PCB utomoni wamagetsi ndi kanema

1, ABS resin

It is a ternary mixture of Acrylonitrile-Butadine-Styrane (Acrylonitrile-Butadine-Styrane), in which the rubber part of the butadiene can be corroded by chromic acid to form holes, and can be used as a landing point for chemical copper or nickel for further plating. Many parts on the circuit board are assembled by ABS plating.

2, gawo A

Varnish refers to the glass fiber cloth or cotton paper that is used to reinforce the Prepreg during its manufacturing process. The Varnish (also translates as Varnish water) of the resin is still in its monomer and diluted by the solvent, known as the A-stage. Pamene nsalu yamagalasi kapena pepala lakotoni limayamwa guluu, ndipo pambuyo pa mpweya wotentha ndi kuyanika kwa infrared, kulemera kwake kwa chala chamtengo kudzawonjezeka mpaka kovuta kapena Oligomer, kenako nkudziphatika kuzinthu zolimbitsa kuti apange kanema. Dziko la resin limatchedwa b-siteji. When it is further softened by heat and further polymerized into the final polymer resin, it is called C-stage.

3. Mapepala Olumikizana (wosanjikiza) Mapepala Olumikizana, kenako wosanjikiza

Onetsani bolodi lolimba la multilayer kuti muwonetse mgwirizano “kanema”, kapena bolodi lofewa “tebulo lotetezera wosanjikiza” gawo lotsatira pakati pa nkhope yake

B) Stage B) Stage

Limatanthauza theka-polima komanso kulimba kotentha kwa utomoni wa thermosetting, monga utomoni wophatikizidwa ndi nsalu yamagalasi yamagalasi pambuyo poti kumiza kwa gawo la epoxy resin, komwe kumatha kuchepetsedwa ndi kutentha kwina.

5, Copolymer

Ndi mzere wosanjikiza wamkuwa wopanikizika pamwamba pa gawo la CCL mkuwa wojambula. Chojambula chamkuwa chofunidwa ndi mafakitale a PCB chitha kupezeka ndi electroplating kapena rolling, yoyambayo yama board oyang’anira okhwima, kapena yomalizirayi yama board osinthika.

6, lumikiza Mtumiki

Circuit board industry refers to the surface of the glass fiber cloth coated by a layer of “silane compound class”, make between epoxy resin and glass fiber combination, more a “bypass hooked” layer of chemical bonds between them have more powerful telescopic elastic and combined with the robustness, once the plate caused by strong heat and the expansion of the difference is very big, coupling agent will be able to avoid the separation of the two.

Kulumikiza, Crosslinking, yolumikiza, yolumikiza

ThermosetTIng Polymer is formed by the bonding of many monomers through their molecular bonds. The bonding process is called “crosslinking”.

8, The C Gawo

In general substrate board, the resin can be divided into A,B,C and other three hardening (also known as polymerization or curing) stage. Tengani utomoni wa epoxy wogwiritsidwa ntchito kwambiri monga chitsanzo. Varnish yake amatchedwa siteji; Prepreq yake amatchedwa B-siteji; Mafilimu angapo omwe sanachiritsidwe komanso mapepala amkuwa adalilimbidwa ndikukanikizidwanso kutentha kwambiri kuti apange gawo lapansi. Utali wosasinthika wolimba womwe umatchedwa C-gawo.

9, D-galasi D galasi

Limatanthauza gawo lomwe limapangidwa ndi fiber yamagalasi yokhala ndi boron kwambiri, kotero kuti mawonekedwe ake apakatikati amatha kuwongoleredwa kutsika.

10. Dicyandiamide(Dicy)

Kodi mtundu wa epoxy resin polymerization kuumitsa kumafunikira kulumikizira wothandizila, chifukwa cha mawonekedwe ake am’madzi omwe ali ndi amine oyambira (-NH2), amine wachiwiri (= NH), ndi amine apamwamba (≡NH) atatu olimba omwe amathandizira, ndi cholimba chosowa kwambiri , wotchedwanso Cyano-guanidine cyanide Guanidine. Koma chifukwa cha kuyamwa kwamadzi kwamphamvu kwazinthuzo, pamakhala vuto m’mbale kuti asonkhanitse “kuyesanso”, chifukwa chake kuyenera kukhala pansi bwino kuti musakanizidwe ndi utomoni wokhala ndi kumiza.

11, DifferenTIal Scanning Calorimetry(DSC) micro Scanning thermal card analysis

Mwachidule, chinthu chikatenthedwa, kuchuluka kwa “kutentha” komwe kumayenderera mu chinthucho (MCAL / SEC) kumasiyanasiyana pamatenthedwe osiyanasiyana. DSC ndiyesa “kutentha kwamphamvu” (kapena kuchuluka kwa kutentha) pamasamba osiyanasiyana. Mwachitsanzo pamene utomoni wa epoxy utenthedwa, kutentha kwake kumatentha mosiyanasiyana komanso kosiyanasiyana, koma watsala pang’ono kufikira “kutentha kwa galasi, kutentha kwa kutentha pakati pa ℃ kumatha kuwoneka ngati kusintha kwakukulu, kupindika kwa kusintha mfundo yolingana ndi kutentha kwa njira yodutsa yolowera, yomwe ndi Tg ya utomoni, kotero Tg DSC ipeze kuti ikupezeka. Njira ya DSC ndiyowerengera (S) ndi kutanthauzira (R) nthawi yomweyo Kutentha, chifukwa cha “mphamvu ya kutentha” iwiri ndiyosiyana, kotero kutentha kumakhala kosiyana, koma kusiyana pakati pa △ T kumatha kusungidwa kosasintha. Komabe, ikayandikira Tg, △ T pakati pawo idzasintha kwambiri, ndipo DSC ikhoza kuyeza kusintha kwakusiyana kwa kutentha. It is a modified “thermal differential analysis” (DTA). In addition to the DETERMINATION of polymer Tg, DSC can also be used to measure the specific heat of plastics, crystallinity, hardening crosslinking, and purity, is an important “thermal analysis” instrument.

12. Sungani CoaTIng

Ndi njira yosavuta komanso yotsika mtengo yovekera (makulidwe a kanema wachikopa amakhudzana ndi mamasukidwe akayendedwe ndi liwiro la malaya). Prepreg (chosindikizidwa cha board board) amagwiritsidwa ntchito motere. Itha kuvekedwa panja, komanso imalowerera m’malo opangira nsalu yamagalasi (motero imadziwikanso kuti zotere).

E-galasi pakompyuta kalasi galasi

E-glass was originally owned by OWens-Corning Fiberglass Co. As a result of the circuit board industry has been used for a long time, it has become an academic noun. Kuphatikiza pa silicon ndi calcium, mumakhala potaziyamu wochepa kwambiri ndi sodium, koma boron wambiri ndi aluminium. Its insulation and processability are good, has been widely used in circuit board substrate reinforcement purposes. Zolemba zake ndi izi: Boron oxide B2O3 5~10% Sodium oxide/potassium Na2O/K2O 0~2% Calcium oxide CaO 16~25% Titanium dioxide TiO2 0~0.8% Aluminum oxide A12O3 12~16% Iron oxide Fe2O3 0.05~0.4% silica SiO2 52 ~ 56% fluorin F2 0 ~ 1.0%

14. Epoxy Resin

Ndi polima mosiyanasiyana kwambiri Thermosetting polima, amene angagwiritsidwe ntchito kuumba, ma CD, zokutira, guluu wolimba ndi zolinga zina. M’makampani oyang’anira dera, ndikumagwiritsa ntchito utomoni waukulu kwambiri komanso utomoni wolumikizira, komanso nsalu yamagalasi, chikwangwani chamagalasi, ndi pepala loyera loyera, ndipo limatha kukhala ndi mitundu yonse yazowonjezera, kuti ikwaniritse zosayaka ndi ntchito yayikulu, monga zinthu zoyambira m’magawo onse oyang’anira dera.

15. Kutentha (kopindika)

Pakati pa polima ndi kuuma kwa ma resins osiyanasiyana, mawuwa amatanthauza kutentha kwa kutentha kwakanthawi. Nthawi yomwe kutentha kwakukulu kumatulutsidwa ndiye malo okwera kwambiri otentha. Ndipo Kusintha Kowopsa- ndi Kusintha kwa mankhwala osokoneza bongo.

16. Fyuluta

It refers to the most basic unit of various fabrics, usually consisting of a single Yarn that is twisted into a single Strand or a multi-strand Yarn, and then woven into the required cloth by “warp” and “weft”. Filament amatanthauza Filament mosalekeza kapena Chakudya.

17. Fill in weft direction

Fiberglass kapena mauna osindikizira, momwe kuwongolera kumakhala kocheperako kuposa kuchuluka kwa weft pa unit unit, motero mphamvu ndizochepa. This word has a synonym Weft.

18, Flame Resistant

Amatanthawuza bolodi loyenda mu utoto wa mbale yotsekemera, kuti akwaniritse kuyatsa kwamoto (mu UL94 HB, VO, V1 ndi V2 mulingo 4), ndikuwonjezera mankhwala ena ayenera kukhala dala mu fomula ya utomoni, monga bromine, silika, alumina, monga FR – 4 momwe oposa 20% a bromide), amapanga thabwa logwirira ntchito limatha kukwaniritsa kukana kwamoto. Generally fire-resistant FR-4 will be marked with the manufacturer’s UL “red mark” watermark on the Warp of its substrate (double panel) surface to indicate that it is fire-resistant. G-10 yopanda lawi lamoto imatha kusindikizidwa ndi “green” watermarking mozungulira. Pali mawu ofanana ndi Flame Retardent, koma nthawi yolondola yoyang’anira dera ndi Fire Resist, yomwe ndi yosasamala ndipo siyiyenera kunenedwa zabodza ndi anthu wamba.

19, Gel Time

Limatanthauza chala chamtengo mu b-gawo. Mukalandira kutentha kwakunja, chala chamtengo chimasintha kuchoka pachimake kukhala chamadzimadzi, kenako pang’onopang’ono chimasungunulanso ndikukhalanso cholimba. Pogwira ntchitoyi, “masekondi” onse omwe akuchepetsedwa “kuti awonekere colloidality” amatchedwa “nthawi ya colloidization”. Ndiye kuti, pakukanikiza kosanjikiza kwamitundu ingapo, guluu woyenda amatha kuthamangitsa mpweya ndikudzaza kukwera ndi kutsika kwa mzere wamkati. Chiwerengero cha masekondi omwe atha kugwiritsidwa ntchito ndikofunikira kwa nthawi ya guluu. Ichi ndichinthu chofunikira kwambiri mu kanema wa Prereg yemwe sanachiritsidwe.

20, Gelation Particle

Kukhalapo kwa phula loyera, lopangidwa kale ndi sera mu chala cha mtengo wa b-siteji.