silane compound class”, make between epoxy resin and glass fiber combination, more a “bypass hooked” layer of chemical bonds between them have more powerful telescopic elastic and combined with the robustness, once the plate caused by strong heat and the expansion of the difference is very big, coupling agent will be able to avoid the separation of the two.

Txuas, Hla kev sib txuas, txuas, txuas

ThermosetTIng Polymer is formed by the bonding of many monomers through their molecular bonds. The bonding process is called “crosslinking”.

8, Qib C

In general substrate board, the resin can be divided into A,B,C and other three hardening (also known as polymerization or curing) stage. Siv cov tshuaj epoxy uas siv tshaj plaws ua piv txwv. Nws Cov Varnish hu ua a-stage; nws qhov Prepreq hu ua B-stage; Ntau cov yeeb yaj kiab uas tau kho ib nrab thiab cov ntawv tooj liab tau laminated thiab nias dua ntawm qhov kub kom tsim cov substrate. Qhov no tsis tuaj yeem hloov pauv tag nrho cov tawv tawv tawv lub xeev hu ua C-stage.

9, D-iav D iav

Nws hais txog cov txheej txheem ua los ntawm cov iav fiber ntau nrog cov ntsiab lus boron siab heev, yog li nws qhov nruab nrab tuaj yeem tswj tau qis dua.

10. Dicyandiamide(Dicy)

Yog ib hom epoxy resin polymerization hardening yuav tsum tau tus neeg sawv cev txuas ntxiv, vim tias nws cov qauv molecular nrog thawj amine (-NH2), theem nrab amine (= NH), thiab tertiary amine (≡NH) peb lub zog ua kom muaj zog tiv taus, yog qhov tsis tshua muaj zog , tseem hu ua Cyano-guanidine cyanide Guanidine. Tab sis vim yog cov dej nqus tau zoo ntawm cov khoom, muaj teeb meem hauv phaj los sib sau ua ke “rov ua dua tshiab”, yog li nws yuav tsum tau hauv av zoo heev kom sib xyaw hauv cov tshuaj uas muaj dej tso.

11, DifferenTIal Scanning Calorimetry(DSC) micro Scanning thermal card analysis

Yooj yim muab, thaum cov tshuaj raug rhaub, tus nqi ntawm “cua sov” ntws mus rau hauv cov khoom (MCAL/SEC) txawv ntawm qhov kub sib txawv. DSC yog los ntsuas qhov “ntsuas cua sov” (lossis tus nqi hloov pauv cua sov) ntawm qhov kub sib txawv. Piv txwv li thaum kev lag luam epoxy cob tau ua kom sov, nws cov cua sov ntws los ntawm qhov kub thiab txias sib txawv, tab sis tab tom yuav txog “iav hloov pauv kub, tus nqi ntawm cov cua sov ntws ntawm txhua ℃ tuaj yeem pom qhov hloov pauv loj heev, nkhaus tig taw tes sib xws rau qhov kub ntawm qhov kev sib tshuam nqes hav sib tshuam, uas yog Tg rau cov cob, yog li Tg DSC los txiav txim siab muaj. DSC txoj hauv kev yog ua piv txwv (S) thiab siv (R) tib lub sijhawm cua sov, vim tias ob qhov “peev xwm cua sov” sib txawv, yog li qhov kub thiab txias sib txawv, tab sis qhov sib txawv ntawm △ T tuaj yeem tswj tau tsis hloov pauv. Txawm li cas los xij, thaum nws nyob ze Tg, △ T nruab nrab ntawm lawv yuav hloov pauv ntau, thiab DSC tuaj yeem ntsuas qhov kev hloov pauv ntawm qhov kub thiab txias. It is a modified “thermal differential analysis” (DTA). In addition to the DETERMINATION of polymer Tg, DSC can also be used to measure the specific heat of plastics, crystallinity, hardening crosslinking, and purity, is an important “thermal analysis” instrument.

12. Dip CoaTIng

Nws yog txoj hauv kev yooj yim thiab pheej yig rau lub tsho loj (cov tuab ntawm zaj duab xis tawv yog cuam tshuam nrog viscosity thiab nrawm ntawm lub tsho loj). Prepreg (luam tawm cov khoom siv ntawm lub rooj tsavxwm) ib txwm siv li no. Nws tuaj yeem pleev xim rau sab nraud, thiab tseem nkag mus rau hauv qhov chaw ntawm iav ntaub ntaub (yog li nws tseem paub tias yog cov khoom ntub).

E-iav qib qib iav

E-glass was originally owned by OWens-Corning Fiberglass Co. As a result of the circuit board industry has been used for a long time, it has become an academic noun. Ntxiv rau qhov yooj yim silicon thiab calcium, nws muaj cov poov tshuaj thiab sodium tsawg heev, tab sis muaj ntau ntawm boron thiab txhuas. Its insulation and processability are good, has been widely used in circuit board substrate reinforcement purposes. Nws muaj pes tsawg leeg yog raws li hauv qab no: Boron oxide B2O3 5~10% Sodium oxide/potassium Na2O/K2O 0~2% Calcium oxide CaO 16~25% Titanium dioxide TiO2 0~0.8% Aluminum oxide A12O3 12~16% Iron oxide Fe2O3 0.05~0.4% silica SiO2 52 ~ 56% fluorin F2 0 ~ 1.0%

14. Epoxy Resin

Nws yog cov khoom siv thermosetting polymer uas tsis tshua muaj neeg siv tau, uas tuaj yeem siv rau molding, ntim, txheej, nplaum, thiab lwm lub hom phiaj. Hauv kev lag luam ntawm lub rooj tsav xwm hauv Circuit Court, yog kev siv hluav taws xob ntau tshaj plaws ntawm cov rwb thaiv tsev thiab cov khoom sib txuas, thiab iav ntaub ntaub, iav fiber ntau lev, thiab dawb kraft ntawv ntawv sib xyaw ua ke, thiab tuaj yeem ua raws txhua yam ntxiv, txhawm rau ua tiav lub hom phiaj ntawm kev tsis tuaj yeem siv tau. thiab ua haujlwm siab, raws li cov khoom siv hauv paus ntawm txhua qib ntawm pawg thawj coj saib xyuas hluav taws xob.

15. Exotherm (nkhaus)

Thaum lub polymerization thiab hardening ntawm ntau yam resins, lub sij hawm hais txog nkhaus ntawm tshav kub tso tawm lub sij hawm. Lub sijhawm thaum tshav kub tshaj tawm yog qhov siab tshaj ntawm qhov nkhaus kub. Thiab Exothermic Reaction- nws yog Exothermic chemical Reaction.

16. Cov ntsiab lus

It refers to the most basic unit of various fabrics, usually consisting of a single Yarn that is twisted into a single Strand or a multi-strand Yarn, and then woven into the required cloth by “warp” and “weft”. Filament hais txog kev sib txuas lus txuas ntxiv lossis Staple.

17. Fill in weft direction

Fiberglass lossis luam ntawv ntxaij, uas qhov kev taw qhia weft feem ntau tsawg dua tus lej ntawm ib chav ntev, yog li lub zog tsawg dua. This word has a synonym Weft.

18, Nplaim Tiv Thaiv

Hais txog lub rooj tsav xwm hluav taws xob hauv rwb thaiv tsev phaj yas, txhawm rau ua tiav qee qib ntawm cov nplaim taws tsis kam (hauv UL94 HB, VO, V1 thiab V2 qib 4), ntxiv qee cov tshuaj yuav tsum tau txhob txwm ua hauv cov qauv tshuaj, xws li bromine, silica, alumina, xws li FR – 4 uas ntau dua 20% ntawm bromide), ua rau cov plank ntawm kev ua tau zoo tuaj yeem ua tiav qee yam nplaim taws tsis kam. Generally fire-resistant FR-4 will be marked with the manufacturer’s UL “red mark” watermark on the Warp of its substrate (double panel) surface to indicate that it is fire-resistant. G-10 yam tsis muaj nplaim taws tuaj yeem tsuas yog luam nrog “ntsuab” cov cim dej hauv qhov kev taw qhia. Muaj lub ntsiab lus zoo rau Nplaim Retardent, tab sis lub sijhawm raug rau lub rooj sib tham yog Hluav Taws Kub Tiv Thaiv, uas tsis muaj lub luag haujlwm thiab yuav tsum tsis txhob hais lus dag los ntawm cov neeg ua phem.

19, Gel Time

Nws hais txog tsob ntoo ntiv tes hauv b-theem. Tom qab tau txais cov cua sov sab nraud, tsob ntoo ntiv tes hloov pauv los ntawm cov khoom mus rau kua, thiab tom qab ntawd maj mam polymerizes thiab dhau los ua tawv dua. Thaum lub sijhawm txheej txheem, tag nrho “tus lej ntawm vib nas this” tau ntsib los ntawm qhov muag “kom pom cov colloidality” hu ua “colloidization time”. Ntawd yog, hauv txheej txheem ntawm txheej txheej txheej txheej nias, cov kua nplaum ntws tuaj yeem tshem tawm huab cua thiab sau qhov nce thiab nqis ntawm txoj kab sab hauv. Tus naj npawb ntawm cov vib nas this uas tuaj yeem siv tau yog qhov tseem ceeb ntawm kev ua kua nplaum. Qhov no yog qhov tseem ceeb ntawm cov yeeb yaj kiab ib nrab kho Prepreg.

20, Gelation Particle

Lub xub ntiag ntawm pob tshab, ua ntej polymerized ciab hais hauv tsob ntoo ntiv tes ntawm b-theem zaj duab xis.