PCB i-resin chemistry nefilimu

1, i-ABS resin

Kuyinhlanganisela ye-ternary ye-Acrylonitrile-Butadine-Styrane (i-Acrylonitrile-Butadine-Styrane), lapho ingxenye yenjoloba ye-butadiene ingashiswa yi-chromic acid ukwakha izimbobo, futhi ingasetshenziswa njengendawo yokufika yekopha lamakhemikhali noma i-nickel ukuthola okunye ukugcwala. Izingxenye eziningi ebhodini lesifunda zihlanganiswe yi-ABS plating.

2, isigaba A

I-varnish ibhekisa kwindwangu yengilazi yefayibha noma iphepha likakotini elisetshenziselwa ukuqinisa i-Prepreg ngesikhathi senqubo yokukhiqiza. IVarnish (ibuye ihumushe njengamanzi we-Varnish) we-resin isesezingeni layo futhi ihlanjululwa yi-solvent, eyaziwa njenge-A-stage. Lapho indwangu yengilazi yefayibha noma iphepha likakotini elincela i-glue, futhi ngemuva komoya oshisayo nokomiswa kwe-infrared, isisindo samangqamuzana somunwe womuthi sizokwenyuka siye ku-complex noma i-Oligomer, bese sinamathiselwa entweni yokuqinisa ukwenza ifilimu. Isimo se-resin sibizwa nge-b-stage. Uma iphinda yathanjiswa ukushisa futhi yaphinde yapholishwa yangena ku-resin yokugcina i-polymer, ibizwa nge-C-isigaba.

3. Ishidi Lokuhlanganisa (ungqimba) Ishidi Lokuhlanganisa, bese kuba ungqimba

Khomba ebhodini eliqinile le-multilayer ukuze ulaminishe “ifilimu” lenyunyana, noma ibhodi elithambile “ithebula livikela ungqimba” ungqimba olulandelayo phakathi kobuso bebhodi

B) Isiteji B) Isiteji

Kusho isimo se-semi-polymerization kanye ne-semi-hardening ye-thermosetting resin, njenge-resin enamathiselwe kwindwangu yengilazi yefilimu ngemuva kwephrojekthi yokucwiliswa kwesiteji se-epoxy resin, engathanjiswa ngokuqhubeka nokushisa.

5, iCopolymer

Ingqimba yethusi icindezelwe ebusweni be-CCL yethusi le-substrate yethusi. Ucwecwe lwethusi oludingwa imboni ye-PCB lungatholakala ngokuqothula noma ukugingqa, okwangaphambili kwamabhodi wesifunda aqinile, noma okugcina ngamabhodi aguquguqukayo.

6, Coupling Agent

Umkhakha webhodi lesifunda ubhekise ngaphezulu kwendwangu yengilazi yefayibha eboshwe ungqimba lwe “silane compound class”, yenza phakathi kwe-epoxy resin kanye nenhlanganisela yengilazi yefibre, ngaphezulu ungqimba “lokudlula olubambekile” lwezibopho zamakhemikhali phakathi kwabo lunokunwebeka okuthe xaxa kwe-telescopic futhi kuhlanganiswe nokuqina, lapho ipuleti elidalwe ukushisa okuqinile nokwandiswa komehluko kukhulu kakhulu, i-coupling agent izokwazi ukugwema ukuhlukaniswa kwalokhu okubili.

Ukuxhumanisa, ukuxhumanisa, ukuxhumanisa, ukuxhumanisa

I-ThermosetTIng Polymer yakhiwa ngokuhlanganiswa kwama-monomers amaningi ngokusebenzisa izibopho zawo zamangqamuzana. Inqubo yokubopha ibizwa nge- “crosslinking”.

8, Isigaba seC

Ngokujwayelekile ebhodini le-substrate, i-resin ingahlukaniswa ngo-A, B, C nezinye izinto ezintathu zokuqina (ezaziwa nangokuthi i-polymerization noma ukwelapha) isigaba. Thatha i-epoxy resin esetshenziswe kakhulu njengesibonelo. IVarnish yayo ibizwa ngesigaba; i-Prepreq yayo ibizwa nge-B-stage; Amafilimu amaningana aphulukisiwe kanye namashidi wethusi ahlanganiswa futhi aphinda acindezelwa futhi ekushiseni okuphezulu ukwenza i-substrate. Lesi simo se-resin esingenakuguqulwa ngokuphelele sibizwa ngokuthi yi-C-stage.

9, ingilazi ye-D-glass D

Kushiwo i-substrate eyenziwe ngengilazi yefayibha enokuqukethwe okuphezulu kakhulu kwe-boron, ukuze ukungaguquguquki kwayo okuphakathi kube nokulawulwa okuphansi.

10.Dicyandiamide (Okunongiwe)

Ingabe uhlobo oluthile lwe-epoxy resin polymerization lukhuni oludingekayo ukuze kuvinjwe umenzeli, ngenxa yefomula yamangqamuzana ane-amine eyinhloko (-NH2), i-amine yesibili (= NH), ne-amine ephakeme (≡NH) isisekelo sokuphendula esisebenza ngamandla, iyisiqobelo esihle esingandile , eyaziwa nangokuthi iCyano-guanidine cyanide Guanidine. Kepha ngenxa yokumuncwa kwamanzi okunamandla kokuqukethwe, kunenkinga epuletini yokuqoqa i- “recrystallization”, ngakho-ke kufanele kube kuhle kakhulu ukuthi kuxubeke ku-resin equkethe ukucwiliswa.

11, i-DifferenTIal Iskena i-Calorimetry (DSC) ukuskena okuncane kokuhlaziywa kwekhadi lokushisa

Kalula nje, lapho into ishiswa, izinga “lokushisa” eligelezela entweni (i-MCAL / SEC) liyahlukahluka emazingeni okushisa ahlukene. I-DSC ukukala le “rate flow flow” (noma izinga lokushintsha kokushisa) emazingeni okushisa ahlukene. Isibonelo lapho i-resin ye-epoxy yezentengiselwano ishiswa, isilinganiso sayo sokushisa sishisa emazingeni okushisa ahlukile futhi ahlukile, kepha sesizofinyelela “ezingeni lokushisa lengilazi lokushintsha, izinga lokugeleza kokushisa phakathi kwe- ℃ ngalinye lingabonakala lukhulu kakhulu, ijika lokujika iphoyinti elihambelana namazinga okushisa empambanweni yomgwaqo onqamulelayo, okuyi-Tg ye-resin, ngakho-ke i-Tg DSC ukunquma ukuthi iyatholakala. Indlela ye-DSC ukwenza isampula (i-S) nereferensi (R) ngasikhathi sinye ukufudumeza, ngenxa yokuthi “amandla okushisa” amabili ahlukile, ngakho-ke izinga lokushisa lihlukile, kepha igebe phakathi kwe-△ T lingagcinwa lingashintshiwe. Kodwa-ke, uma iseduze ne-Tg, △ T phakathi kwabo izoshintsha kakhulu, futhi i-DSC ingalinganisa ushintsho lokwehluka kwamazinga okushisa. Kuyinto “ukuhlaziywa okushisayo okuhlukile” (DTA). Ngaphezu kokumiswa kwe-polymer Tg, i-DSC nayo ingasetshenziselwa ukukala ukushisa okuqondile kwamapulasitiki, i-crystallinity, ukuqina kwe-crosslinking, nokuhlanzeka, kuyinsimbi ebalulekile “yokuhlaziya okushisayo”.

12. Dip CoaTIng

Kuyindlela elula futhi engabizi kakhulu yokugqoka (ubukhulu befilimu lesikhumba buhlobene ne-viscosity nejubane lejazi). I-Prepreg (impahla yebhodi yesifunda ephrintiwe) ihlala isetshenziswa ngale ndlela. Ingafakwa ngaphandle, futhi iphinde ingene esikhaleni sendwangu yengilazi (yingakho yaziwa nangokuthi into emanziswe).

E-ingilazi grade grade ingilazi

I-E-glass ekuqaleni yayiphethwe yi-OWens-Corning Fiberglass Co. Ngenxa yemboni yebhodi lesifunda isetshenziswe isikhathi eside, isiphenduke ibizo lezemfundo. Ngaphezu kwe-silicon eyisisekelo ne-calcium, iqukethe i-potassium ne-sodium encane kakhulu, kepha i-boron ne-aluminium eningi. Ukufakwa kwayo nokusebenza kahle kuhle, kusetshenziswe kabanzi kuzinhloso zokuqinisa ibhodi lesifunda. Ukwakheka kwayo kanje: I-Boron oxide B2O3 5 ~ 10% Sodium oxide / potassium Na2O / K2O 0 ~ 2% Calcium oxide CaO 16 ~ 25% Titanium dioxide TiO2 0 ~ 0.8% Aluminium oxide A12O3 12 ~ 16% Iron oxide Fe2O3 0.05 ~ 0.4% silica SiO2 52 ~ 56% fluorin F2 0 ~ 1.0%

14. I-epoxy Resin

Kuyinto i-polymer Thermosetting polymer ehlukahlukene kakhulu, engasetshenziselwa ukubumba, ukupakisha, ukumboza, ukunamathela nezinye izinjongo. Embonini yebhodi lesifunda, ukusetshenziswa okukhulu kakhulu kokufakwa kwe-resin ne-bonding, nengilazi yefayibha yendwangu, ingilazi yefayibha mat, nebhodi elimhlophe le-kraft iphepha elihlanganayo, futhi lingakwazi ukwamukela zonke izinhlobo zezithasiselo, ukuze kuzuzwe inhloso yokungavuthi nokusebenza okuphezulu, njengezinto eziyisisekelo zawo wonke amazinga ebhodi lesifunda.

I-Exotherm (ijika)

Ngesikhathi se-polymerization kanye nokwenza lukhuni izinhlaka ezahlukahlukene, leli gama lisho ijika lokukhishwa kokushisa ngokuhamba kwesikhathi. Isikhathi lapho kukhishwa ukushisa okukhulu kuyiphuzu eliphakeme kakhulu lejika lokushisa. Futhi Ukusabela Okungalawuleki- kungukuphendula Kwe-Exothermic kwamakhemikhali.

Intambo

Kubhekiswa kuyunithi eyisisekelo kunazo zonke yezindwangu ezahlukahlukene, imvamisa iba neNtambo eyodwa esontekile yaba iStrand eyodwa noma Intambo enemicu eminingi, bese ilukelwa endwangwini edingekayo nge- “warp” ne- “weft”. Intambo ibhekisa ku-intambo eqhubekayo noma okuyisisekelo.

17. Gcwalisa i-weft direction

I-fiberglass noma i-mesh yokuphrinta, lapho ukuqondiswa kwe-weft kuvame ukuba ngaphansi kwenani le-weft ngobude beyunithi, ngakho-ke amandla mancane. Leli gama linomqondo ofanayo Weft.

18, i-Flame Resistant

Kushiwo ibhodi lesifunda ku-resin plate plate, ukuze kufinyelelwe ezingeni elithile lokumelana nelangabi (ku-UL94 HB, VO, V1 no-V2 level 4), ukungeza amanye amakhemikhali kufanele kwenziwe ngamabomu kwifomula ye-resin, njenge-bromine, i-silica, i-alumina, efana ne-FR – 4 lapho ngaphezulu kwe-20% ye-bromide), yenza ipulangwe lokusebenza lingafinyelela ukumelana nomlilo okuthile. Ngokuvamile ukumelana nomlilo i-FR-4 izomakwa nge-watermark yomkhiqizi we-UL “red mark” ku-Warp ye-substrate yayo (double panel) ebusweni ukukhombisa ukuthi ayizweli emlilweni. I-G-10 engenakho ukulibazisa ilangabi ingaphrintwa kuphela nge-watermarking “eluhlaza” ku-warp direction. Kukhona igama elifanayo le-Flame Retardent, kepha igama elifanele lebhodi lesifunda yi-Fire Resist, elingenakuzibophezela futhi okungafanele limelwe kabi ngabantu nje abavamile.

19, Isikhathi seGel

Kushiwo umunwe wesihlahla ku-b-sigaba. Ngemuva kokuthola ukushisa kwangaphandle, umunwe wesihlahla uyashintsha kusuka ekuqineni uye kuketshezi, bese kancane upholisha futhi uphinde uqine futhi. Phakathi nenqubo, inani eliphelele “lemizuzwana” elihlangabezwe ukuthamba “ukuvela kokubambisana” libizwa ngokuthi “isikhathi se-colloidization”. Okusho ukuthi, ngenkathi kucindezelwa izingqimba eziningi, iglue flow ingaxosha umoya futhi igcwalise amahla-ndenyuka omugqa wangaphakathi. Inani lamasekhondi angasetshenziswa ukubaluleka okusebenzayo kwesikhathi seglue. Lesi isici esibalulekile sefilimu elapheka kancane elungiselelwe i-Prepreg.

20, Gelation Particle

Ukuba khona kwezinhlayiya ze-wax ezisobala, ezenziwe ngaphambilini.