PCB resin chemistry uye firimu

1, ABS nebwe

Iyo ternary musanganiswa weAcrylonitrile-Butadine-Styrane (Acrylonitrile-Butadine-Styrane), umo chikamu cherabha chebutadiene chinogona kukanganiswa nechromic acid kuti iumbe maburi, uye inogona kushandiswa senzvimbo yekumhara yemakemikari mhangura kana nickel. yekuwedzera kufuratira. Zvikamu zvakawanda pabhodhi redunhu zvakaunganidzwa neABS yakanamirwa pamifananidzo.

2, a-nhanho A

Varnish zvinoreva girazi fiber jira kana pepa pepa iro rinoshandiswa kusimbisa iyo Prepreg panguva yekugadzirwa kwayo. Iyo Varnish (zvakare inoshandura semvura yeVarnish) yeiyo resin ichiri mune yayo monomer uye yakasanganiswa neyakagadziriswa, inozivikanwa seA-nhanho. Kana girazi faibha jira kana yekotoni bepa yekukweva glue, uye mushure memhepo inopisa uye infrared kuomesa, iyo mamorekuru uremu hwemuti chigunwe huchawedzera kune yakaoma kana Oligomer, uye yozonamatira kune inosimbisa zvinhu kuumba iyo firimu. Iyo resin nyika inonzi b-nhanho. Kana ichiwedzererwa nekupisa uye ichiwedzerwazve mupolymer resin yekupedzisira, inonzi C-nhanho.

3. Kubatanidza Sheet (dura) Kubatanidza Sheet, kwadaro rukoko

Nongedza kune akaomarara multilayer bhodhi kuitira kuti laminate mubatanidzwa “firimu”, kana rakapfava bhodhi “tafura inodzivirira yakatetepa” inotevera dura pakati payo bhodhi kumeso

B) Chikamu B) Chikamu

Icho chinoreva iyo semi-polymerization uye semi-kuomesa mamiriro eiyo thermosetting resin, senge iro resini rakanamatira kune iyo firimu girazi fiber jira mushure meiyo-padanho rekunyudza chirongwa che epoxy resin, iyo inogona kuderedzwa nekuenderera mberi kupisa.

5, Copolymer

Iyo yemhangura denderedzwa yakatsikwa pamusoro peCCL mhangura foil substrate. Iyo yemhangura foil inodiwa nePCB indasitiri inogona kuwanikwa neelectroplating kana kutenderera, iyo yekutanga kune akaomarara mabhodhi wedunhu, kana ekupedzisira emabhodhi anochinjika.

6, Kubatanidza Agent

Circuit board indasitiri inoreva pamusoro pegirazi fiber jira rakaputirwa netaundi ye “silane remubatanidzwa kirasi”, gadzira pakati epoxy resin uye girazi fiber musanganiswa, yakawanda “yekupfuura yakanamatira” dura remakemikari zvisungo pakati pavo vane yakasimba simba telescopic elastic uye inosanganiswa nekusimba, kana ndiro ichikonzerwa nekupisa kwakasimba uye kuwedzera kwemusiyano kwakakura kwazvo, coupling mumiriri anokwanisa kudzivirira kupatsanurwa kwevaviri.

Kubatanidza, Kubatanidza, kubatanidza, kubatanidza

ThermosetTIng Polymer inoumbwa nekubatana kwema monomers mazhinji kuburikidza nema molecular bond. Maitiro ekubatanidza anonzi “crosslinking”.

8, Iyo C Chikamu

In general substrate board, iyo resin inogona kukamurwa kuita A, B, C uye mamwe matatu kuomesa (inozivikanwawo se polymerization kana kurapa) nhanho. Tora iyo yakanyanya kushandiswa epoxy resin semuenzaniso. Varnish Yayo inonzi a-stage; iyo Prepreq inonzi B-nhanho; Mafirimu akati wandei akaporeswa uye machira emhangura akaomeswa uye akamanikidzwa zvakare patembiricha yepamusoro kuti iite substrate. Iyi isingachinjiki yakazara yakaoma resin nyika inonzi C-nhanho.

9, D-girazi D girazi

Iyo inoreva kune substrate yakagadzirwa negirazi fiber ine yakanyanya kwazvo boron yezvinhu, kuitira kuti yayo yepakati irambe inogona kudzorwa yakaderera.

10. Dicyandiamide (Diki)

Rudzi rweepoxy resin polymerization kuomesa kunodiwa yekuvharira mumiririri, nekuda kweiyo mamorekuru fomura ine yekutanga amine (-NH2), yechipiri amine (= NH), uye tertiary amine (≡NH) matatu akasimba anoshanda ekupindura base, isingawanzo kunaka yakaoma , inozivikanwawo seCyano-guanidine cyanide Guanidine. Asi nekuda kwekutorwa kwemvura kwakasimba kwechinhu ichi, pane dambudziko muplate yekuunganidza “recrystallization”, saka inofanira kunge iri pasi yakanaka kwazvo kuti isanganiswe muresini ine kunyudza.

11, DifferenTIal Kuongorora Calorimetry (DSC) micro Kuongorora chakapisa kadhi kuongorora

Zvichitaurwa zviri nyore, kana chinhu chapiswa, mwero we “kupisa” unoyerera uchipinda muchinhu (MCAL / SEC) unosiyana pamatembiricha akasiyana. DSC ndeye kuyera iyi “kupisa kuyerera chiyero” (kana chiyero chekuchinja mukupisa) pane akasiyana tembiricha. Semuenzaniso kana epoxy resin inotengeswa inopisa, kupisa kwaro kupisa pamatanho akasiyana uye kwakasiyana, asi zvava kuda kusvika “tembiricha yekuchinja tembiricha, mwero wekuyerera kwekupisa pakati peumwe neumwe” unogona kuoneka shanduko hombe kwazvo, iko kutenderera poindi inoenderana netembiricha yekuyambuka nzira inoyerera, inova Tg yeiyo resin, saka iyo Tg DSC kuona iripo. DSC nzira ndeyekuyera (S) uye chirevo (R) panguva imwe chete kupisa, nekuda kweayo maviri “masimba ekushisa” akasiyana, saka tembiricha yakasiyana, asi mukaha uri pakati pe △ T unogona kuchengetwa usingashandurike. Nekudaro, kana iri padyo neTg, △ T pakati pavo ichachinja zvakanyanya, uye DSC inogona kuyera shanduko yemusiyano wetembiricha. Icho chakashandurwa “kupisa kwakasiyana kusiyanisa” (DTA). Pamusoro peiyo DETERMINATION ye polymer Tg, DSC inogona zvakare kushandiswa kuyera iyo chaiyo kupisa kwemapurasitiki, crystallinity, kuomesa crosslinking, uye kuchena, yakakosha “yekupisa yekuongorora” chishandiso.

12. Dip CoaTIng

Iyo yakapusa uye isingadhuri nzira yekupfeka (iyo ukobvu hweganda firimu inoenderana neiyo viscosity uye kumhanya kwejasi). Prepreg (yakadhindwa redunhu bhodhi zvinhu) inogara ichishandiswa nenzira iyi. Inogona kuvezwa kunze, uye zvakare inonamira munzvimbo yegirazi fiber jira (nekudaro inozivikanwa seyakanyorova zvinhu).

E-girazi zvemagetsi giredhi girazi

E-girazi pakutanga raive raOWens-Corning Fiberglass Co. Nekuda kweye indasitiri yebhodhi indasitiri yanga ichishandiswa kwenguva yakareba, rave zita rekudzidza. Kuwedzera kune yakakosha silicon uye calcium, ine potasiamu shoma uye sodium, asi yakawanda boron nealuminium. Kuputira uye kugadzirisa kwacho kwakanaka, kwave kushandiswa zvakanyanya mudunhu bhodhi substrate yekusimbisa zvinangwa. Maumbirwo aro anotevera: Boron oxide B2O3 5 ~ 10% Sodium oxide / potassium Na2O / K2O 0 ~ 2% Calcium oxide CaO 16 ~ 25% Titanium dioxide TiO2 0 ~ 0.8% Aluminium oxide A12O3 12 ~ 16% Iron oxide Fe2O3 0.05 ~ 0.4% silica SiO2 52 ~ 56% fluorin F2 0 ~ 1.0%

14. Epoxy Resin

Iyo yakanyanyisa kuita Thermosetting polymer, iyo inogona kushandiswa pakuumba, kurongedza, kupfeka, kunamatira uye zvimwe zvinangwa. Mune redunhu bhodhi indasitiri, ndiyo hombe kudyiwa kwekuputira uye kwekubatanidza resin, uye girazi fiber jira, girazi faibha mat, uye chena kraft bepa rinoumbwa bhodhi, uye rinogona kugadzirisa mhando dzese dzekuwedzera, kuitira kuzadzisa chinangwa cheisinga pise. uye yakakwira mashandiro, seye yepasi zvinhu zvematanho ese wedunhu bhodhi.

15. Exotherm (munyonga)

Munguva ye polymerization uye kuomarara kwema resin akasiyana siyana, izwi iri rinoreva kumhepo yekuburitsa kupisa nekufamba kwenguva. Iyo nguva iyo yakanyanya kupisa kuburitswa ndiyo yakakwira poindi yetembiricha curve. Uye Exothermic Reaction- iri Exothermic kemikari Reaction.

16. Filament

Icho chinoreva chikamu chakakoshesesa chemachira akasiyanasiyana, anowanzo kuve neRumwe rweshinda rwakamonyaniswa kuita Strand imwechete kana kuti Yakawanda-tambo yakasungwa, uyezve yakarukwa mumucheka unodikanwa ne “warp” uye “weft”. Filament inoreva kuenderera mberi Filament kana Chikafu.

17. Zadza weft nzira

Washington City Offices kana kudhinda pajira riya mesh, umo weft nzira inowanzo kuve yakaderera pane nhamba yeweft pauniti kureba, saka simba ishoma. Izwi iri rine rinoreva zvakafanana Weft.

18, Flame Resistant

Inoreva iyo redunhu bhodhi mune inoisa ndiro ndiro, kuitira kuti uwane imwe nhanho yemoto kuramba (mune iyo UL94 HB, VO, V1 uye V2 nhanho 4), ichiwedzera mamwe makemikari anofanirwa kuve nemaune mune resin fomula, senge bromine, silica, alumina, yakadai seFR – 4 mune inopfuura 20% yebromide), inoita kuti puranga rekuita rigone kuzadzisa kumwe kurwisa kwemurazvo. Kazhinji isingadziviriki moto-FR-4 inoiswa mucherechedzo neiyo UL “red mark” watermark pane iyo Warp yeiyo substrate (mbiri pani) pamusoro kuratidza kuti haina moto. Iyo G-10 isina murazvo unodzora inogona kudhindwa chete ne “green” watermarking mune yakarukwa nzira. Pane chirevo chakafanana cheFlame Retardent, asi izwi rakaringana redunhu redhira ndeye Fire Resist, isingatarisi uye isingafanire kumirirwa zvisirizvo nevanhuwo zvavo.

19, Nguva yeGel

Inoreva chigunwe chemuti mu b-nhanho. Mushure mekutambira kupisa kwekunze, chigunwe chemuti chinoshanduka kubva pane chakasimba kuenda pane chinoyerera, uye chobva chadzora polymerize uye chobva chasimba zvakare. Munguva yekuita, huwandu hwese hwe “masekondi” akasangana nekudzikamisa “kuoneka colloidality” inonzi “colloidization nguva”. Ndokunge, mukuita kweakawanda-masenduru ndiro yekumanikidza, iyo yekuyerera glue inogona kudzinga mhepo uye kuzadza kumusoro uye kuderera kwemukati mutsara. Huwandu hwesekondi hunogona kushandiswa ndiko kukosha kunoshanda kweglue nguva. Ichi chinhu chakakosha chemiviri-yakaporeswa firimu Prepreg.

20, Gelation Particle

Kuvapo kwekujeka, pre-polymerized wakisi zvidimbu mumuti chigunwe che b-danho firimu.